Method for manufacturing an on-chip BALUN transformer

• US 8,505,193 B2
• Filed: 05/16/2012
• Issued: 08/13/2013
• Est. Priority Date: 08/31/2004
• Status: Active Grant

• Current Assignee: Theta IP, LLC
• Original Assignee: Theta Microelectronics, Inc.
• Inventors: Papananos, Yannis
• Primary Examiner(s): Kim, Paul D
• Application Number:
  US13/473,368
• Publication Number:
  US 20120223176A1
• Time in Patent Office: 454 Days
• Field of Search: 295/921, 296/021, 29604-606, 336/65, 336/83, 336/200, 336206-208, 336/223, 336/232, 336/233
• US Class Current: 29/606
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/0086 on semiconductor substrate
• CPC Class Codes: H01F 2027/2809 on stacked layers
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H03H 2001/0064 comprising semiconductor material
• CPC Class Codes: H03H 7/42 Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49071 by winding or coiling
• CPC Class Codes: Y10T 29/49073 by assembling coil and core

Abstract

Integrated high frequency balanced-to-unbalanced transformers and inductors suitable for operation in high frequencies, such as radio frequencies. Embodiments disclosed give consideration to issues related to the layout of the top and bottom inductors for the minimization of capacitive effects between layers and methods of manufacturing thereof. The manufacturing process comprises forming of a first winding in a first metal layer; forming an insulating layer over at least the first metal layer; forming of a second winding in a second metal layer such that the second winding path has both a vertical and a horizontal displacement to the first conductive path, preferably with an overlap that is less than a full overlap; and forming shunts to ensure continuity of each of the first and second windings.

Claims

1. A method for manufacturing an on-chip BALUN transformer using a manufacturing process, the method comprising:

forming a first winding conductive path in a first metal layer wherein the forming a first winding conductive path further comprises;

forming an essentially symmetrical primary inductor comprising of a plurality of symmetrical windings, each winding ending with a metal segment on the first metal layer causing the next winding to be internal to the previous winding;

forming an insulator layer using an insulating material to insulate between said first metal layer and at least a subsequent metal layer;

forming a symmetrical second winding conductive path in a second metal layer over at least an insulating layer that insulates the second winding conductive path from at least the first winding conductive path, the second winding conductive path essentially placed in vertical and horizontal displacement with respect of a winding path of the first winding conductive path; and

,

forming shunts to ensure the continuity of each of the first winding conductive path and the second winding conductive path.

2. A method for manufacturing an on-chip BALUN transformer using a manufacturing process, the method comprising:

forming a first winding conductive path in a first metal layer wherein the forming a first winding conductive path further comprises;

forming a conductive path comprising of a plurality of winding segments wound symmetrically in the first metal layer, with at least shunts connecting the first metal layer winding segments at respective intersections in a third metal layer thereby forming an inductor;

forming an insulator layer using an insulating material to insulate between said first metal layer and at least a subsequent metal layer;

forming a symmetrical second winding conductive path in a second metal layer over at least an insulating layer that insulates the second winding conductive path from at least the first winding conductive path, the second winding conductive path essentially placed in vertical and horizontal displacement with respect of a winding path of the first winding conductive path; and

,

forming shunts to ensure the continuity of each of the first winding conductive path and the second winding conductive path.

3. A method for manufacturing an on-chip BALUN transformer using a manufacturing process, the method comprising:

forming a first winding conductive path in a first metal layer;

forming an insulator layer using an insulating material to insulate between said first metal layer and at least a subsequent metal layer;

forming a symmetrical second winding conductive path in a second metal layer over at least an insulating layer that insulates the second winding conductive path from at least the first winding conductive path, the second winding conductive path essentially placed in vertical and horizontal displacement with respect of a winding path of the first winding conductive path wherein the forming a second winding conductive path further comprises;

forming a conductive path comprising of a plurality of winding segments wound symmetrically in the second metal layer, with at least shunts connecting the second metal layer winding segments at respective intersections in a fourth metal layer thereby forming an inductor; and

,

forming shunts to ensure the continuity of each of the first winding conductive path and the second winding conductive path.

4. A method for manufacturing an on-chip BALUN transformer using a manufacturing process, the method comprising:

forming a first winding conductive path in a first metal layer;

forming an insulator layer using an insulating material to insulate between said first metal layer and at least a subsequent metal layer;

forming a symmetrical second winding conductive path in a second metal layer over at least an insulating layer that insulates the second winding conductive path from at least the first winding conductive path, the second winding conductive path essentially placed in vertical and horizontal displacement with respect of a winding path of the first winding conductive path;

forming shunts to ensure the continuity of each of the first winding conductive path and the second winding conductive path; and

,

forming the ports of the first winding conductive path one-hundred and eighty degrees from the ports of the second winding conductive path.

5. The method of claim 4 further comprising:

causing the displacement to essentially result in an overlap between the first winding conductive path and the second winding conductive path that does not exceed fifty percent of at least one of;

the width of the first winding conductive path, and the second winding conductive path.

6. The method of claim 4 further comprising:

causing the displacement to result in essentially no horizontal overlap between the first winding conductive path and the second winding conductive path while maintaining at least a magnetic coupling between the first winding conductive path and the second winding conductive path.