Method of integrating an identification circuit into a data medium
First Claim
Patent Images
1. Method for integrating an identification circuit in a data medium formed by at least one dielectric substrate covered by a conductive layer, the conductive layer having a part receiving data and a part without data, the method comprising the steps of:
- etching in the part without data of the conductive layer on a first length L less than a perimeter of said part without data, at least a radiating slot forming an antenna, said first length L determining a resonating frequency, andcoupling an integrated circuit to the radiating slot and positioning said integrated circuit on said radiating slot, at a second length L′
from an end of said first length L, said second length L′
being selected to optimize an impedance of the radiating slot.
4 Assignments
0 Petitions
Accused Products
Abstract
The present invention relates to a method for integrating an identifier circuit in a data medium formed by at least one dielectric substrate covered by a conductive layer, the conductive layer comprising a part receiving data and a part without data. The method consists in etching in the part without data of the conductive layer, at least one resonating slot forming an antenna and coupling an integrated circuit to the slot.
-
Citations
9 Claims
-
1. Method for integrating an identification circuit in a data medium formed by at least one dielectric substrate covered by a conductive layer, the conductive layer having a part receiving data and a part without data, the method comprising the steps of:
-
etching in the part without data of the conductive layer on a first length L less than a perimeter of said part without data, at least a radiating slot forming an antenna, said first length L determining a resonating frequency, and coupling an integrated circuit to the radiating slot and positioning said integrated circuit on said radiating slot, at a second length L′
from an end of said first length L, said second length L′
being selected to optimize an impedance of the radiating slot. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A data medium formed by at least one dielectric substrate covered by a conductive layer, the conductive layer having a part receiving data and a part without data;
-
wherein the part without data of the conductive layer comprises etching on a first length L less than a perimeter of said part without data, at least a radiating slot forming an antenna, said first length L determining a resonating frequency; and an integrated circuit coupled to said radiating slot and positioned on said radiating slot at a second length L′
from an end of said first length L, said second length L′
being selected to optimize an impedance of the radiating slot.
-
Specification