Die having a via filled with a heat-dissipating material
First Claim
Patent Images
1. A structure comprising:
- a die with at least one via within a semiconductor portion of the die, the via being proximate to a hot spot, the via being at least partially filled with a heat-dissipating material; and
the via being capable of absorbing heat from the hot spot.
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Abstract
A structure including a die with at least one via within a semiconductor portion of the die, the via being proximate to a hot spot. The via is at least partially filled with a heat-dissipating material and is also capable of absorbing heat from the hot spot.
87 Citations
6 Claims
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1. A structure comprising:
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a die with at least one via within a semiconductor portion of the die, the via being proximate to a hot spot, the via being at least partially filled with a heat-dissipating material; and the via being capable of absorbing heat from the hot spot. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification