Package 3D interconnection and method of making same

• US 8,508,045 B2
• Filed: 06/30/2011
• Issued: 08/13/2013
• Est. Priority Date: 03/03/2011
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Khan, Rezaur Rahman, Zhao, Sam Ziqun
• Primary Examiner(s): Williams, A O
• Application Number:
  US13/174,066
• Publication Number:
  US 20120223429A1
• Time in Patent Office: 775 Days
• Field of Search: 257/738, 257/737, 257/E23.068, 257/E23.069, 257/E21.502, 257/686, 257/685, 257/723, 257/724, 257/728, 257/777
• US Class Current: 257/738
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2225/1005 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1041 Special adaptations for top connections of the lowermost container, e.g. redistribution layer, integral interposer
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15331 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2924/3511 : Warping

Abstract

An integrated circuit (IC) package has a package member having a first surface and a second surface opposite the first surface. A first plurality of contact members is physically and electrically fixed to the second surface. An interposer substrate having a second plurality of contact members on one surface thereof which make physical and electrical contact with respective ones of the first plurality of contact members. The interposer substrate is configured to have at least one circuit member mounted to a second surface thereof opposite the one surface thereof.

Claims

1. An integrated circuit (IC) package, comprising:

a package member having a first surface and a second surface opposite the first surface;

a die attached to the second surface of the package member;

a first plurality of contact members physically and electrically fixed to the second surface; and

an interposer substrate having opposing first and second surfaces and having a second plurality of contact members on the first surface of the interposer substrate, the second plurality of contact members making physical and electrical contact with respective ones of the first plurality of contact members,

wherein a plurality of contact pads are located on the second surface of the interposer substrate, wherein the plurality of contact pads are configured to be coupled to have at least one device, and wherein the die is electrically coupled to the plurality of contact pads through the package member.

2. The IC package of claim 1, further comprising:

a mold compound disposed on the second surface of the package member, such that the first plurality of contact members are substantially flush with a surface of the mold compound.

3. The IC package of claim 1, further comprising:

a mold compound disposed on the second surface of the package member, such that the first plurality of contact members lie below the surface of the mold compound adjacent the interposer substrate;

the mold compound having openings therein in the surface adjacent the interposer substrate; and

the interposer substrate having contact members that extend below the surface of the mold compound in the openings thereof to make physical and electrical contact with respective ones of the first plurality of contact members.

4. The IC package of claim 1, wherein the second plurality of contact members comprise conductive posts extending from the first surface of the interposer substrate to make contact with respective ones of the first plurality of contact members.

5. The IC package of claim 1, wherein the second plurality of contact members comprise conductive pads that are substantially flush with the first surface of the interposer substrate and which make contact with respective ones of the first plurality of contact members.

6. The IC package of claim 1, wherein the interposer substrate comprises a plurality of interposer substrates, each having a second plurality of contact members on a first surface thereof which make physical and electrical contact with respective ones of the first plurality of contact members, each interposer substrate configured to have at least one circuit member mounted to a second surface thereof.

7. The IC package of claim 1, wherein the first surface of the interposer substrate is electrically coupled to the second surface of the interposer substrate with at least one wirebond.

8. The IC package of claim 7, further comprising a mold compound encapsulating the at least one wirebond, the second surface of the interposer substrate, and at least one circuit member.

9. The IC package of claim 1, wherein the first surface of the interposer substrate is electrically coupled to the second surface of the interposer substrate with at least one wirebond, and wherein the IC package further comprises a second mold compound that encapsulates the at least one wirebond.

10. The IC package of claim 7, wherein the second mold compound encapsulates the first surface of interposer substrate and at least one circuit member.

11. The IC package of claim 1, wherein the package member is electrically coupled to the interposer substrate through an outer periphery of the first plurality of contact members, whereby a structure of the package member electrically coupled to the interposer substrate forms a Faraday Cage.

12. The IC package of claim 1, wherein the package member is electrically coupled to the interposer substrate through the center of the first plurality of contact members, whereby a structure of the package member electrically coupled to the interposer substrate forms a Faraday Cage.

13. The IC package of claim 12, wherein the package member is electrically coupled with the interposer substrate through an outer periphery and the center of the first plurality of contact members, whereby a structure of the package member electrically coupled to the interposer substrate forms a Faraday Cage.

14. The IC package of claim 1, wherein the first plurality of contact members comprises at least one of:

a solder ball, a solder post, a conductor post, or a conductor pillar.

15. The IC package of claim 1, wherein the first surface of the interposer substrate has exposed contact pads which are substantially flush with a mold compound disposed on the second surface of the package member and a surface of each of the first and second plurality of contact members.

16. The IC package of claim 1, wherein the at least one device comprises a ball grid array (BGA) device package.

17. The IC package of claim 1, wherein the at least one device comprises a leadframe device package.

18. The IC package of claim 1, wherein the die is attached to the second surface of the package member in a flip chip configuration.

19. The IC package of claim 1, wherein the interposer substrate comprises a plurality of conductor layers.

20. The IC package of claim 1, further comprising:

the at least one device coupled to the plurality of contact pads.

21. The IC package of claim 11, wherein the package member comprises at least one trace configured to confine radiation emitted by the die.

22. The IC package of claim 11, wherein the interposer substrate comprises at least one trace configured to confine radiation emitted by the die.