Light-emitting device and manufacturing method thereof

• US 8,497,512 B2
• Filed: 03/09/2012
• Issued: 07/30/2013
• Est. Priority Date: 08/05/2005
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Nakamura, Osamu, Higuchi, Miyuki, Watanabe, Yasuko, Arai, Yasuyuki
• Primary Examiner(s): ARMAND, MARC ANTHONY
• Application Number:
  US13/415,939
• Publication Number:
  US 20120168776A1
• Time in Patent Office: 508 Days
• Field of Search: 257/80, 257/E33.056, 257/72, 257/83, 257/918, 257/642, 257/E25.008, 257/E25.009, 257/E51.018, 438/25
• US Class Current: 257/72
• CPC Class Codes: H01L 27/12 the substrate being other than a semiconductor body, e.g. an insulating body
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/124 with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 27/14645 Colour imagers
• CPC Class Codes: H10K 59/1201 Manufacture or treatment
• CPC Class Codes: H10K 59/1275 Electrical connections of the two substrates
• CPC Class Codes: H10K 59/179 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 59/60 OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
• CPC Class Codes: H10K 71/80 using temporary substrates
• CPC Class Codes: Y10S 257/918 Light emitting regenerative switching device, e.g. light emitting scr arrays, circuitry

Abstract

To prevent a point defect and a line defect in forming a light-emitting device, thereby improving the yield. A light-emitting element and a driver circuit of the light-emitting element, which are provided over different substrates, are electrically connected. That is, a light-emitting element and a driver circuit of the light-emitting element are formed over different substrates first, and then electrically connected. By providing a light-emitting element and a driver circuit of the light-emitting element over different substrates, the step of forming the light-emitting element and the step of forming the driver circuit of the light-emitting element can be performed separately. Therefore, degrees of freedom of each step can be increased, and the process can be flexibly changed. Further, steps (irregularities) on the surface for forming the light-emitting element can be reduced than in the conventional technique.

Claims

1. A light-emitting device comprising:

a first substrate having a first surface and a second surface which is a rear surface of the first surface;

a light-emitting element over the first surface of the first substrate;

a second substrate;

a pixel circuit for driving the light-emitting element over the second substrate, the second substrate being provided to face the second surface of the first substrate; and

a third substrate being provided to face the first surface of the first substrate so as to cover the light-emitting element,

wherein the light-emitting element is electrically connected to the pixel circuit.

2. The light-emitting device according to claim 1, wherein the first substrate and the second substrate are attached to each other with an anisotropic conductive film, thereby the light-emitting element is electrically connected to the pixel circuit.

3. The light-emitting device according to claim 1, wherein each of the first substrate and the second substrate is a light-transmissive substrate.

4. The light-emitting device according to claim 1, wherein the number of the first substrates is one, and the number of the second substrates is more than one.

5. The light-emitting device according to claim 1, wherein the number of the first substrates is more than one, and the number of the second substrates is one.

6. The light-emitting device according to claim 1, wherein the number of the first substrates and the number of the second substrates are more than one.

7. A light-emitting device comprising:

a first substrate having a first surface and a second surface which is a rear surface of the first surface;

a light-emitting element over the first surface of the first substrate;

a second substrate;

a pixel circuit for driving the light-emitting element over the second substrate, the second substrate being provided to face the second surface of the first substrate; and

a third substrate being provided to face the first surface of the first substrate so as to cover the light-emitting element,

wherein the pixel circuit comprises a driving transistor for driving the light-emitting element; and

wherein the driving transistor is electrically connected to the light-emitting element.

8. The light-emitting device according to claim 7, wherein the first substrate and the second substrate are attached to each other with an anisotropic conductive film, thereby the light-emitting element is electrically connected to the driving transistor.

9. The light-emitting device according to claim 7, wherein each of the first substrate and the second substrate is a light-transmissive substrate.

10. The light-emitting device according to claim 7, wherein the number of the first substrates is one, and the number of the second substrates is more than one.

11. The light-emitting device according to claim 7, wherein the number of the first substrates is more than one, and the number of the second substrates is one.

12. The light-emitting device according to claim 7, wherein the number of the first substrates and the number of the second substrates are more than one.

13. A light-emitting device comprising:

a first substrate;

a light-emitting element over the first substrate;

an insulating film which covers the light-emitting element;

a second substrate; and

a row driver and a column driver for driving the light-emitting element over the second substrate, the second substrate being provided to face the first substrate so as to cover the light-emitting element,

wherein the light-emitting element is electrically connected to the row driver or the column driver through the insulating film.

14. The light-emitting device according to claim 13, wherein the first substrate and the second substrate are attached to each other with an anisotropic conductive film, thereby the light-emitting element is electrically connected to the row driver or the column driver.

15. The light-emitting device according to claim 13, wherein each of the first substrate and the second substrate is a light-transmissive substrate.

16. The light-emitting device according to claim 13, wherein the number of the first substrates is one, and the number of the second substrates is more than one.

17. The light-emitting device according to claim 13, wherein the number of the first substrates is more than one, and the number of the second substrates is one.

18. The light-emitting device according to claim 13, wherein the number of the first substrates and the number of the second substrates are more than one.

19. A manufacturing method of a light-emitting device, comprising the steps of:

forming a light-emitting element over a first substrate;

forming an insulating film over the light-emitting element;

forming a separation layer over a second substrate;

forming a layer comprising a pixel circuit for driving the light-emitting element over the separation layer;

separating the layer comprising the pixel circuit for driving the light-emitting element from the second substrate; and

attaching the first substrate and the layer comprising the pixel circuit for driving the light-emitting element to each other so that the first substrate and the layer comprising the pixel circuit for driving the light-emitting element face each other, thereby electrically connecting the light-emitting element to the pixel circuit.

20. The method according to claim 19, wherein the light-emitting element faces a separated surface of the layer comprising the pixel circuit for driving the light-emitting element.

21. The method according to claim 19, wherein the light-emitting element is electrically connected to the pixel circuit through the insulating film.

22. A manufacturing method of a light-emitting device, comprising the steps of:

forming a light-emitting element over a first substrate;

forming an insulating film over the light-emitting element;

forming a layer comprising a pixel circuit for driving the light-emitting element over a second substrate;

processing the second substrate to be thinner; and

attaching the first substrate and the second substrate to each other so that the first substrate and the second substrate face each other, thereby electrically connecting the light-emitting element to the pixel circuit.

23. The method according to claim 22, wherein the light-emitting element faces a surface of the second substrate which is processed to be thinner

24. The method according to claim 22, wherein the light-emitting element is electrically connected to the pixel circuit through the insulating film.