LED package and method of assembling the same
First Claim
Patent Images
1. An LED package, comprising:
- a carrier integrally punched from a metal sheet into a cup shape comprising a bottom portion and a lateral wall;
an LED chip, received in the carrier and disposed on the bottom portion;
a conductive structure, electrically connected to the LED chip;
a first encapsulant, received in the carrier and fixing the carrier and the conductive structure, wherein the first encapsulant separates the carrier from the conductive structure;
a lens, corresponding to the LED chip, wherein the LED chip, the conductive structure, the lens, and the first encapsulant are assembled on the carrier to form an assembly, wherein the lens is entirely within the lateral wall of the carrier from a top view; and
a heat sink having a recess corresponding in shape to the carrier, wherein the assembly is received in the recess such that the carrier is embedded in the heat sink, and heat generated by the LED chip is transmitted to the heat sink via the bottom portion and the lateral wall of the carrier, wherein the heat sink is not integrally formed with the carrier.
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Abstract
An LED package is provided. The LED package includes a carrier, an LED chip, a conductive structure, a first encapsulant, a lens and a heat sink. The carrier is cup shaped and comprises a bottom portion and a lateral wall. The LED chip is received in the carrier and disposed on the bottom portion. The conductive structure is electrically connected to the LED chip. The first encapsulant is received in the carrier and fixing the carrier and the conductive structure. The lens is corresponding to the LED chip. The carrier is embedded in the heat sink, and heat generated by the LED chip is transmitted to the heat sink via the bottom portion and the lateral wall of the carrier.
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Citations
21 Claims
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1. An LED package, comprising:
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a carrier integrally punched from a metal sheet into a cup shape comprising a bottom portion and a lateral wall; an LED chip, received in the carrier and disposed on the bottom portion; a conductive structure, electrically connected to the LED chip; a first encapsulant, received in the carrier and fixing the carrier and the conductive structure, wherein the first encapsulant separates the carrier from the conductive structure; a lens, corresponding to the LED chip, wherein the LED chip, the conductive structure, the lens, and the first encapsulant are assembled on the carrier to form an assembly, wherein the lens is entirely within the lateral wall of the carrier from a top view; and a heat sink having a recess corresponding in shape to the carrier, wherein the assembly is received in the recess such that the carrier is embedded in the heat sink, and heat generated by the LED chip is transmitted to the heat sink via the bottom portion and the lateral wall of the carrier, wherein the heat sink is not integrally formed with the carrier. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An LED package, comprising:
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a carrier integrally formed by punching from a metal sheet, wherein the carrier is cup shaped and comprises a bottom portion and a lateral wall; a conductive structure formed by punching; a first encapsulant injected into the carrier, wherein the first encapsulant fixes the carrier and the conductive structure, wherein the first encapsulant separates the carrier from the conductive structure; a LED chip disposed on the carrier and electrically connected to the LED chip and the conductive structure; a lens packaged with the LED chip, wherein the lens corresponds to the LED chip; and wherein carrier, the conductive structure, the first encapsulant, the LED chip and the lens are first assembled together, and then the carrier is embedded in a heat sink such that heat generated by the LED chip is transmitted to the heat sink via the bottom portion and the lateral wall of the carrier. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification