Process and apparatus for producing glass member provided with sealing material layer and process for producing electronic device
First Claim
1. A process for producing an electronic device, the process comprising:
- (i) applying a sealing material paste to a second sealing region in the form of a frame on a second glass substrate, to produce a frame-form coating layer, whereinthe sealing material paste is prepared by mixing a sealing material with an organic binder,the sealing material comprises a sealing glass and a laser absorbent,the second glass substrate comprises a second surface comprising the second sealing region which corresponds to a first sealing region on a first glass substrate, andthe first glass substrate comprises a first surface comprising the first sealing region;
(ii) irradiating the frame-form coating layer with a laser light for firing to heat the coating layer such that a heating temperature of the sealing material is within a range of at least (T+213°
C.) and at most (T+480°
C.) relative to a softening temperature T (°
C.) of the sealing glass, thereby firing the sealing material while burning out the organic binder, to form a sealing material layer;
(iii) laminating the first glass substrate and the second glass substrate with the sealing material layer, such that the first surface and the second surface face each other; and
(iv) irradiating the sealing material layer with a laser light for sealing to melt the sealing material layer and thereby seal an electronic element portion situated between the first glass substrate and the second glass substrate,wherein;
the irradiating (iv) of the sealing material layer occurs through the first glass substrate or the second glass substrate;
the frame-form coating layer is irradiated (ii) with at least one laser light along it such that, relative to the softening temperature T (°
C.) of the sealing glass;
heating temperatures of the coating layer during an irradiation initiation period and during an irradiation completion period are within a range of at least (T+350°
C.) and at most (T+550°
C.); and
a heating temperature of the coating layer during a scanning irradiation period is within a range of at least (T+213°
C.) and at most (T+480°
C.),such that a heating temperature of the coating layer during the irradiation initiation period is different than the heating temperature of the coating layer during the scanning irradiation period.
1 Assignment
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Accused Products
Abstract
To provide a process for producing a glass member provided with a sealing material layer, capable of favorably forming a sealing material layer even in a case where the entire glass substrate cannot be heated.
A sealing material paste prepared by mixing a sealing material containing a sealing glass and a laser absorbent with an organic binder is applied to a sealing region of a glass substrate 2 in the form of a frame. The frame-form coating layer 8 of the sealing material paste is selectively heated by irradiation with a laser light 9 along the coating layer 8 to fire the sealing material while the organic binder in the coating layer 8 is burnt out to form a sealing material layer 7. Using such a sealing material layer 7, a space between two glass substrates is sealed.
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Citations
13 Claims
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1. A process for producing an electronic device, the process comprising:
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(i) applying a sealing material paste to a second sealing region in the form of a frame on a second glass substrate, to produce a frame-form coating layer, wherein the sealing material paste is prepared by mixing a sealing material with an organic binder, the sealing material comprises a sealing glass and a laser absorbent, the second glass substrate comprises a second surface comprising the second sealing region which corresponds to a first sealing region on a first glass substrate, and the first glass substrate comprises a first surface comprising the first sealing region; (ii) irradiating the frame-form coating layer with a laser light for firing to heat the coating layer such that a heating temperature of the sealing material is within a range of at least (T+213°
C.) and at most (T+480°
C.) relative to a softening temperature T (°
C.) of the sealing glass, thereby firing the sealing material while burning out the organic binder, to form a sealing material layer;(iii) laminating the first glass substrate and the second glass substrate with the sealing material layer, such that the first surface and the second surface face each other; and (iv) irradiating the sealing material layer with a laser light for sealing to melt the sealing material layer and thereby seal an electronic element portion situated between the first glass substrate and the second glass substrate, wherein; the irradiating (iv) of the sealing material layer occurs through the first glass substrate or the second glass substrate; the frame-form coating layer is irradiated (ii) with at least one laser light along it such that, relative to the softening temperature T (°
C.) of the sealing glass;heating temperatures of the coating layer during an irradiation initiation period and during an irradiation completion period are within a range of at least (T+350°
C.) and at most (T+550°
C.); anda heating temperature of the coating layer during a scanning irradiation period is within a range of at least (T+213°
C.) and at most (T+480°
C.),such that a heating temperature of the coating layer during the irradiation initiation period is different than the heating temperature of the coating layer during the scanning irradiation period. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification