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Systems and methods for in situ annealing of electro- and electroless platings during deposition

  • US 8,496,799 B2
  • Filed: 09/10/2008
  • Issued: 07/30/2013
  • Est. Priority Date: 02/08/2005
  • Status: Expired due to Fees
First Claim
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1. A method depositing a metal layer on a substrate by action of a chemical solution that includes one of an electrolytic and electroless solution of one or more metal ions, the substrate having a front and a back surface and including an array of spaced-apart sections, each of the sections including a first portion in contact with the chemical solution and a second portion coupled with a rail that is not in contact with the chemical solution, the method comprising:

  • depositing a metal layer on the first portion of each of the plurality of sections of the substrate by action of the chemical solution; and

    annealing the metal layer in-situ during its growth phase as it is being deposited, wherein the annealing comprises locally heating a portion of the rail while moving the rail along the direction of the array of the spaced-apart sections such that at least some sections in the array of the spaced-apart sections of the substrate are heated at different times by thermal conduction from the portion of the rail being heated.

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