Separation of electrical and optical components
First Claim
1. An optical device, comprising:
- an outer casing;
an optical support fixed to a position within an interior of the outer casing;
a plurality of optical components mounted to the optical support;
a heat sink thermally coupled to a first optical component of the plurality of optical components, wherein at least a portion of the heat sink extends through the optical support;
a gasket configured to thermally insulate the portion of the heat sink extending through the optical support;
a printed circuit board separate from the optical support and fixed to a position in the outer casing that is spatially separated from the optical support and the plurality of optical components;
one or more electrical components mounted to the printed circuit board; and
one or more electrical conductors electrically connecting the one or more electrical components to the plurality of optical components.
2 Assignments
0 Petitions
Accused Products
Abstract
Embodiments related to establishing and maintaining precision alignment in an optical system are disclosed. For example, one disclosed embodiment provides an optical device comprising an outer casing and a rigid optical support disposed within an interior of the outer casing and to which a plurality of optical components are mounted. The embodiment further comprises a printed circuit board spatially separated from the optical support and the plurality of optical components, wherein one or more electrical components are mounted to the printed circuit board. The embodiment also comprises one or more electrical conductors electrically connecting the one or more electrical components to the one or more optical components.
208 Citations
19 Claims
-
1. An optical device, comprising:
-
an outer casing; an optical support fixed to a position within an interior of the outer casing; a plurality of optical components mounted to the optical support; a heat sink thermally coupled to a first optical component of the plurality of optical components, wherein at least a portion of the heat sink extends through the optical support; a gasket configured to thermally insulate the portion of the heat sink extending through the optical support; a printed circuit board separate from the optical support and fixed to a position in the outer casing that is spatially separated from the optical support and the plurality of optical components; one or more electrical components mounted to the printed circuit board; and one or more electrical conductors electrically connecting the one or more electrical components to the plurality of optical components. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A depth-sensing camera, comprising:
-
an optical system comprising; a rigid optical support, a projector mounted to the optical support, a first camera mounted to the optical support, a second camera mounted to the optical support, and a heat sink at least partially extending through the optical support and thermally coupled to the projector, the heat sink coupled to the optical support via a gasket configured to thermally insulate the heat sink from the optical support; and an electrical/thermal system comprising; a printed circuit board separate from the optical support and spatially separated from the optical support, one or more electronic components mounted to the printed circuit board, and one or more thermal components mounted to the printed circuit board system and thermally floating relative to the optical support; and a plurality of electrical conductors electrically connecting the projector, the first camera, and the second camera respectively to the printed circuit board. - View Dependent Claims (10, 11, 12, 13)
-
-
14. A method of assembling an optical device, the optical device comprising a rigid optical support, a printed circuit board, and an outer casing, the method comprising:
-
mounting a plurality of optical components to the optical support, wherein one or more optical components of the plurality of optical components comprises a heat sink at least partially extending through the optical support, the heat sink coupled to the optical support via a gasket configured to allow the heat sink to float relative to the optical support and to thermally insulate the heat sink from the optical support; positioning the optical support in the outer casing and fixing a position of the optical support relative to the outer casing; positioning the printed circuit board in the outer casing and fixing a position of the printed circuit board in a location that is spaced from the optical support; and connecting one or more of the plurality of optical components to the printed circuit board via one or more electrical conductors. - View Dependent Claims (15, 16, 17, 18, 19)
-
Specification