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Metal coating, forming method thereof, and metal wiring

  • US 8,507,104 B2
  • Filed: 05/17/2006
  • Issued: 08/13/2013
  • Est. Priority Date: 05/30/2005
  • Status: Expired due to Fees
First Claim
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1. A metal coating formed by baking after applying a metal-nanoparticles-dispersed liquid onto a surface of a base material, the metal-nanoparticles-dispersed liquid being composed of metal nanoparticles, water, and a dispersant having a molecular weight of 2000-30000 and having a solid form at room temperature, wherein:

  • the metal coating has an average grain size of 0.2-5 μ

    m,the electrical resistivity of the metal coating is 20 μ

    Ω

    ·

    cm or less,the metal coating comprises;

    an alloy including Ag, at least one first metal selected from the group consisting of Au, Pt, Pd, Ru, and Ir, and at least one second metal selected from the group consisting of Sn, Cu, Ni Fe, Co, Ti and In,the content ratio of Ag being 90-99.9% by atomic percent in the total quantity of the alloy,the content ratio of the second metal is 0.1-2% by atomic percent in the total quantity of the alloy, andthe metal coating has an arithmetic mean roughness Ra of 100 nm or less.

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