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Pattern recognition with edge correction for design based metrology

  • US 8,495,527 B2
  • Filed: 09/20/2011
  • Issued: 07/23/2013
  • Est. Priority Date: 10/28/2010
  • Status: Expired due to Fees
First Claim
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1. A method for edge correction in pattern recognition for critical dimension scanning electron microscopy, the method comprising:

  • generating, in a processor, a pattern recognition (PR) output for a PR process, including;

    receiving, in the processor, a design layout, which includes a plurality of devices having a plurality of edges;

    receiving, in the processor, a sample plan based on the design layout;

    receiving, in the processor, a first user-generated edge input, which includes a plurality of secondary lines that are placed adjacent the plurality of edges to mimic wider edges present in a plurality of actual devices, the plurality of secondary lines generated via an offset table defining two extremes of line density of each of the plurality of edges, the two extremes being isolated and dense;

    interpolating, in the processor, the two extremes to determine offsets for an intermediate density of lines for each of the plurality of edges;

    generating, in the processor, a PR recipe output from the design layout, the sample plan and the user-generated edge input, wherein the PR recipe output is configured to drive the PR process;

    generating, in the processor, a measurement model (MM) from the PR process;

    generating, in the processor, a measurement model pattern recognition (MMPR) output for an MMPR process, including;

    receiving, in the processor, a second user-generated input; and

    generating, in the processor, a MMPR recipe output from the MM and the second user-generated edge input, wherein the MMPR recipe output configured to drive the MMPR process.

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