Trench transistor
First Claim
Patent Images
1. A method of forming a device comprising:
- providing a substrate defined with a device region;
forming a buried doped region in the substrate in the device region;
forming a trench having upper and lower portions of different widths in the substrate in the device region;
forming sidewall spacers on sidewalls of the upper portion of the trench, leaving a portion of the upper portion unfilled;
forming a drain connector in the trench;
removing the sidewall spacers, the removal of the sidewall spacer leaves a gap between the sidewalls of the trench and exposes a portion of the drain connector;
forming a gate in the upper portion of the trench in the substrate in the device region, wherein a channel of the device is disposed on a sidewall of the upper portion of the trench, the buried doped region is disposed below the gate, wherein a distance from the buried doped region to the channel is a drift length LD of the device, wherein forming the gate comprisesforming gate insulator layer on the exposed portion of the drain connector, andforming gate electrodes on either side of the gate insulators in the upper portion of the trench; and
forming a surface doped region adjacent to the gate.
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Abstract
A method of forming a device is disclosed. A substrate defined with a device region is provided. A buried doped region is formed in the substrate in the device region. A gate is formed in a trench in the substrate in the device region. A channel of the device is disposed on a sidewall of the trench. The buried doped region is disposed below the gate. A distance from the buried doped region to the channel is a drift length LD of the device. A surface doped region is formed adjacent to the gate.
28 Citations
18 Claims
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1. A method of forming a device comprising:
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providing a substrate defined with a device region; forming a buried doped region in the substrate in the device region; forming a trench having upper and lower portions of different widths in the substrate in the device region; forming sidewall spacers on sidewalls of the upper portion of the trench, leaving a portion of the upper portion unfilled; forming a drain connector in the trench; removing the sidewall spacers, the removal of the sidewall spacer leaves a gap between the sidewalls of the trench and exposes a portion of the drain connector; forming a gate in the upper portion of the trench in the substrate in the device region, wherein a channel of the device is disposed on a sidewall of the upper portion of the trench, the buried doped region is disposed below the gate, wherein a distance from the buried doped region to the channel is a drift length LD of the device, wherein forming the gate comprises forming gate insulator layer on the exposed portion of the drain connector, and forming gate electrodes on either side of the gate insulators in the upper portion of the trench; and forming a surface doped region adjacent to the gate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of forming a device comprising:
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providing a substrate defined with a device region; providing first and second device doped wells in the device region, wherein the first device doped well has a depth greater than the second device doped well; forming a buried doped region in the first device doped well; forming a trench having upper and lower portions of different widths in the substrate in the device region; forming sidewall spacers on sidewalls of the upper portion of the trench, leaving a portion of the upper portion unfilled; forming a drain connector in the trench; removing the sidewall spacers, the removal of the sidewall spacer leaves a gap between the sidewalls of the trench and exposes a portion of the drain connector; forming a gate in the upper portion of the trench in the substrate in the device region, wherein a channel of the device is disposed on a sidewall of the upper portion of the trench, the buried doped region is disposed below the gate, wherein a distance from the buried doped region to the channel is a drift length LD of the device, wherein forming the gate comprises forming gate insulator layer on the exposed portion of the drain connector, and forming gate electrodes on either side of the gate insulators in the upper portion of the trench; and forming a surface doped region adjacent to the gate. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A method of forming a device comprising:
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providing a substrate defined with a device region; forming a buried doped region in the substrate in the device region; forming a first trench in the substrate in the device region; forming a second trench in the first trench, wherein the second trench has a depth deeper than the first trench; forming sidewall spacers on sidewalls of the first trench, leaving a portion of the first trench unfilled; forming a drain connector in the first and second trenches; removing the sidewall spacers, the removal of the sidewall spacer leaves a gap between the sidewalls of the first trench and exposes a portion of the drain connector in the first trench; forming a gate in the first trench in the substrate in the device region, wherein a channel of the device is disposed on a sidewall of the first trench, the buried doped region is disposed below the gate, wherein a distance from the buried doped region to the channel is a drift length LD of the device, wherein forming the gate comprises forming gate insulator layer on the exposed portion of the drain connector, and forming gate electrodes on either side of the gate insulators in the first trench; and forming a surface doped region adjacent to the gate.
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Specification