Vertical solid-state transducers having backside terminals and associated systems and methods
First Claim
1. A method of forming solid-state transducers (SSTs) having a first side and second side facing away from the first side, the method comprising:
- forming a transducer structure having an active region positioned between a first semiconductor material and a second semiconductor material, wherein the first semiconductor material is at the first side of the SST and the second semiconductor material is at the second side of the SST, wherein forming the transducer structure comprises forming the transducer structure on a growth substrate, the second semiconductor material being proximate to the growth substrate;
forming a first contact electrically coupled to the first semiconductor material;
forming a buried second contact electrically coupled to the second semiconductor material;
disposing a conductive carrier substrate on the first side of the SST, and electrically coupling the first and second contacts to the conductive carrier substrate;
forming a first terminal from a first portion of the conductive carrier substrate, the first terminal being electrically coupled to the first contact; and
forming a second terminal from a second portion of the conductive carrier substrate, the second terminal being electrically coupled to the second contact and electrically isolated from the first terminal, the first and second terminals both being accessible from the first side of the SST;
forming a plurality of trenches extending from the first side of the SST at least partially into the growth substrate;
forming separators in the trenches that demarcate individual SSTs; and
removing the growth substrate from the second semiconductor material such that at least a portion of each separator extends beyond the second semiconductor material to form a plurality of protrusions.
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Accused Products
Abstract
Vertical solid-state transducers (“SSTs”) having backside contacts are disclosed herein. An SST in accordance with a particular embodiment can include a transducer structure having a first semiconductor material at a first side of the SST, a second semiconductor material at a second side of the SST opposite the first side, and an active region between the first and second semiconductor materials. The SST can further include first and second contacts electrically coupled to the first and second semiconductor materials, respectively. A portion of the first contact can be covered by a dielectric material, and a portion can remain exposed through the dielectric material. A conductive carrier substrate can be disposed on the dielectric material. An isolating via can extend through the conductive carrier substrate to the dielectric material and surround the exposed portion of the first contact to define first and second terminals electrically accessible from the first side.
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Citations
12 Claims
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1. A method of forming solid-state transducers (SSTs) having a first side and second side facing away from the first side, the method comprising:
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forming a transducer structure having an active region positioned between a first semiconductor material and a second semiconductor material, wherein the first semiconductor material is at the first side of the SST and the second semiconductor material is at the second side of the SST, wherein forming the transducer structure comprises forming the transducer structure on a growth substrate, the second semiconductor material being proximate to the growth substrate; forming a first contact electrically coupled to the first semiconductor material; forming a buried second contact electrically coupled to the second semiconductor material; disposing a conductive carrier substrate on the first side of the SST, and electrically coupling the first and second contacts to the conductive carrier substrate; forming a first terminal from a first portion of the conductive carrier substrate, the first terminal being electrically coupled to the first contact; and forming a second terminal from a second portion of the conductive carrier substrate, the second terminal being electrically coupled to the second contact and electrically isolated from the first terminal, the first and second terminals both being accessible from the first side of the SST; forming a plurality of trenches extending from the first side of the SST at least partially into the growth substrate; forming separators in the trenches that demarcate individual SSTs; and removing the growth substrate from the second semiconductor material such that at least a portion of each separator extends beyond the second semiconductor material to form a plurality of protrusions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification