Interconnectable circuit boards
DCFirst Claim
1. An interconnectable circuit board, comprising:
- a distal end having a first electrically conductive pad located on a top of the circuit board;
a plated through hole on the conductive pad which passes through a conductive layer of the circuit board and an insulative layer of the circuit board;
a second electrically conductive pad located on the bottom of the circuit board and coupled to the plated through hole; and
a proximal end having a third electrically conductive pad attached to the top of the circuit board;
further comprising an adhesive material; and
an underlying support structure;
wherein the circuit board is attached to the underlying support structure with the adhesive material.
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Accused Products
Abstract
In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.
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Citations
15 Claims
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1. An interconnectable circuit board, comprising:
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a distal end having a first electrically conductive pad located on a top of the circuit board; a plated through hole on the conductive pad which passes through a conductive layer of the circuit board and an insulative layer of the circuit board; a second electrically conductive pad located on the bottom of the circuit board and coupled to the plated through hole; and a proximal end having a third electrically conductive pad attached to the top of the circuit board; further comprising an adhesive material; and an underlying support structure; wherein the circuit board is attached to the underlying support structure with the adhesive material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An apparatus for connecting circuit boards, comprising:
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a first circuit board having a first electrically conductive pad located on a top of the first circuit board; a plated through hole on the first conductive pad which passes through the circuit board; a second electrically conductive pad coupled to the plated through hole located on a bottom of the first circuit board; and a second circuit board having a third electrically conductive pad on a top of the second circuit board, wherein the first circuit board can be placed upon the second circuit board with the second conductive pad and third conductive pad aligned to create an electrical connection between the first circuit board and the second circuit board; further comprising an adhesive material disposed under the first and second circuit boards. - View Dependent Claims (10, 11, 12)
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13. An interconnectable circuit board, comprising:
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a first electrically conductive pad located on a top of the circuit board; a plated through hole on the conductive pad which passes through the circuit board; and a second electrically conductive pad coupled to the plated through hole;
the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board;further comprising an adhesive material disposed under the first and second interconnectable circuit boards. - View Dependent Claims (14, 15)
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Specification