Sputtering target and manufacturing method thereof, and transistor
First Claim
Patent Images
1. A sputtering target comprising:
- a sintered body of at least one metal oxide selected from magnesium oxide, zinc oxide, aluminum oxide, gallium oxide, indium oxide, and tin oxide,wherein the sintered body is subjected to a heat treatment after washing the sintered body, andwherein a concentration of hydrogen atoms contained in the sintered body is lower than 1×
1016 atoms/cm3.
1 Assignment
0 Petitions
Accused Products
Abstract
One object is to provide a deposition technique for forming an oxide semiconductor film. By forming an oxide semiconductor film using a sputtering target including a sintered body of a metal oxide whose concentration of hydrogen contained is low, for example, lower than 1×1016 atoms/cm3, the oxide semiconductor film contains a small amount of impurities such as a compound containing hydrogen typified by H2O or a hydrogen atom. In addition, this oxide semiconductor film is used as an active layer of a transistor.
-
Citations
20 Claims
-
1. A sputtering target comprising:
-
a sintered body of at least one metal oxide selected from magnesium oxide, zinc oxide, aluminum oxide, gallium oxide, indium oxide, and tin oxide, wherein the sintered body is subjected to a heat treatment after washing the sintered body, and wherein a concentration of hydrogen atoms contained in the sintered body is lower than 1×
1016 atoms/cm3. - View Dependent Claims (2, 3)
-
-
4. A transistor comprising an oxide semiconductor layer which is formed using a sputtering target,
wherein the sputtering target includes at least one metal oxide selected from magnesium oxide, zinc oxide, aluminum oxide, gallium oxide, indium oxide, and tin oxide, wherein a concentration of hydrogen atoms contained in the oxide semiconductor layer is lower than 1× - 1016 atoms/cm3.
- View Dependent Claims (5, 6)
-
7. A transistor comprising:
-
an oxide semiconductor layer which is formed using a sputtering target; a source electrode; a drain electrode; a gate electrode; and a gate insulating film, wherein the sputtering target includes at least one metal oxide selected from magnesium oxide, zinc oxide, aluminum oxide, gallium oxide, indium oxide, and tin oxide, wherein a concentration of hydrogen atoms contained in the oxide semiconductor layer is lower than 1×
1016 atoms/cm3. - View Dependent Claims (8, 9, 10, 11, 12)
-
-
13. A semiconductor device comprising:
-
a substrate; a transistor comprising an oxide semiconductor layer which is formed using a sputtering target, the transistor being over the substrate; and a wiring layer electrically connected to the transistor, wherein the sputtering target includes at least one metal oxide selected from magnesium oxide, zinc oxide, aluminum oxide, gallium oxide, indium oxide, and tin oxide, wherein a concentration of hydrogen atoms contained in the oxide semiconductor layer is lower than 1×
1016 atoms/cm3. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
-
Specification