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Process and apparatus for producing glass member provided with sealing material layer and process for producing electronic device

  • US 8,490,434 B2
  • Filed: 01/20/2012
  • Issued: 07/23/2013
  • Est. Priority Date: 07/23/2009
  • Status: Expired due to Fees
First Claim
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1. A process for producing an electronic device, the process comprising:

  • (i) applying a sealing material paste to a second sealing region in the form of a frame on a second glass substrate, to produce a frame-form coating layer, whereinthe sealing material paste is prepared by mixing a sealing material with an organic binder,the sealing material comprises a sealing glass and a laser absorbent,the second glass substrate comprises a second surface comprising the second sealing region which corresponds to a first sealing region on a first glass substrate, andthe first glass substrate comprises a first surface comprising the first sealing region;

    (ii) irradiating the frame-form coating layer with a laser light for firing to heat the coating layer such that a heating temperature of the sealing material is within a range of at least (T+213°

    C.) and at most (T+480°

    C.) relative to a softening temperature T (°

    C.) of the sealing glass, thereby firing the sealing material while burning out the organic binder, to form a sealing material layer;

    (iii) laminating the first glass substrate and the second glass substrate with the sealing material layer, such that the first surface and the second surface face each other; and

    (iv) irradiating the sealing material layer with a laser light for sealing to melt the sealing material layer and thereby seal an electronic element portion situated between the first glass substrate and the second glass substrate,wherein;

    the irradiating (iv) of the sealing material layer occurs through the first glass substrate or the second glass substrate;

    the frame-form coating layer is irradiated (ii) with at least one laser light along it such that, relative to the softening temperature T (°

    C.) of the sealing glass;

    heating temperatures of the coating layer during an irradiation initiation period and during an irradiation completion period are within a range of at least (T+350°

    C.) and at most (T+550°

    C.); and

    a heating temperature of the coating layer during a scanning irradiation period is within a range of at least (T+213°

    C.) and at most (T+480°

    C.),such that a heating temperature of the coating layer during the irradiation initiation period is different than the heating temperature of the coating layer during the scanning irradiation period.

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