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Interconnectable circuit boards

DC
  • US 8,500,456 B1
  • Filed: 07/26/2011
  • Issued: 08/06/2013
  • Est. Priority Date: 03/18/2008
  • Status: Active Grant
First Claim
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1. An interconnectable circuit board, comprising:

  • a distal end having a first electrically conductive pad located on a top of the circuit board;

    a plated through hole on the conductive pad which passes through a conductive layer of the circuit board and an insulative layer of the circuit board;

    a second electrically conductive pad located on the bottom of the circuit board and coupled to the plated through hole; and

    a proximal end having a third electrically conductive pad attached to the top of the circuit board;

    further comprising an adhesive material; and

    an underlying support structure;

    wherein the circuit board is attached to the underlying support structure with the adhesive material.

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