Capacitor, semiconductor device and manufacturing method thereof
First Claim
Patent Images
1. A semiconductor device comprising:
- a first substrate;
a thin film transistor over the first substrate, comprising a wiring electrically connected to an active layer of the thin film transistor;
an interlayer insulating film over the wiring, having a contact hole;
a pixel electrode over the interlayer insulating film, electrically connected to the wiring via the contact hole;
a conductive layer over the interlayer insulating film adjacent to the pixel electrode with an insulating layer therebetween;
a spacer over the interlayer insulating film; and
a second substrate over the spacer,wherein the spacer overlaps the contact hole.
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Abstract
A highly reliable capacitor, a semiconductor device having high operating performance and reliability, and a manufacturing method thereof are provided. A capacitor formed of a first conductive film 102, a dielectric 103 made of an insulating material, and a second conductive film 104 is characterized in that a pin hole 106 formed by chance in the dielectric 103 is filled up with an insulating material (filler) 107 made of a resin material. This can prevent short circuit between the first conductive film 102 and the second conductive film 104. The capacitor is used as a storage capacitor provided in a pixel of a semiconductor device.
127 Citations
35 Claims
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1. A semiconductor device comprising:
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a first substrate; a thin film transistor over the first substrate, comprising a wiring electrically connected to an active layer of the thin film transistor; an interlayer insulating film over the wiring, having a contact hole; a pixel electrode over the interlayer insulating film, electrically connected to the wiring via the contact hole; a conductive layer over the interlayer insulating film adjacent to the pixel electrode with an insulating layer therebetween; a spacer over the interlayer insulating film; and a second substrate over the spacer, wherein the spacer overlaps the contact hole. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A semiconductor device comprising:
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a first substrate; a thin film transistor over the first substrate, comprising an active layer comprising a channel forming region; an interlayer insulating film over the thin film transistor, having a contact hole; a pixel electrode over the interlayer insulating film, electrically connected to the active layer via the contact hole; a conductive layer adjacent to the pixel electrode with an insulating layer therebetween; a spacer over the interlayer insulating film, comprising a resin material; and a second substrate over the spacer, wherein the spacer overlaps the contact hole, and wherein the conductive layer at least partly overlaps the channel forming region. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A semiconductor device comprising:
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a first substrate; a thin film transistor over the first substrate, comprising an active layer comprising a channel forming region; a first interlayer insulating film over the thin film transistor, having a first contact hole; a second interlayer insulating film over the first interlayer insulating film, having a second contact hole; a pixel electrode over the second interlayer insulating film, electrically connected to the active layer via the first contact hole and the second contact hole; a conductive layer adjacent to the pixel electrode with an insulating layer therebetween; a spacer over the second interlayer insulating film, comprising a resin material; and a second substrate over the spacer, wherein the spacer overlaps the second contact hole, and wherein the conductive layer at least partly overlaps the channel forming region. - View Dependent Claims (16, 17, 18, 19, 20, 21)
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22. A semiconductor device comprising:
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a first substrate; a thin film transistor over the first substrate, comprising an active layer comprising a channel forming region; a first interlayer insulating film over the thin film transistor, having a first contact hole; a wiring over the first interlayer insulating film, electrically connected to the active layer via the first contact hole; a second interlayer insulating film over the first interlayer insulating film, having a second contact hole; a pixel electrode over the second interlayer insulating film, electrically connected to the wiring via the second contact hole; a conductive layer adjacent to the pixel electrode with an insulating layer therebetween; a spacer over the second interlayer insulating film, comprising a resin material; and a second substrate over the spacer, wherein the spacer overlaps the second contact hole, and wherein the conductive layer at least partly overlaps the channel forming region. - View Dependent Claims (23, 24, 25, 26, 27, 28)
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29. A semiconductor device comprising:
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a first substrate; a thin film transistor over the first substrate, comprising a wiring electrically connected to an active layer of the thin film transistor; an interlayer insulating film over the wiring, having a contact hole; a conductive layer over the interlayer insulating film; a pixel electrode over the conductive layer with an insulating layer therebetween, electrically connected to the wiring via the contact hole;
a spacer over the interlayer insulating film, comprising a resin material; anda second substrate over the spacer, wherein the spacer overlaps the contact hole. - View Dependent Claims (30, 31, 32, 33, 34, 35)
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Specification