Interconnectable circuit boards

• US 8,500,456 B1
• Filed: 07/26/2011
• Issued: 08/06/2013
• Est. Priority Date: 03/18/2008
• Status: Active Grant

• Current Assignee: MetroSpec Technology LLC
• Original Assignee: MetroSpec Technology LLC
• Inventors: Holec, Henry V., Crandell, Wm. Todd
• Primary Examiner(s): Prasad, Chandrika
• Application Number:
  US13/190,639
• Time in Patent Office: 742 Days
• Field of Search: 439/65, 439/67
• US Class Current: 439/65
• CPC Class Codes: F21Y 2107/30 on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01R 12/00 Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures printed connections to, or between, printed circuits H05K1/11
• CPC Class Codes: H01R 12/523 by an interconnection through aligned holes in the boards or multilayer board
• CPC Class Codes: H01R 13/717 with built-in light source
• CPC Class Codes: H01R 4/02 Soldered or welded connections H01R4/625, H01R4/723, H01R12/59 take precedence
• CPC Class Codes: H05K 1/0266 Marks, test patterns or identification means
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 1/0292 having a modifiable lay-out, i.e. adapted for engineering changes or repair H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/0293 Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/11 Printed elements for providing electric connections to or between printed circuits
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 1/14 Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence
• CPC Class Codes: H05K 2201/041 Stacked PCBs, i.e. having neither an empty space nor mounted components in between
• CPC Class Codes: H05K 2201/09481 Via in pad; Pad over filled via
• CPC Class Codes: H05K 2201/09918 Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2201/2027 : Guiding means, e.g. for guiding flexible circuits
• CPC Class Codes: H05K 2203/0228 : Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 3/0061 : onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/363 : by soldering

Abstract

In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.

Claims

1. An interconnectable circuit board, comprising:

a distal end having a first electrically conductive pad located on a top of the circuit board;

a plated through hole on the conductive pad which passes through a conductive layer of the circuit board and an insulative layer of the circuit board;

a second electrically conductive pad located on the bottom of the circuit board and coupled to the plated through hole; and

a proximal end having a third electrically conductive pad attached to the top of the circuit board;

further comprising an adhesive material; and

an underlying support structure;

wherein the circuit board is attached to the underlying support structure with the adhesive material.

2. The circuit board of claim 1, further comprising circuit paths electrically coupling the electrically conductive pads to provide electrical interconnectivity between the circuit board and a second circuit board.

3. The circuit board of claim 1, further comprising a fourth conductive pad for electrically receiving electronic components.

4. The circuit board of claim 1, wherein the insulative layer is sandwiched between the conductive layer and a second conductive layer.

5. The interconnectable circuit board of claim 1, the adhesive material comprising an adhesive tape.

6. The interconnectable circuit board of claim 1, the underlying support structure comprising a structure selected from the group consisting of a chassis, enclosure, and heat sink.

7. The interconnectable circuit board of claim 1, wherein the underlying support structure has a curving surface.

8. The interconnectable circuit board of claim 1, wherein the underlying support structure has a flexibility sufficient to assume a curved configuration.

9. An apparatus for connecting circuit boards, comprising:

a first circuit board having a first electrically conductive pad located on a top of the first circuit board;

a plated through hole on the first conductive pad which passes through the circuit board;

a second electrically conductive pad coupled to the plated through hole located on a bottom of the first circuit board; and

a second circuit board having a third electrically conductive pad on a top of the second circuit board, wherein the first circuit board can be placed upon the second circuit board with the second conductive pad and third conductive pad aligned to create an electrical connection between the first circuit board and the second circuit board;

further comprising an adhesive material disposed under the first and second circuit boards.

10. The apparatus for connecting circuit boards of claim 9, wherein the first and second circuit boards can be coupled at any angle.

11. The apparatus for connecting circuit boards of claim 9, further comprising a fourth conductive pad on the first circuit board for electrically receiving electronic components.

12. The apparatus for connecting circuit boards of claim 9, wherein the first and second circuit boards can be coupled together with solder.

13. An interconnectable circuit board, comprising:

a first electrically conductive pad located on a top of the circuit board;

a plated through hole on the conductive pad which passes through the circuit board; and

a second electrically conductive pad coupled to the plated through hole;

the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board;

further comprising an adhesive material disposed under the first and second interconnectable circuit boards.

14. The circuit board of claim 13, wherein the circuit board can be cut with scissors.

15. The circuit board of claim 13, wherein the circuit board can be cut to any desired length, size and shape.