Optical semiconductor device
First Claim
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1. An optical semiconductor device comprising:
- a substrate having mounted thereon an LED chip;
an encapsulation resin layer embedding the LED chip;
an inorganic high-heat conductive layer; and
a wavelength conversion layer containing an inorganic phosphor powder,wherein the encapsulation resin layer, the inorganic high-heat conductive layer and the wavelength conversion layer are laminated in this order on the substrate either directly or indirectly.
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Abstract
The present invention relates to an optical semiconductor device including: a substrate having mounted thereon an LED chip; an encapsulation resin layer embedding the LED chip; an inorganic high-heat conductive layer; and a wavelength conversion layer containing an inorganic phosphor powder, in which the encapsulation resin layer, the inorganic high-heat conductive layer and the wavelength conversion layer are laminated in this order on the substrate either directly or indirectly.
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Citations
9 Claims
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1. An optical semiconductor device comprising:
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a substrate having mounted thereon an LED chip; an encapsulation resin layer embedding the LED chip; an inorganic high-heat conductive layer; and a wavelength conversion layer containing an inorganic phosphor powder, wherein the encapsulation resin layer, the inorganic high-heat conductive layer and the wavelength conversion layer are laminated in this order on the substrate either directly or indirectly. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for manufacturing an optical semiconductor device, said method comprising:
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forming a wavelength conversion layer and an inorganic high-heat conductive layer in this order in a concave mold; filling an encapsulation resin on the inorganic high-heat conductive layer; disposing a substrate having mounted thereon an LED chip on the encapsulation resin so as to embed the LED chip in the encapsulation resin; and encapsulating the LED chip.
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Specification