Implantable electrode and method of making the same

• US 8,498,720 B2
• Filed: 03/02/2009
• Issued: 07/30/2013
• Est. Priority Date: 02/29/2008
• Status: Active Grant

• Current Assignee: Neuronexus Technologies Incorporated (NEL Group, Inc.)
• Original Assignee: Neuronexus Technologies Incorporated (NEL Group, Inc.)
• Inventors: Pellinen, David S., Gulari, Mayurachat, Hetke, Jamille Farraye, Anderson, David J., Kipke, Daryl R., Vetter, Rio J.
• Primary Examiner(s): Patel, Niketa
• Assistant Examiner(s): PHAM, MINH DUC GIA
• Application Number:
  US12/396,107
• Publication Number:
  US 20090234426A1
• Time in Patent Office: 1,611 Days
• Field of Search: 607/16, 607/161, 600/395
• US Class Current: 607/116
• CPC Class Codes: A61B 5/24 Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0529 Electrodes for brain stimulation
• CPC Class Codes: A61N 1/0551 Spinal or peripheral nerve electrodes
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/2072 Anchoring, i.e. one structure gripping into another providing micro- or nanometer scale roughness on a metal surface H05K2203/0307
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

The implantable electrode system of the preferred embodiments includes a conductor, an interconnect coupled to the conductor, an insulator that insulates the interconnect, and an anchor that is connected to both the conductor and the insulating element. The anchor is mechanically interlocked with at least one of the conductor and the insulator.

Claims

1. An implantable electrode, comprising:

a) an insulator layer comprising an upper insulator surface;

b) an electrically conductive interconnect, layer supported directly on the upper insulator surface and comprising an interconnect width extending between spaced apart first and second interconnect edges;

c) an electrically conductive plug layer supported directly on an upper interconnect surface of the interconnect layer, the plug layer comprising a plug width extending between spaced apart first and second plug edges;

d) an electrically conductive electrode layer supported directly on an upper plug surface of the plug layer, the electrode layer comprising an electrode width or diameter extending between spaced apart first and second electrode edges; and

e) an electrically conductive anchor layer supported on the insulator layer, the anchor layer comprising an anchor width extending between spaced apart first and second anchor edges,

f) wherein the anchor layer resides adjacent to at least one of the first and second edges of the electrode layer where the anchor layer is electrically connected to the electrode layer, and

g) a portion of the insulator layer contacts the first plug edge and extends to an overlaying relationship with a portion of an upper anchor surface of the anchor layer to thereby lock the anchor layer in the insulator layer.

2. The implantable electrode of claim 1, wherein the electrode layer is a neural interface that provides at least one function selected from the group consisting of recording and stimulating.

3. The implantable electrode of claim 1, wherein the anchor layer is chemically bonded to at least one of the electrode layer and the insulator layer.

4. The implantable electrode of claim 1, wherein the anchor layer is of a first material that creates a first bond with the electrode layer and the insulator layer is of a second material that creates a second bond with the electrode layer, and wherein the first bond is stronger than the second bond.

5. The implantable electrode of claim 4, wherein both the electrode layer and the anchor layer are of a metal material.

6. The implantable electrode of claim 4, wherein the insulator layer partially envelops the anchor layer and defines an opening to expose a portion of the anchor layer, thereby mechanically interlocking the insulator layer and the anchor layer.

7. The implantable electrode of claim 6, wherein the exposed portion of the anchor layer has a shape that is substantially similar to the shape of the electrode layer.

8. The implantable electrode claim 7, wherein the exposed portion of the anchor layer has a ring shape.

9. The implantable electrode of claim 6, wherein the electrode layer is chemically bonded to the anchor layer.

10. The implantable electrode of claim 9, wherein the electrode layer includes a leg that chemically bonds with the anchor layer.

11. The implantable electrode of claim 1, wherein the anchor layer is of a first material that creates a first bond with the insulator layer and the electrode layer is of a second material that creates a second bond with the insulator layer, wherein the first bond is stronger than the second bond.

12. The implantable electrode of claim 11, wherein both the insulator layer and the anchor layer are of a material that acts as an electrical insulator.

13. The implantable electrode of claim 11, wherein the anchor layer partially envelops the electrode layer and defines an opening to expose a portion of the electrode layer, thereby mechanically interlocking the anchor layer and the electrode layer.

14. The implantable electrode of claim 13, wherein the exposed portion of the electrode layer is a center portion of the surface of the electrode layer and a perimeter of the electrode layer is substantially enveloped by the anchor layer.

15. The implantable electrode claim 13, wherein the anchor layer is chemically bonded to the insulator layer.

16. The implantable electrode of claim 1, wherein the insulator layer includes a first insulator layer supporting the electrically conductive interconnect layer and a second insulator layer that contacts the first plug edge and extends to the overlaying relationship with the portion of the upper anchor surface to thereby lock the anchor layer in the insulator layer, wherein the second insulator layer is supported on the first insulator layer.

17. The implantable electrode of claim 16, wherein the first insulator layer comprises the upper insulator surface that supports the interconnect layer and the anchor layer, and wherein the second insulator layer contacts both the interconnect layer and the anchor layer and physically insulates the interconnect layer from the anchor layer.

18. The implantable electrode of claim 16, wherein the first insulator layer comprises the upper insulator surface that supports the interconnect layer, and wherein the second insulator layer defines a second insulator surface that supports the anchor layer, and wherein the insulator layer further includes a third insulator layer that is supported on the second insulator layer and coupled to the anchor layer.

19. The implantable electrode of claim 1 wherein the portion of the insulator layer contacting the first plug edge and extending to the overlaying relationship with the portion of the upper anchor surface also contacts the first edge of the interconnect layer.

20. An implantable electrode system, comprising:

a) an insulator layer comprising an upper insulator surface;

b) an electrically conductive interconnect layer supported directly on the upper insulator surface and comprising an interconnect width extending between spaced apart first and second interconnect edges;

c) an electrically conductive plug layer supported directly on an upper interconnect surface of the interconnect layer, the plug layer comprising a plug width extending between spaced apart first and second plug edges;

d) an electrically conductive electrode layer supported directly on an upper plug surface of the plug layer, the electrode layer comprising an electrode width or diameter extending between spaced apart first and second electrode edges; and

e) an electrically conductive anchor layer supported on the insulator layer, the anchor layer comprising an anchor width extending between spaced apart first and second anchor edges,

f) wherein the anchor layer resides adjacent to at least one of the first and second edges of the electrode layer where the anchor layer is electrically connected to the electrode layer, and

g) a portion of the insulator layer resides between the first plug edge and extends to an overlaying relationship with a portion of an upper anchor surface of the anchor layer to thereby lock the anchor layer in the insulator layer.

21. An implantable electrode, comprising:

a) an insulator layer comprising an upper insulator surface;

b) an electrically conductive interconnect layer supported directly on the upper insulator surface and comprising an interconnect width extending between spaced apart first and second interconnect edges;

c) an electrically conductive plug layer supported directly on an upper interconnect surface of the interconnect layer, the plug layer comprising a plug width extending between spaced apart first and second plug edges;

d) an electrically conductive electrode layer supported directly on an upper plug surface of the plug layer, the electrode layer comprising an electrode width or diameter extending between spaced apart first and second electrode edges; and

e) an electrically conductive anchor layer supported on the insulator layer, the anchor layer comprising an anchor width extending between spaced apart first and second anchor edges,

f) wherein the anchor layer resides adjacent to at least one of the first and second edges of the electrode layer where the anchor layer is electrically connected to the electrode layer, and

g) a portion of the insulator layer that contacts the first interconnect edge and the first plug edge and extends to an overlaying relationship with a portion of an upper anchor surface of the anchor layer to thereby lock the anchor layer in, the insulating layer.

22. An implantable electrode, comprising:

a) an insulator layer comprising an upper insulator surface;

b) an electrically conductive interconnect layer supported directly on the upper insulator surface and comprising an interconnect width extending between spaced apart first and second interconnect edges;

c) an electrically conductive plug layer supported directly on an upper interconnect surface of the interconnect layer, the plug layer comprising a plug width extending between spaced apart first and second plug edges, wherein the plug width is less than the interconnect width;

d) an electrically conductive electrode layer supported directly on an upper plug surface of the plug layer, the electrode layer comprising an electrode width or diameter extending between spaced apart first and second electrode edges, wherein the electrode width is greater than both the interconnect width and the plug width; and

e) an electrically conductive anchor layer supported on the insulator layer, the anchor layer comprising an anchor width extending between spaced apart first and second anchor edges,

f) wherein the anchor layer resides adjacent to at least one of the first and second edges of the electrode layer where the anchor layer is electrically connected to the electrode layer, and

g) a portion of the insulator layer contacts the first plug edge and extends to an overlaying relationship with a portion of an upper anchor surface of the anchor layer to thereby lock the anchor layer in the insulator layer.

23. An implantable electrode system, comprising:

a) an insulator layer comprising an upper insulator surface;

b) an electrically conductive interconnect layer supported directly on the upper insulator surface and comprising an interconnect, width extending between spaced apart first and second interconnect edges;

c) an electrically conductive plug layer supported directly on an upper interconnect surface of the interconnect layer, the plug layer comprising a plug width extending between spaced apart first and second plug edges, wherein the plug width is less than the interconnect width;

d) an electrically conductive electrode layer supported directly on an upper plug surface of the plug layer, the electrode layer comprising an electrode width or diameter extending between spaced apart first and second electrode edges, wherein the electrode width is greater than both the interconnect width and the plug width; and

e) an electrically conductive anchor layer supported on the insulator layer, the anchor layer comprising an anchor width extending between spaced apart first and second anchor edges,

f) wherein the anchor layer resides adjacent to at least one of the first and second edges of the electrode layer where the anchor layer is electrically connected to the electrode layer, and

g) a portion of the insulator layer resides between the first plug edge and extends to an overlaying relationship with a portion of an upper anchor surface of the anchor layer to thereby lock the anchor layer in the insulator layer.

24. An implantable electrode, comprising:

a) an insulator layer comprising an upper insulator surface;

b) an electrically conductive interconnect layer supported directly on the upper insulator surface and comprising an interconnect width extending between spaced apart first and second interconnect edges;

c) an electrically conductive plug layer supported directly on an upper interconnect surface of the interconnect layer, the plug layer comprising a plug width extending between spaced apart first and second plug edges, wherein the plug width is less than the interconnect width;

d) an electrically conductive electrode layer supported directly on an upper plug surface of the plug layer, the electrode layer comprising an electrode width or diameter extending between spaced apart first and second electrode edges, wherein the electrode width is greater than both the interconnect width and the plug width; and

e) an electrically conductive anchor layer supported on the insulator layer, the anchor layer comprising an anchor width extending between spaced apart first and second anchor edges,

f) wherein the anchor layer resides adjacent to at least one of the first and second edges of the electrode layer where the anchor layer is electrically connected to the electrode layer, and

g) a portion of the insulator layer that contacts the first interconnect edge and the first plug edge and extends to an overlaying relationship with a portion of an upper anchor surface of the anchor layer to thereby lock the anchor layer in the insulating layer.

25. An implantable electrode, comprising:

a) an insulator layer comprising an upper insulator surface;

b) an electrically conductive interconnect layer supported directly on the upper insulator surface and comprising an interconnect width extending between spaced apart first and second interconnect edges;

c) an electrically conductive plug layer supported directly on an upper interconnect surface of the interconnect layer, the plug layer comprising a plug width extending between spaced apart first and second plug edge;

d) an electrically conductive electrode layer supported directly on an upper plug surface of the plug layer, the electrode layer comprising an electrode width or diameter extending between spaced apart first and second electrode edges; and

e) an electrically conductive anchor layer supported on the insulator layer, the anchor layer comprising an anchor width extending between spaced apart first and second anchor edges,

f) wherein the anchor layer resides adjacent to at least one of the first and second edges of the electrode layer where the anchor layer is electrically connected to a leg of the electrode layer, and

g) a portion of the insulator layer that contacts the first interconnect edge and the first plug edge and extends to an overlaying relationship with a portion of an upper anchor surface of the anchor layer to thereby lock the anchor layer in the insulator layer.

26. An implantable electrode, comprising:

a) an insulator layer comprising an upper insulator surface;

b) an electrically conductive interconnect layer supported directly on the upper insulator surface and comprising an interconnect width extending between spaced apart first and second interconnect edges;

c) an electrically conductive plug layer supported directly on an upper interconnect surface of the interconnect layer, the plug layer comprising a plug width extending between spaced apart first and second plug edges, wherein the plug width is less than the interconnect width;

d) an electrically conductive electrode layer supported directly on an upper plug surface of the plug layer, the electrode layer comprising an electrode width or diameter extending between spaced apart first and second electrode edges, wherein the electrode width is greater than both the interconnect width and the plug width; and

e) an electrically conductive anchor layer supported on the insulator layer, the anchor layer comprising an anchor width extending between spaced apart first and second anchor edges,

f) wherein the anchor layer resides adjacent to at least one of the first and second edges of the electrode layer where the anchor layer is electrically connected to a leg of the electrode layer, and

g) a portion of the insulator layer that contacts the first interconnect edge and the first plug edge and extends to an overlaying relationship with a portion of an upper anchor surface of the anchor layer to thereby lock the anchor layer in the insulator layer.