Manufacturing and processing polymer arrays

• US 8,501,122 B2
• Filed: 12/08/2010
• Issued: 08/06/2013
• Est. Priority Date: 12/08/2009
• Status: Active Grant

• Current Assignee: Affymetrix, Inc. (Thermo Fisher Scientific Incorporated)
• Original Assignee: Affymetrix, Inc. (Thermo Fisher Scientific Incorporated)
• Inventors: Shirazi, Mohsen
• Primary Examiner(s): Mui, Christine T
• Application Number:
  US12/963,593
• Publication Number:
  US 20110136699A1
• Time in Patent Office: 972 Days
• Field of Search: 422/553
• US Class Current: 422/553
• CPC Class Codes: B01J 2219/00317 Microwell devices, i.e. having large numbers of wells
• CPC Class Codes: B01J 2219/00702 Processes involving means for analysing and characterising the products
• CPC Class Codes: B01L 2200/0689 Sealing
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0636 Integrated biosensor, microarrays
• CPC Class Codes: B01L 2300/0829 Multi-well plates; Microtitration plates
• CPC Class Codes: B01L 3/5085 for multiple samples, e.g. microtitration plates
• CPC Class Codes: B01L 3/50855 using modular assemblies of strips or of individual wells
• CPC Class Codes: B01L 9/523 for multisample carriers, e.g. used for microtitration plates
• CPC Class Codes: B32B 2305/342 Chips
• CPC Class Codes: B32B 2457/14 Semiconductor wafers
• CPC Class Codes: C12Q 1/6837 using probe arrays or probe chips C12Q1/6874 takes precedence
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

The invention provides sensor plates, particularly plates having a plurality of sensors, and related methods for assembling such plates. The sensors can be arrays of probes, such as microarrays, including high density oligonucleotide microarrays. The methods include the steps of selecting a substrate having a plurality of sensors, aligning the substrate to a support plate, and attaching the substrate to the support plate. Moduled sensor plates, and methods of assembling such plates, are also provided. The moduled sensor plates can include a plurality of sensor plates, such as sensor or microarray strip plates, with each strip plate having an attachment feature that is used to attach the strip plate to a frame. The sensor plates and moduled sensor plates can be inserted into processing plates, including hybridization plates, washing plates, staining plates, and detection plates. The assembled plates of the invention find use in high throughput analysis of samples, particularly biological samples having nucleic acid analytes.

Claims

1. A method of assembling a sensor plate comprising:

selecting a substrate comprising a plurality of sensors, each sensor surrounded by a border region that does not comprise any sensors, each sensor comprising an array of probes, wherein the substrate has an active side from which the sensor probes are dipped in a reservoir of a processing plate and an inactive side for attachment to a support plate;

aligning the substrate relative to a support plate comprising structural elements; and

fixedly attaching the substrate to the support plate to form a sensor plate, wherein the structural elements of the support plate contact and support the inactive side of the substrate within the border regions surrounding the sensors, and wherein the attached substrate protrudes from the support plate to facilitate dipping the active side of the substrate into the reservoir of the processing plate.

2. The method according to claim 1, wherein the attaching step is a bonding step using a curable adhesive.

3. The method according to claim 2, wherein the adhesive is cured with a solid state narrow wavelength light source.

4. The method according to claim 3, wherein the light source is an LED.

5. The method according to claim 4, wherein the LED'"'"'s wavelength is from 430 nm to 480 nm.

6. The method according to claim 5, wherein the wavelength is approximately 455 nm.

7. The method according to claim 1, wherein the substrate is a wafer section.

8. The method according to claim 7, where the wafer section is produced by dicing an undiced wafer to fit onto the support plate.

9. The method according to claim 7, wherein each sensor is a microarray and the sensor plate is a microarray plate.

10. A method of assembling a moduled sensor plate comprising:

assembling a plurality of sensor plates according to claim 1, wherein each support plate further comprises at least one attachment feature;

providing a frame, wherein the frame comprises a plurality of corresponding attachment features; and

attaching the plurality of sensor plates to the frame by engaging the at least one attachment feature on each support plate to a corresponding attachment feature on the frame so as to produce a moduled sensor plate.

11. The method according to claim 9, wherein the microarray plate is a microarray strip plate.

12. A method of assembling a microarray plate comprising a plurality of microarray strip plates, the method comprising:

assembling a plurality of microarray strip plates according to claim 11, wherein each microarray strip plate comprises at least one strip plate-to-frame attachment feature;

providing a frame, wherein the frame comprises a plurality of frame-to-strip plate attachment features; and

attaching the plurality of microarray strip plates to the frame by matching the at least one strip plate-to-frame alignment feature on each microarray strip plate to a frame-to-strip plate alignment feature on the frame to produce a microarray plate.

13. The method of claim 1, wherein the edges of the substrate are used to align the substrate to the support plate.

14. The method of claim 1, wherein the support plate further comprises at least one alignment feature that guides the aligning of the substrate with the support plate.

15. The method of claim 14, wherein the alignment feature is selected from the group consisting of a hole, a post, a raised edge, and an indentation.

16. The method of claim 1, wherein the support plate structural elements are ridges or walls.

17. The method of claim 1 further comprising:

providing the processing plate; and

inserting the assembled sensor plate into the processing plate.

18. The method of claim 17, wherein the processing plate includes a sealing surface that supports the border surrounding each sensor on the active side of the substrate.

19. The method of claim 17, wherein the processing plate includes a clamping feature.

20. The method of claim 12 further comprising:

providing the processing plate; and

inserting the assembled microarray plate into the processing plate.

21. The method of claim 20, wherein the processing plate includes a sealing surface that supports the border surrounding each microarray on the active side of the wafer section.

22. The method of claim 20, wherein the processing plate includes a clamping feature.