Laminate

• US 8,501,305 B2
• Filed: 01/16/2008
• Issued: 08/06/2013
• Est. Priority Date: 01/16/2007
• Status: Active Grant

• Current Assignee: Agilent Technologies, Inc.
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Barlow, David
• Primary Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US12/523,496
• Publication Number:
  US 20100068477A1
• Time in Patent Office: 2,029 Days
• Field of Search: 428/209, 428/901, 428/200, 428/201, 428/320.2, 428/339, 264/35, 264/467, 264/614
• US Class Current: 428/200
• CPC Class Codes: B32B 2307/31 Heat sealable
• CPC Class Codes: B32B 2323/04 Polyethylene
• CPC Class Codes: B32B 2323/10 Polypropylene
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/32 comprising polyolefins comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30
• CPC Class Codes: B32B 7/02 Physical, chemical or physicochemical properties
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/24843 with heat sealable or heat releasable adhesive layer
• CPC Class Codes: Y10T 428/24851 Intermediate layer is discontinuous or differential
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/24942 including components having same physical characteristic in differing degree
• CPC Class Codes: Y10T 428/249994 Composite having a component wherein a constituent is liquid or is contained within preformed walls [e.g., impregnant-filled, previously void containing component, etc.]
• CPC Class Codes: Y10T 428/269 including synthetic resin or polymer layer or component

Abstract

The present invention relates to laminate comprising a first thermoplastic polymer layer with a first melt flow index, adjacent a thermoplastic polymer second layer with a second melt flow index, the first and second layer comprising the same thermoplastic polymer, characterized in that the first melt flow index is lower than the second melt flow index. The invention also relates to a microfluidic device comprising the laminate and a method for incorporating an ink pattern in the laminate.

Claims

1. A laminate comprising a first thermoplastic polymer layer with a first melt flow index, adjacent a second thermoplastic polymer layer with a second melt flow index, the first and second thermoplastic polymer layers comprising the same type of thermoplastic polymer having different melt flow index, wherein the first melt flow index at a given temperature and pressure is lower than the second melt flow index at the same temperature and pressure, wherein a surface of the first thermoplastic polymer layer is heat-bonded to a surface of the second thermoplastic polymer layer, and wherein the first thermoplastic polymer layer comprises an ink pattern on the surface heat bonded to the second thermoplastic polymer layer.

2. The laminate according to claim 1, wherein the thermoplastic polymer is polyethylene.

3. The laminate according to claim 2, wherein the ink pattern forms an electrode circuit on the surface of the first thermoplastic polymer layer adjacent the second thermoplastic polymer layer.

4. The laminate according to claim 1, wherein the thermoplastic polymer is polypropylene.

5. The laminate according to claim 4, wherein the ink pattern forms an electrode circuit on the surface of the first thermoplastic polymer layer adjacent the second thermoplastic polymer layer.

6. A microfluidic device comprising a laminate according to claim 1.

7. A method for incorporating an ink pattern in a laminate comprising:

providing a first thermoplastic polymer layer with a first melt flow index;

applying the ink pattern onto a surface of the first thermoplastic polymer layer,

bonding said surface with a second thermoplastic polymer layer with a second melt flow index;

the first and second thermoplastic polymer layers comprising the same type of thermoplastic polymer having different melt flow index, wherein the first melt flow index is lower than the second melt flow index,

wherein the ink pattern does not distort, crack or break after the bonding step.

8. The method according to claim 7, wherein the surface of the first thermoplastic polymer layer is bonded to the second thermoplastic polymer layer by application of heat.

9. The method according to claim 8, wherein the heat applied is a sealing temperature of the thermoplastic polymer.

10. The method according to claim 7, wherein the bonding step is carried out under pressure.

11. The method according to claim 7, wherein the ink is conductive.

12. The method according to claim 11, wherein the ink pattern forms an electrode.