Cooling active circuits

• US 8,508,943 B2
• Filed: 10/16/2009
• Issued: 08/13/2013
• Est. Priority Date: 10/16/2009
• Status: Active Grant

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Danello, Paul A., Cheyne, Scott R., Ellsworth, Joseph R., Tellinghuisen, Thomas J.
• Primary Examiner(s): DUONG, DIEU HIEN
• Application Number:
  US12/580,356
• Publication Number:
  US 20120146862A1
• Time in Patent Office: 1,397 Days
• Field of Search: 343/700.MS, 361/702, 361/704, 361/708, 361/688, 361/696, 361/697, 361/679.01
• US Class Current: 361/704
• CPC Class Codes: H01Q 21/0087 Apparatus or processes specially adapted for manufacturing antenna arrays manufacturing waveguides H01P11/00
• CPC Class Codes: H05K 7/20509 Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Abstract

In one aspect, an assembly includes a panel that includes a first surface. The panel also includes a first active circuit coupled to the first surface of the panel and a cold plate having a first bore. The cold plate includes a first inner surface exposed by the first bore. The panel further includes a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit.

Claims

1. An assembly comprising:

a panel comprising a first surface;

a first active circuit coupled to the first surface of the panel;

a cold plate having a first bore and comprising;

a first inner surface exposed by the first bore; and

a second surface facing the first surface of the panel;

a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit and forming a thermal conductive path from the first active circuit to the cold plate that extends only through the first thermally conductive material, the first thermally conductive material being in direct contact with the second surface of the cold plate; and

a mask layer in direct contact with the second surface of the cold plate, the mask layer being resistant to bonding to the first thermally conductive material, the mask layer not being part of the thermal conductive path,

wherein an opening of the bore is completely filled with only the first thermally conductive material.

2. The assembly of claim 1 wherein the cold plate has a second bore and the cold plate comprises a second inner surface exposed by the second bore, and

further comprising;

a second active circuit coupled to the first surface of the panel; and

a second thermally conductive material in contact with the second inner surface of the cold plate and the first active circuit.

3. The assembly of claim 2 wherein the first active circuit and the second active circuit differ in thickness by more than 1 mil.

4. The assembly of claim 2 wherein the first thermally conductive material and the second thermally conductive material are composed of the same elements.

5. The assembly of claim 4 wherein the first thermally conductive material comprises one of lead and tin.

6. The assembly of claim 4 wherein the first thermally conductive material comprises a thermally conductive epoxy.

7. The assembly of claim 1, wherein the first inner surface comprises a gold layer, the gold layer extends from the first inner surface to a portion of the second surface of the cold plate.

8. The assembly of claim 1, further comprising:

a first standoff member in contact with the panel and the cold plate; and

a first fastener extending through the standoff and configured to secure the cold plate to the panel.

9. The assembly of claim 8, further comprising:

a second standoff member in contact with the panel and the cold plate; and

a second fastener extending through the standoff and configured to secure the cold plate to the panel;

a third standoff member in contact with the panel and the cold plate; and

a third fastener extending through the standoff and configured to secure the cold plate to the panel.

10. The assembly of claim 1 wherein the mask layer is a solder mask.

11. An active, electronically scanned array (AESA) panel architecture system comprising:

an antenna panel;

an active panel coupled to the antenna panel and comprising a first surface;

active circuits coupled to the first surface of the active panel;

a cold plate comprising;

bores;

inner surfaces exposed by the bores; and

second surface facing the first surface of the panel;

thermally conductive material in contact with the inner surfaces of the cold plate and the active circuits and forming thermal conductive paths from the active circuits to the cold plate that extend only through the thermally conductive material, the thermally conductive material being in direct contact with the second surface of the cold plate; and

a mask layer in direct contact with the second surface of the cold plate, the mask layer being resistant to bonding to the thermally conductive material, the mask layer not being part of the thermal conductive paths,

wherein a first active circuit of the active circuits and a second active circuit of the active circuits differ in thickness by more than 1 mil,

wherein openings of the bores are completely filled with only the thermally conductive material.

12. The system of claim 11 wherein the thermally conductive material comprises one of lead and tin.

13. The system of claim 12, wherein the inner surfaces of the cold plate comprise a gold layer, each gold layer extends from the inner surface to a portion of the second surface of the cold plate.

14. The system of claim 11, further comprising:

standoff members in contact with the active panel and the cold plate; and

fasteners extending through the standoff and configured to secure the cold plate to the active panel.

15. The system of claim 11 wherein the mask layer is a solder mask.