Method and system for converting RF power to DC power utilizing a leaky wave antenna

• US 8,508,422 B2
• Filed: 05/28/2010
• Issued: 08/13/2013
• Est. Priority Date: 06/09/2009
• Status: Expired due to Fees

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza, Rofougaran, Maryam
• Primary Examiner(s): PHAN, THO GIA
• Application Number:
  US12/790,279
• Publication Number:
  US 20100309078A1
• Time in Patent Office: 1,173 Days
• Field of Search: 343/700.MS, 343/770, 343/771, 343/772, 343/776
• US Class Current: 343/772
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/15321 being a ball array, e.g. BGA
• CPC Class Codes: H01Q 1/248 provided with an AC/DC converting device, e.g. rectennas
• CPC Class Codes: H01Q 13/20 Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
• CPC Class Codes: H01Q 13/22 Longitudinal slot in boundary wall of waveguide or transmission line H01Q13/203 takes precedence

Abstract

Methods and systems for converting RF power to DC power utilizing a leaky wave antenna (LWA) are disclosed and may include receiving RF wireless signals utilizing one or more LWAs in a wireless device, and generating one or more DC voltages from the received RF signals utilizing cascaded rectifier cells. A resonant frequency of the LWAs may be configured utilizing micro-electro-mechanical systems (MEMS) deflection. The LWAs may be configured to receive the RF signals from a desired direction. The LWAs may comprise microstrip or coplanar waveguides, wherein a cavity height of the LWAs is dependent on a spacing between conductive lines in the waveguides. The LWAs may be integrated in one or more integrated circuits, integrated circuit packages, and/or printed circuit boards. The packages may be affixed to one or more printed circuit boards and the integrated circuits may be flip-chip-bonded to the packages.

Claims

1. A method for communication, the method comprising:

receiving RF wireless signals utilizing one or more leaky wave antennas in a wireless device; and

generating one or more DC voltages for use in said wireless device from said received RF signals utilizing cascaded rectifier cells.

2. The method according to claim 1, comprising configuring a resonant frequency of said one or more leaky wave antennas utilizing micro-electro-mechanical systems (MEMS) deflection.

3. The method according to claim 1, comprising configuring said one or more leaky wave antennas to receive said RF signals from a desired direction.

4. The method according to claim 1, wherein said one or more leaky wave antennas comprise microstrip waveguides.

5. The method according to claim 4, wherein a cavity height of said one or more leaky wave antennas is dependent on a spacing between conductive lines in said microstrip waveguides.

6. The method according to claim 1, wherein said one or more leaky wave antennas comprise coplanar waveguides.

7. The method according to claim 6, wherein a cavity height of said one or more leaky wave antennas is dependent on a spacing between conductive lines in said coplanar waveguides.

8. The method according to claim 1, wherein said one or more leaky wave antennas are integrated in one or more integrated circuits flip-chip bonded to one or more integrated circuit packages.

9. The method according to claim 1, wherein said one or more leaky wave antennas are integrated in one or more integrated circuit packages affixed to one or more printed circuit boards.

10. The method according to claim 1, wherein said one or more leaky wave antennas are integrated in one or more printed circuit boards.

11. A system for enabling communication, the system comprising:

a wireless device comprising one or more leaky wave antennas, wherein said wireless device is operable to;

receive RF wireless signals utilizing said one or more leaky wave antennas; and

generate one or more DC voltages for use in said wireless device from said received RF signals utilizing cascaded rectifier cells.

12. The system according to claim 11, wherein said wireless device is operable to configure a resonant frequency of said one or more leaky wave antennas utilizing micro-electro-mechanical systems (MEMS) deflection.

13. The system according to claim 11, wherein said wireless device is operable to configure said one or more leaky wave antennas to receive said RF signals from a desired direction.

14. The system according to claim 11, wherein said one or more leaky wave antennas comprise microstrip waveguides.

15. The system according to claim 14, wherein a cavity height of said one or more leaky wave antennas is dependent on a spacing between conductive lines in said microstrip waveguides.

16. The system according to claim 11, wherein said one or more leaky wave antennas comprise coplanar waveguides.

17. The system according to claim 16, wherein a cavity height of said one or more leaky wave antennas is dependent on a spacing between conductive lines in said coplanar waveguides.

18. The system according to claim 11, wherein said one or more leaky wave antennas are integrated in one or more integrated circuits flip-chip bonded to one or more integrated circuit packages.

19. The system according to claim 11, wherein said one or more leaky wave antennas are integrated in one or more integrated circuit packages affixed to one or more printed circuit boards.

20. The system according to claim 11, wherein said one or more leaky wave antennas are integrated in one or more printed circuit boards.