Semiconductor device with a zigzag radiator

• US 8,503,181 B2
• Filed: 08/27/2009
• Issued: 08/06/2013
• Est. Priority Date: 08/28/2008
• Status: Active Grant

• Current Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Original Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Inventors: Osada, Hiroshi, Miyachi, Yukio, Nakajima, Kiyofumi
• Primary Examiner(s): Edmonds, Lisa Lea
• Assistant Examiner(s): Cunningham, Xanthia C
• Application Number:
  US13/059,664
• Publication Number:
  US 20110134608A1
• Time in Patent Office: 1,440 Days
• Field of Search: None
• US Class Current: 361/709
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 25/071 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]

Abstract

A semiconductor apparatus 10 includes a radiator 30 on which plural semiconductor modules 20 that include semiconductor elements 21 are mounted, the semiconductor apparatus 10 characterized by the radiator 30 including a first main surface 30B and a second main surface 30C configured to be located on the opposite side of the first main surface 30B. Semiconductor module mount-surfaces 30B1, 30B2, 30C1, 30C2 are arranged in the first main surface 30B and the second main surface 30C in a zigzag pattern in cross-sectional view; and the semiconductor modules 20 are mounted onto some or all of the semiconductor module mount-surfaces 30B1, 30B2, 30C1, 30C2.

Claims

1. A semiconductor apparatus comprising:

a radiator on which a plurality of semiconductor modules are mounted, each of the semiconductor modules include semiconductor elements;

the radiator including a first main surface and a second main surface opposite the first main surface, wherein semiconductor module mount-surfaces are arranged in the first main surface and the second main surface in a zigzag pattern in cross-sectional view; and

wherein the semiconductor modules are mounted only onto the semiconductor module mount-surfaces located in bottom surfaces of concave portions of the first main surface in cross-sectional view, or mounted only onto the semiconductor module mount-surfaces located in bottom surfaces of concave portions of the second main surface in cross-sectional view.

2. The semiconductor apparatus according to claim 1, wherein a cross-sectional shape of the radiator is almost symmetrical about a point.

3. The semiconductor apparatus according to claim 1, wherein a volume of one side of a stress-neutral plane of the radiator is almost equal to a volume of the other side of the stress-neutral plane of the radiator.

4. The semiconductor apparatus according to claim 1, wherein the semiconductor module mount-surfaces are formed periodically.

5. The semiconductor apparatus according to claim 1, wherein shapes of boundaries between the concave portions of the first main surfaces and the second main surfaces in cross-sectional view, and the convex portions located adjacent to the concave portions in cross-sectional view are step-like shapes.

6. The semiconductor apparatus according to claim 1, wherein the semiconductor module includes the semiconductor element, an insulated substrate, a radiator plate and bonding material configured to be bonded therebetween.

7. The semiconductor apparatus according to claim 6, wherein the bonding materials are constituted of solder or braze.

8. A semiconductor apparatus comprising:

a radiator on which a plurality of semiconductor modules are mounted, each of the semiconductor modules include semiconductor elements;

the radiator including a first main surface and a second main surface opposite the first main surface, wherein semiconductor module mount-surfaces are arranged in the first main surface and the second main surface in a zigzag pattern in cross-sectional view; and

wherein the semiconductor modules are mounted onto the semiconductor module mount-surfaces located in bottom surfaces of concave portions and the semiconductor module mount-surfaces located in top surfaces of convex portions of the first main surface in cross-sectional view, or mounted onto the semiconductor module mount-surfaces located in bottom surfaces of concave portions and the semiconductor module mount-surfaces located in top surfaces of convex portions of the second main surface in cross-sectional view.

9. A semiconductor apparatus comprising:

a radiator on which a plurality of semiconductor modules are mounted, each of the semiconductor modules include semiconductor elements;

the radiator including a first main surface and a second main surface opposite the first main surface, wherein semiconductor module mount-surfaces are arranged in the first main surface and the second main surface in a zigzag pattern in cross-sectional view; and

wherein the semiconductor modules are mounted onto the semiconductor module mount-surfaces located in bottom surfaces of concave portions of the first main surface in cross-sectional view, and mounted onto the semiconductor module mount-surfaces located in bottom surfaces of concave portions of the second main surface in cross-sectional view.