Method and apparatus for controlling the temperature of molds, dies, and injection barrels using fluid media

• US 8,501,060 B2
• Filed: 02/13/2007
• Issued: 08/06/2013
• Est. Priority Date: 02/14/2005
• Status: Active Grant

• Current Assignee: Moldcool International, LLC
• Original Assignee: Moldcool International, LLC
• Inventors: Johnson, Kenneth E.
• Primary Examiner(s): Jules, Frantz
• Assistant Examiner(s): ABDUR RAHIM, AZIM
• Application Number:
  US12/278,579
• Publication Number:
  US 20090174101A1
• Time in Patent Office: 2,366 Days
• Field of Search: 621/85, 622/01, 623/10, 623/06, 623/07, 621/71, 623/04, 625/02, 623/35, 62/79, 621/75, 236/46.F, 236/78.D, 165/263, 165/293, 700/202, 264/40.6, 264/519, 264/328.16, 264/328.14, 374 29- 33, 374 39- 40, 374/100, 374/141, 374/135, 374/137, 374/143, 374/165, 261/DIG.75
• US Class Current: 264/40.6
• CPC Class Codes: B29C 2945/76545 Flow rate
• CPC Class Codes: B29C 2945/76782 temperature control fluids
• CPC Class Codes: B29C 35/007 Tempering units for temperature control of moulds or cores, e.g. comprising heat exchangers, controlled valves, temperature-controlled circuits for fluids B29C35/0294 takes precedence
• CPC Class Codes: B29C 45/7306 Control circuits therefor
• CPC Class Codes: G05D 23/1919 characterised by the type of controller

Abstract

For controlling temperature in the molding of plastics, metal, ceramic, or die-casting, a circulator supporting a molding machine includes a fixed displacement pump driven by an electronic servo motor for volumetric metering of thermal fluid to or from the molding machine. A pre-set or dynamically controlled volume and flow rate profile matches the heating and cooling requirement of a molding machine and process. Volumetric metering may be based on parameters such as time, machine cycle status, temperature, pressure, and/or flow rate. Fluid may be circulated through the mold at positive or negative pressure at fixed, variable, or pulsed flow. The supply side in a fluid loop may be restricted so as to cause a pressure drop in or upstream of the mold, die or barrel, and seed bubbles may be injected into the fluid flow to excite vaporization and lowering of the fluid temperature.

Claims

1. A temperature control liquid circulator system configured for circulating a temperature control liquid through a process that includes a mold, die or barrel, the temperature control liquid circulator system comprising:

a liquid control loop comprising a liquid supply line plumbed to an inlet side of a cooling cavity associated with said mold, die or barrel and a liquid return line plumbed to an outlet side of said cooling cavity;

a pump disposed in said liquid control loop whereby the temperature control liquid is advanced from said liquid return line into said liquid supply line and through said cooling cavity;

an inline restriction to liquid flow in said liquid control loop, the restriction being configured to lower a pressure of said temperature control liquid in said cooling cavity below ambient pressure and below the vapor pressure of the temperature control liquid in the cooling cavity; and

a gas injector connected to a gas source and coupled to said liquid control loop, said gas injector being configured for introducing seed bubbles of gas into said liquid flow at a location in said liquid flow that will cause the seed bubbles to initiate boiling of the temperature control liquid at a desired location in the cooling cavity even if the temperature control liquid is depleted of dissolved air and would otherwise be subject to delayed boiling.

2. The liquid circulator system of claim 1, wherein the pump is a positive displacement pump that meters the temperature control liquid in exact quantities in proportion to a speed at which the positive displacement pump is driven, the positive displacement pump being driven by a motor having a programmable and controllable speed which is independent of variations in line voltage.

3. The liquid circulator system of claim 1, further comprising at least one liquid temperature sensor connected to said control system.

4. The liquid circulator system of claim 1, further comprising means for restoring the temperature of said temperature control liquid exiting said cooling cavity to the temperature of said temperature control liquid entering said cooling cavity.

5. The fluid circulator system of claim 4, said liquid circulator system being a closed loop type circulator, said means for changing the temperature of said temperature control liquid comprising a heat exchanger, one side of which is disposed in said control loop, the other side of which is connected to a chiller system.

6. The fluid circulator system of claim 4, said liquid circulator system being a direct injection type circulator, said means for changing the temperature of said temperature control liquid comprising a direct injection valve disposed in said control loop and connected to a source of thermally conditioned make-up liquid.

7. The liquid circulator system of claim 4, said means for changing the temperature of said temperature control liquid comprising an in-line heater disposed in said control loop.

8. The liquid circulator system of claim 1, further comprising a gas extractor in the circulation loop.

15. The liquid circulator system of claim 1, wherein the pump is disposed proximate to the outlet side of the cooling cavity and the inline restriction to fluid flow is disposed proximate to the inlet side of the cooling cavity, so that the thermal control liquid is drawn through the cooling cavity at a lower-than-ambient pressure that inhibits fluid leakage from the cooling cavity.

16. The liquid circulator system of claim 1, wherein the inline restriction is variable under control of a digital control system.

17. The liquid circulator system of claim 1, wherein the gas injector is variable.

9. A method of controlling the temperature of a mold, die, or barrel of a process, the method comprising:

advancing a temperature control liquid at a first temperature in a temperature control loop into a cooling cavity of the mold, die, or barrel by means of a pump, said cooling cavity being configured with respect to said mold, die, or barrel with means for transferring thermal energy between said temperature control liquid and said mold, die, or barrel while said liquid is present therein, thereby changing said first temperature of said temperature control liquid to a second temperature;

reducing a pressure of said temperature control liquid in the cooling cavity below ambient pressure and below the vapor pressure of the temperature control liquid in the cooling cavity; and

removing heat from the temperature control liquid in the cooling cavity by injecting seed bubbles into said temperature control liquid that induce boiling of the temperature control liquid at a desired location within the cooling cavity even if the temperature control liquid is depleted of dissolved air and would otherwise be subject to delayed boiling.

10. The method of controlling the temperature according to claim 9, further comprising:

further advancing said temperature control liquid at said second temperature out of the cooling cavity; and

restoring said temperature control liquid to substantially said first temperature.

11. The method of controlling the temperature according to claim 10, further comprising:

calculating a rate of advancing of said temperature control liquid based on differences in said first temperature and said second temperature.

12. The method of controlling the temperature according to claim 9, further comprising:

advancing said temperature control liquid with a delivery profile calculated to maintain a desired thermal profile for said mold, die or barrel.

13. The method of controlling the temperature according to claim 9, said pump being a positive displacement pump that meters the temperature control liquid in exact quantities in proportion to a speed at which the positive displacement pump is driven, said positive displacement pump being driven by a motor having a programmable and controllable speed which is independent of variations in line voltage.

14. The method of controlling the temperature according to claim 9, further comprising:

removing from said temperature control liquid gas from said seed bubbles injected into said temperature control liquid in said control loop.

18. The method of controlling the temperature of claim 9, wherein the pump is disposed proximate to an outlet side of the cooling cavity and an inline restriction to fluid flow is disposed proximate to an inlet side of the cooling cavity, so that the thermal control liquid is drawn through the cooling cavity at a lower-than-ambient pressure that inhibits fluid leakage from the cooling cavity.

19. The method of controlling the temperature of claim 9, wherein reducing the temperature of the temperature control liquid includes advancing the temperature control liquid through an inline restriction that is variable under control of a digital control system.

20. The method of controlling the temperature of claim 9, wherein the seed bubbles are injected into the temperature control liquid by a gas injector that is variable.