Semiconductor device and a method of manufacturing the same
First Claim
1. A semiconductor device comprising:
- a first gate electrode formed of a first conductor film and a second gate electrode formed of a second conductor film, the first and second gate electrodes being formed over a semiconductor substrate and adjacent to each other;
a first gate insulating film formed between the first gate electrode and the semiconductor substrate;
a second gate insulating film formed between the second gate electrode and the semiconductor substrate and between the first gate electrode and the second gate electrode, and having a charge accumulator portion disposed inside of the second gate insulating film;
a resistive element formed in the semiconductor substrate;
first sidewall insulating films formed over side walls of the first and second gate electrodes;
a first insulating film formed over an upper portion of the second gate electrode;
a second insulating film formed over a side wall of the first insulating film; and
a third insulating film formed over the resistive element,wherein a height of the second gate electrode is lower than a height of the first gate electrode,wherein the first sidewall insulating films have the same material as that of the first insulating film,wherein the second insulating film have the same material as that of the third insulating film,wherein the resistive element has first, second, and third portions,wherein the first portion and the second portion are exposed from the third insulating film,wherein the third portion is covered with the third insulating film,wherein a first metal silicide layer is formed over the first portion and a second metal silicide layer is formed on the second portion,wherein a third metal silicide film is formed over the first gate electrode, andwherein a metal silicide film is not formed over the second gate electrode.
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Accused Products
Abstract
Provided is a semiconductor device having, over a semiconductor substrate, a control gate electrode and a memory gate electrode which are adjacent to each other and constitute a nonvolatile memory. The height of the memory gate electrode is lower than the height of the control gate electrode. A metal silicide film is formed over the upper surface of the control gate electrode, but not formed over the upper surface of the memory gate electrode. The memory gate electrode has, over the upper surface thereof, a sidewall insulating film made of silicon oxide. This sidewall insulating film is formed in the same step as that for the formation of respective sidewall insulating films over the sidewalls of the memory gate electrode and the control gate electrode. The present invention makes it possible to improve the production yield and performance of the semiconductor device having a nonvolatile memory.
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Citations
7 Claims
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1. A semiconductor device comprising:
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a first gate electrode formed of a first conductor film and a second gate electrode formed of a second conductor film, the first and second gate electrodes being formed over a semiconductor substrate and adjacent to each other; a first gate insulating film formed between the first gate electrode and the semiconductor substrate; a second gate insulating film formed between the second gate electrode and the semiconductor substrate and between the first gate electrode and the second gate electrode, and having a charge accumulator portion disposed inside of the second gate insulating film; a resistive element formed in the semiconductor substrate; first sidewall insulating films formed over side walls of the first and second gate electrodes; a first insulating film formed over an upper portion of the second gate electrode; a second insulating film formed over a side wall of the first insulating film; and a third insulating film formed over the resistive element, wherein a height of the second gate electrode is lower than a height of the first gate electrode, wherein the first sidewall insulating films have the same material as that of the first insulating film, wherein the second insulating film have the same material as that of the third insulating film, wherein the resistive element has first, second, and third portions, wherein the first portion and the second portion are exposed from the third insulating film, wherein the third portion is covered with the third insulating film, wherein a first metal silicide layer is formed over the first portion and a second metal silicide layer is formed on the second portion, wherein a third metal silicide film is formed over the first gate electrode, and wherein a metal silicide film is not formed over the second gate electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification