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Die having a via filled with a heat-dissipating material

  • US 8,505,613 B2
  • Filed: 08/12/2011
  • Issued: 08/13/2013
  • Est. Priority Date: 01/11/2002
  • Status: Expired due to Term
First Claim
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1. A structure comprising:

  • a die with at least one via within a semiconductor portion of the die, the via being proximate to a hot spot, the via being at least partially filled with a heat-dissipating material; and

    the via being capable of absorbing heat from the hot spot.

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