Monitoring systems and backplane for a monitoring system

• US 8,503,190 B2
• Filed: 05/18/2010
• Issued: 08/06/2013
• Est. Priority Date: 05/18/2010
• Status: Active Grant

• Current Assignee: Baker Hughes, a GE Company, LLC (Baker Hughes Company)
• Original Assignee: General Electric Company
• Inventors: Tart, Michael Alan, Summers, Sean Kelly, Shadel, Bryan James, Cohen, Mitchell Dean, Turnbeaugh, Lysle Rollan, Clemens, Steven Thomas
• Primary Examiner(s): Dinh, Tuan T
• Application Number:
  US12/782,029
• Publication Number:
  US 20110286186A1
• Time in Patent Office: 1,176 Days
• Field of Search: 361/788, 361796-803, 710300-310
• US Class Current: 361/788
• CPC Class Codes: G05B 23/0267 Fault communication, e.g. human machine interface [HMI]

Abstract

A first backplane for being electrically coupled to a second backplane, a system monitoring module, and at least one transducer monitoring module includes a system interface bus configured to be coupled to the system monitoring module and the second backplane. The intermediate backplane also includes at least one monitor interface bus configured to be coupled to the at least one transducer monitoring module and the second backplane and an intermediate backplane bus configured to be coupled to the at least one transducer monitoring module and the system monitoring module.

Claims

1. A monitoring system comprising:

at least one transducer configured to monitor an operating condition of at least one machine;

a first backplane configured to be coupled to said at least one transducer;

a second backplane configured to be coupled to said first backplane;

at least one transducer monitoring module configured to be coupled to said second backplane, said at least one transducer monitoring module further configured to process at least one signal received from said at least one transducer; and

a power supply module configured to couple to said second backplane, wherein said second backplane further comprises a power input bus configured to couple to said power supply module and to said first backplane, said power supply module further configured to provide power to said at least one transducer and to said at least one transducer monitoring module.

2. A monitoring system in accordance with claim 1, further comprising a system monitoring module configured to be coupled to said second backplane.

3. A monitoring system in accordance with claim 1, further comprising a housing, wherein said first backplane is positioned at least partially within said housing.

4. A monitoring system in accordance with claim 1, further comprising an electromagnetically shielded housing, wherein said second backplane is positioned within said electromagnetically shielded housing.

5. A monitoring system in accordance with claim 1, further comprising at least one interface board, said at least one interface board configured to be coupled to said second backplane and said first backplane.

6. A monitoring system in accordance with claim 1 wherein said second backplane further comprises a system backplane power bus configured to be coupled to said power supply module and said first backplane.

7. A monitoring system in accordance with claim 1, wherein said second backplane further comprises an intermediate backplane power bus configured to be coupled to said power supply module.

8. A monitoring system in accordance with claim 1, wherein said second backplane comprises a monitor interface bus configured to be coupled to said at least one transducer monitoring module and said first backplane.

9. A monitoring system in accordance with claim 1, further comprising:

a system monitoring module configured to be coupled to said second backplane; and

an intermediate backplane bus configured to be coupled to said system monitoring module and said at least one transducer monitoring module.

10. A monitoring system in accordance with claim 2, wherein said second backplane further comprises a system interface bus configured to be coupled to said system monitoring module and said first backplane.

11. A monitoring system comprising:

at least one transducer configured to monitor an operating condition of at least one machine;

a first backplane;

a second backplane configured to couple to said first backplane, said second backplane comprising a system interface, at least one monitor interface, and an intermediate backplane bus; and

a power supply module configured to couple to said second backplane, wherein said second backplane further comprises a power input bus configured to couple to said power supply module, said power supply module further configured to provide power to said at least one transducer.

12. A monitoring system in accordance with claim 11, further comprising at least one transducer monitoring module configured to couple to said second backplane.

13. A monitoring system in accordance with claim 11, further comprising at least one interface board configured to couple to said second backplane and said first backplane.

14. A monitoring system in accordance with claim 13, wherein said at least one interface board comprises:

a system interface board configured to couple to said system interface bus; and

at least one monitor interface board configured to couple to said at least one monitor interface bus.

15. A monitoring system in accordance with claim 14, wherein said at least one monitor interface bus comprises at least two monitor interface busses configured to couple to at least two transducer monitoring modules and said first backplane, said at least one monitor interface board configured to couple to said at least two monitor interface busses.