Optical proximity correction verification accounting for mask deviations

• US 8,499,260 B2
• Filed: 01/26/2011
• Issued: 07/30/2013
• Est. Priority Date: 01/26/2011
• Status: Expired due to Fees

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Bruce, James A., Settlemyer, Kenneth T. Jr.
• Primary Examiner(s): LIN, SUN J
• Application Number:
  US13/014,159
• Publication Number:
  US 20120192124A1
• Time in Patent Office: 916 Days
• Field of Search: 716 50- 54
• US Class Current: 716/54
• CPC Class Codes: G03F 1/36 Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
• CPC Class Codes: G03F 7/70441 Optical proximity correction [OPC]

Abstract

Solutions for accounting for photomask deviations in a lithographic process during optical proximity correction verification are disclosed. In one embodiment, a method includes: identifying a wafer control structure in a data set representing one of a first chip or a kerf; biasing the data set representing the first chip in the case that the wafer control structure is in the data set representing the first chip; biasing the data set representing the kerf or a second chip distinct from the first chip, in the case that the wafer control structure is in the data set representing the kerf or the second chip; simulating formation of the wafer control structure; determining whether the simulated wafer control structure complies with a target control structure; and iteratively adjusting an exposure dose condition in the case that the simulated wafer control structure does not comply with the target control structure.

Claims

1. A computer-implemented method of accounting for photomask deviations in a lithographic process during optical proximity correction verification, the method comprising:

identifying a wafer control structure in a data set representing one of a first chip or a kerf;

biasing the data set representing the first chip if the wafer control structure is in the data set representing the first chip;

biasing the data set representing the kerf or a second chip distinct from the first chip, if the wafer control structure is in the data set representing the kerf or the second chip;

simulating formation of the wafer control structure;

determining whether the simulated wafer control structure complies with a target control structure; and

iteratively adjusting an exposure dose condition if the simulated wafer control structure does not comply with the target control structure.

2. The computer-implemented method of claim 1, further comprising running the optical proximity correction verification on the simulated wafer control structure using the adjusted exposure dose condition and one of the biased data set representing the first chip and the biased data set representing the kerf or the second chip.

3. The computer-implemented method of claim 1, wherein the simulated wafer control structure complies with the target control structure if the simulated wafer control structure is within a predetermined tolerance band of the target control structure.

4. The computer-implemented method of claim 1, further comprising:

measuring a mask control structure prior to the identifying a wafer control structure; and

creating a map of differences between the mask control structure and a target mask control structure after the measuring of the mask control structure.

5. The computer-implemented method of claim 4, wherein the biasing the data set representing the kerf or the second chip is performed using the map of the differences between the mask control structure and the target mask control structure.

6. The computer-implemented method of claim 4, wherein the biasing the data set representing the first chip or biasing a data set representing a subset of the first chip, is performed using the map of the differences between the mask control structure and the target mask control structure.

7. The computer-implemented method of claim 4, further comprising biasing a region around the wafer control structure based upon the map of the differences between the mask control structure and the target mask control structure.

8. The computer-implemented method of claim 1, further comprising running the optical proximity correction verification on the simulated wafer control structure using the adjusted exposure dose condition and one of the biased data set representing the first chip and the biased data set representing the kerf or the second chip.

9. The computer-implemented method of claim 1, wherein the simulated wafer control structure complies with the target control structure if the simulated wafer control structure is within a predetermined tolerance band of the target control structure.

10. The computer-implemented method of claim 1, further comprising:

measuring a mask control structure prior to the identifying a wafer control structure; and

creating a map of differences between the mask control structure and a target mask control structure after the measuring a mask control structure.

11. The computer-implemented method of claim 10, wherein the biasing the data set representing the kerf or the second chip is performed using the map of the differences between the mask control structure and the target mask control structure;

and the biasing the data set representing the first chip is performed using the map of the differences between the mask control structure and the target mask control structure.

12. The computer-implemented method of claim 10, further comprising biasing a region around the wafer control structure based upon the map of the differences between the mask control structure and the target mask control structure.

13. A computer system comprising:

at least one computing device configured to account for photomask deviations in a lithographic process during optical proximity correction verification by performing actions comprising;

identifying a wafer control structure in a data set representing one of a first chip or a kerf;

biasing the data set representing the first chip if the wafer control structure is in the data set representing the first chip;

biasing the data set representing the kerf or a second chip distinct from the first chip, if the wafer control structure is in the data set representing the kerf or the second chip;

simulating formation of the wafer control structure;

determining whether the simulated wafer control structure complies with a target control structure; and

iteratively adjusting an exposure dose condition if the simulated wafer control structure does not comply with the target control structure.

14. The computer system of claim 13, further comprising running the optical proximity correction verification on the simulated wafer control structure using the adjusted exposure dose condition and one of the biased data set representing the first chip and the biased data set representing the kerf or the second chip.

15. The computer system of claim 13, wherein the simulated wafer control structure complies with the target control structure if the simulated wafer control structure is within a predetermined tolerance band of the target control structure.

16. The computer system of claim 13, further comprising:

measuring a mask control structure prior to the identifying of a wafer control structure; and

creating a map of differences between the mask control structure and a target mask control structure after the measuring of a mask control structure.

17. The computer system of claim 16, wherein the biasing the data set representing the kerf or the second chip is performed using the map of the differences between the mask control structure and the target mask control structure.

18. The computer system of claim 16, wherein the biasing the data set representing the first chip or biasing a data set representing a subset of the first chip is performed using the map of the differences between the mask control structure and the target mask control.

19. The computer system of claim 16, further comprising biasing a region around the wafer control structure based upon the map of the differences between the mask control structure and the target mask control structure.

20. A computer program comprising program code embodied in at least one non-transitory computer-readable medium, which when executed, enables a computer system to account for photomask deviations in a lithographic process during optical proximity correction verification, the method comprising:

identifying a wafer control structure in a data set representing one of a first chip or a kerf;

biasing the data set representing the first chip if the wafer control structure is in the data set representing the first chip;

biasing the data set representing the kerf or a second chip distinct from the first chip, if the wafer control structure is in the data set representing the kerf or the second chip;

simulating formation of the wafer control structure;

determining whether the simulated wafer control structure complies with a target control structure; and

iteratively adjusting an exposure dose condition if the simulated wafer control structure does not comply with the target control structure.