Process and system for quality management and analysis of via drilling
First Claim
1. A process for laser drilling blind vias in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry, comprising:
- before blind via drilling, evaluating a relationship between a capture pad geometry value within a predetermined distance from a drilling location of a capture pad with respect to a blind via geometry value for a blind via to be drilled at the drilling location; and
setting at least one laser operating parameter based on a result of the evaluation in order to obtain a desired capture pad appearance after blind via drilling, wherein the desired capture pad appearance is a subjective surface texture of the capture pad after blind via drilling.
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Accused Products
Abstract
A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in at least one layer of a circuit substrate, evaluating a capture pad geometry value (such as area and/or volume) within a predetermined distance from a drilling location with respect to a blind via geometry value (such as area and/or volume) to be formed at the drilling location. The process can include setting at least one laser operating parameter based on the evaluation in order to obtain a desired capture pad appearance after blind via formation. The process can include imaging a capture pad area defined as an area within a predetermined distance from a blind via drilling location in at least one layer of a circuit substrate, quantifying at least one appearance value for the imaged capture pad area, and determining an acceptability of the imaged capture pad areas based on the quantified appearance value.
69 Citations
19 Claims
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1. A process for laser drilling blind vias in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry, comprising:
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before blind via drilling, evaluating a relationship between a capture pad geometry value within a predetermined distance from a drilling location of a capture pad with respect to a blind via geometry value for a blind via to be drilled at the drilling location; and setting at least one laser operating parameter based on a result of the evaluation in order to obtain a desired capture pad appearance after blind via drilling, wherein the desired capture pad appearance is a subjective surface texture of the capture pad after blind via drilling. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry, comprising:
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before blind via drilling and for at least one blind via to be drilled in at least one layer of a circuit substrate, evaluating a capture pad geometry value within a predetermined distance from a drilling location with respect to a blind via geometry value to be drilled at the drilling location; and setting at least one laser operating parameter based on a result of the evaluation in order to obtain a desired capture pad appearance after blind via drilling; and analyzing a capture pad appearance after blind via drilling, wherein analyzing the capture pad appearance after blind via drilling comprises; imaging a capture pad area defined as an area within a predetermined distance from a blind via drilling location in at least one layer of a circuit substrate; quantifying an appearance value for the imaged capture pad area as a numerical appearance value indicative of a subjective quality judgment of the imaged capture pad area; and determining acceptability of the imaged capture pad area based on the quantified appearance value; and
wherein quantifying the appearance value comprises;performing a fractal dimension analysis on the imaged capture pad area to obtain the numerical appearance value as a fractal dimension, wherein a level of the numerical appearance value corresponds to a subjective surface texture for the imaged capture pad area.
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19. A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry, comprising:
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before blind via drilling and for at least one blind via to be drilled in at least one layer of a circuit substrate, evaluating a capture pad geometry value within a predetermined distance from a drilling location with respect to a blind via geometry value to be drilled at the drilling location; setting at least one laser operating parameter based on a result of the evaluation in order to obtain a desired capture pad appearance after blind via drilling; and analyzing a capture pad appearance after blind via drilling, wherein analyzing the capture pad appearance after blind via drilling comprises; imaging a capture pad area defined as an area within a predetermined distance from a blind via drilling location in at least one layer of a circuit substrate; quantifying an appearance value for the imaged capture pad area as a numerical appearance value indicative of a subjective quality judgment of the imaged capture pad area; and determining acceptability of the imaged capture pad area based on the quantified appearance value; and
wherein quantifying the appearance value comprises;performing a histogram analysis on the imaged capture pad area to obtain the numerical appearance value as a symmetry between populations in the histogram, wherein the symmetry corresponds to a subjective surface texture for the imaged capture pad area.
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Specification