Configurable health-care equipment apparatus

• US 8,499,108 B2
• Filed: 06/01/2012
• Issued: 07/30/2013
• Est. Priority Date: 07/24/2009
• Status: Active Grant

• Current Assignee: Welch Allyn Incorporated
• Original Assignee: Welch Allyn Incorporated
• Inventors: Edwards, Ian K., Lia, Raymond A., Martin, Scott A., Salvati, Jon R., Vivenzio, Robert L., Wawro, Thaddeus J., Wood, Robert J.
• Primary Examiner(s): Tsai, Henry
• Assistant Examiner(s): Sun, Michael
• Application Number:
  US13/486,326
• Publication Number:
  US 20120246375A1
• Time in Patent Office: 424 Days
• Field of Search: None
• US Class Current: 710/63
• CPC Class Codes: A61B 1/00105 characterised by modular construction
• CPC Class Codes: A61B 1/00148 using anchoring means
• CPC Class Codes: A61B 1/227 for ears, i.e. otoscopes
• CPC Class Codes: A61B 1/267 for the respiratory tract, e.g. laryngoscopes, bronchoscopes
• CPC Class Codes: A61B 2560/0431 Portable apparatus, e.g. comprising a handle or case
• CPC Class Codes: A61B 2560/0437 Trolley or cart-type apparatus
• CPC Class Codes: A61B 2560/0443 Modular apparatus
• CPC Class Codes: A61B 2560/0456 Apparatus provided with a docking unit
• CPC Class Codes: A61B 2560/0462 Apparatus with built-in sensors
• CPC Class Codes: A61B 3/1208 Multiple lens hand-held instruments
• CPC Class Codes: A61B 3/18 Arrangement of plural eye-testing or -examining apparatus
• CPC Class Codes: A61B 5/00 Measuring for diagnostic purposes radiation diagnosis A61B6/00; diagnosis by ultrasonic, sonic or infrasonic waves A61B8/00; Identification of persons
• CPC Class Codes: A61B 5/0022 Monitoring a patient using a global network, e.g. telephone networks, internet
• CPC Class Codes: A61B 5/01 Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue clinical contact thermometers G01K13/20
• CPC Class Codes: A61B 5/0205 Simultaneously evaluating both cardiovascular conditions and different types of body conditions, e.g. heart and respiratory condition
• CPC Class Codes: A61B 5/02141 Details of apparatus construction, e.g. pump units or housings therefor, cuff pressurising systems, arrangements of fluid conduits or circuits A61B5/02233, A61B5/0235 take precedence
• CPC Class Codes: A61B 5/022 by applying pressure to close blood vessels, e.g. against the skin; Ophthalmodynamometers
• CPC Class Codes: A61B 5/12 Audiometering
• CPC Class Codes: A61B 5/1455 using optical sensors, e.g. spectral photometrical oximeters
• CPC Class Codes: A61B 5/14552 Details of sensors specially adapted therefor
• CPC Class Codes: A61B 5/6891 : Furniture
• CPC Class Codes: A61B 50/10 : Furniture specially adapted for surgical or diagnostic appliances or instruments
• CPC Class Codes: A61B 50/13 : Trolleys, e.g. carts
• CPC Class Codes: G01K 13/20 : Clinical contact thermometers for use with humans or animals
• CPC Class Codes: G06F 13/385 : for adaptation of a particular data processing system to different peripheral devices
• CPC Class Codes: G06F 13/409 : Mechanical coupling back panels H05K7/1438
• CPC Class Codes: G06F 13/4221 : being an input/output bus, e.g. ISA bus, EISA bus, PCI bus, SCSI bus

Abstract

An apparatus, system and method for providing health-care equipment in a plurality of customizable configurations. A configuration includes a selection and arrangement of health-care equipment modules that each provide specialized support for the provision of health care, including the measurement of physiological parameters. Various types of configurations include those adapted to be mounted upon a desk top or a wall surface, or adapted for wheel mounting or hand-carriable mobile configurations.

Claims

1. A module, comprising:

an embedded component configured to measure a physiological parameter;

a module enclosure including the embedded component; and

an electrical interface between the embedded component and a computing component, which is separate from the module,

wherein at least one of electrical power and data is transferred between the computing component and the embedded component via the electrical interface, and

wherein the embedded component includes software executing at least one communications protocol via the electrical interface for facilitating identification and interoperation between the embedded component and the computing component, and

wherein the module enclosure is designed to attach to a frame and to stack in combination with one or more other modules, while said other modules are also attached to said frame.

2. The module of claim 1 wherein the computing component performs a decision to permit or deny interoperation between the computing component and the embedded component and wherein the decision is based upon at least one of a vendor-identification value and a product-identification value.

3. The module of claim 1 wherein the electrical interface is provided as a feature of a commercially available personal computer and wherein the personal computer can function as the computing component.

4. The module of claim 1 including a well configured for docking a hand-held device and providing the electrical interface to the hand-held device.

5. The module of claim 4 wherein the module is attached to the frame, which is incorporated into a mobile wheel mounted cart.

6. The module of claim 4 wherein the module is attached to the frame, which is incorporated into a wall mounted configuration.

7. The module of claim 4 wherein the module is attached to the frame, which is incorporated into a desk top mounted configuration.

8. The module of claim 1 wherein the electrical interface includes a universal serial bus (USB) connection between the embedded component and a universal serial bus (USB) host.

9. The module of claim 8 wherein the embedded component functions as a USB end-point connection.

10. The module of claim 1 wherein the module attaches to the frame and wherein the frame provides a universal serial bus (USB) end-point connection to the module.

11. The module of claim 10 wherein the frame further provides universal serial bus (USB) connection to a (USB) host from the (USB) end-point connection.

12. The module of claim 11 wherein the USB connection to the USB host is provided via a universal serial bus (USB) hub.

13. The module of claim 10 wherein the computing component is implemented as an embedded component within one of the other modules.

14. The module of claim 8 wherein the embedded component communicates with the computing component via the USB host.

15. The module of claim 8 wherein the universal serial bus (USB) module end-point connection supplies voltage within universal serial bus (USB) standards while supplying current substantially in excess of universal serial bus (USB) standards.

16. The module of claim 8 wherein the universal serial bus (USB) module end-point connection is designed to supply voltage between 4.75 volts and 5.25 volts and designed to supply current at a rate greater than or equal to 1.5 amperes.

17. The module of claim 1 wherein the computing component transmits a command to the embedded component, to transition the embedded component from normal operation to a sleep mode.

18. The module of claim 8 wherein the computing component transmits a command to the embedded component to transition the embedded component from a sleep mode to normal operation.

19. The module of claim 1 wherein the embedded component is a temperature measuring, oxyhemoglobin saturation measurement via pulse oximetry(SPO2) measuring or a blood pressure measuring device.

20. The module of claim 1 wherein the module enclosure is dimensioned to stack in combination with the other modules along a stacking direction, and wherein each of a plurality of module enclosures has a cross-section uniformly shaped and sized with respect to a plane oriented perpendicular to the stacking direction.

21. The module of claim 20 wherein each of the plurality of module enclosures has a width dimension parallel to the stacking direction and can vary substantially relative to each module enclosure within the stack of module enclosures so that each module enclosure can comprise an embedded component of substantially different type or size relative to an embedded component within another module enclosure.

22. A system for integrating one or more health care-equipment modules, comprising:

a frame having a mechanical interface for engagement with each of one or more modules, which each include an embedded component, at one time;

an electrical interface between a computing component and each embedded component for transfer of at least one of electrical power and data between the computing component and each embedded component; and

software within each embedded component configured for executing at least one communications protocol via the electrical interface for facilitating identification and interoperation between the embedded component and the computing component,

wherein the computing component performs a decision to permit or deny initiation of any interoperation between the computing component and each embedded component based upon at least one of the vendor-identification value and the product-identification value, and

wherein each embedded component is configured to perform a measurement and to communicate results of the measurement to the computing component during interoperation with the computing component; and

wherein the module enclosure is designed to attach to a frame and to stack in combination with one or more other modules, while said other modules are also attached to said frame.

23. A method for integrating one or more health care-equipment modules, comprising the steps of:

providing a frame having a mechanical interface for engagement with each of one or more modules, at one time;

providing the modules that each include an embedded component; and

providing an electrical interface between a computing component and each embedded component for transfer of at least one of electrical power and data between the computing component and each embedded component;

providing software within each embedded component configured for executing at least one communications protocol via the electrical interface for facilitating identification and interoperation between the embedded component and the computing component; and

wherein the computing component performs a decision to permit or deny initiation of any interoperation between the computing component and each embedded component based upon at least one of the vendor-identification value and the product-identification value, and

wherein each embedded component is configured to perform a measurement and to communicate results of the measurement to the computing component during interoperation with the computing component; and

wherein the module enclosure is designed to attach to a frame and to stack in combination with one or more other modules, while said other modules are also attached to said frame.