Modular shielded electronics enclosure

• US 8,508,956 B2
• Filed: 05/05/2011
• Issued: 08/13/2013
• Est. Priority Date: 05/05/2011
• Status: Active Grant

• Current Assignee: Carefusion 303 Incorporated (Becton, Dickinson & Co)
• Original Assignee: Carefusion 303 Incorporated (Becton, Dickinson & Co)
• Inventors: Nicol, David H., Joyce, Michael Dugan, Burgess, Brendan
• Primary Examiner(s): Nguyen, Hoa C
• Assistant Examiner(s): Cunningham, Xanthia C
• Application Number:
  US13/101,861
• Publication Number:
  US 20120281368A1
• Time in Patent Office: 831 Days
• Field of Search: None
• US Class Current: 361/818
• CPC Class Codes: H05K 9/0054 specially adapted for display applications

Abstract

A modular electronics enclosure for reducing electromagnetic interference (EMI) is disclosed. The electronics assembly includes a first electronic component having an output, a second electronic component having an input with an input impedance, and a circuit matching element having an input coupled to the output of the first electronic component and an output coupled to the input of the second electronic component. The output of the circuit matching element is configured to provide an output impedance that matches the input impedance of the second electronic component. The electronics assembly also includes a conductive surface that forms a volume that encloses the first electronic component and the circuit matching element. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a maximum shielding frequency.

Claims

1. A modular electronics assembly for reducing electromagnetic interference (EMI), the electronics assembly comprising:

a first electronic component having an output;

a second electronic component having an input with an input impedance;

a circuit matching element having an input coupled to the output of the first electronic component and an output coupled to the input of the second electronic component, the output of the circuit matching element configured to provide an output impedance that matches the input impedance of the second electronic component;

a conductive surface configured to form a volume, the first electronic component and the circuit matching element disposed within the volume;

wherein all non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a maximum shielding frequency.

2. The electronics assembly of claim 1, wherein:

the second electronic component comprises a display; and

the output of the first electronic component comprises a video signal.

3. The electronics assembly of claim 1, wherein:

the input of the second electronic component is configured to accept a Low Voltage Differential Signal (LVDS) signal;

the input of the second electronic component has a characteristic input impedance; and

the output of the circuit matching element is configured to provide a LVDS signal having an output impedance that matches the characteristic impedance of the second electronic component input.

4. The electronics assembly of claim 3, wherein no inductive element is coupled to the line between the circuit matching element output and the second electronic component input.

5. The electronics assembly of claim 4, wherein no ferrite is coupled to the line between the circuit matching element output and the second electronic component input.

6. The electronics assembly of claim 1, wherein the maximum shielding frequency is at least 1 GHz.

7. The electronics assembly of claim 1, further comprising:

a sled configured to accept the first electronic component and the circuit matching element, the sled comprising a conductive material; and

a conductive shell configured to couple to the sled to form the conductive surface.

8. The electronics assembly of claim 7, wherein:

the first electronic component comprises a motherboard having a processor and; and

the second electronic component comprises a display.

9. The electronics assembly of claim 8, wherein the motherboard further comprises an electrical interface connector configured to removably engage a docking connector coupled to an external device.

10. The electronics assembly of claim 9, further comprising:

a touchscreen proximate to a front surface of the display, the touchscreen comprising a controller that is coupled to the processor;

a backlight proximate to a back surface of the display, the backlight comprising an inverter that is coupled to the circuit matching element; and

an external cover configured to enclose the sled and conductive shell, the display, the backlight, and the touchscreen;

wherein the electronics assembly further comprises at least one mechanical attachment feature configured to retain the electrical interface connector in engagement with the docking connector.

11. The electronics assembly of claim 10, wherein the sled and external cover are configured such that the mechanical attachment feature is provided by coupling of the sled to an external structure, such that loads are transferred from the sled to the external structure without creating tension, bending, or shear stresses in the external cover.

12. The electronics assembly of claim 10, wherein the external cover does not provide EMI shielding.

13. An electronics assembly for removably connecting an electronic assembly to at least one external device while reducing EMI emissions, the electronics enclosure comprising:

a first electronic component comprising an output and an electrical interface connector configured to removably mate with a docking connector coupled to the at least one external device;

a second electronic component comprising an input having an input impedance;

a circuit matching element coupled between the output of the first electronic component and the input of the second electronic component, the circuit matching element configured to provide an output impedance that matches the input impedance of the second electronic component;

a conductive sled configured to accept the first electronic component and the circuit matching element;

a conductive cover configured to couple to the sled to form a volume, the first electronic component and the circuit matching element disposed within the volume;

wherein all non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a maximum shielding frequency.

14. The electronics assembly of claim 13, wherein:

the first electronic component comprises a motherboard having a processor; and

the second electronic component comprises a display.

15. The electronics assembly of claim 14, wherein:

the processor is coupled through the interface connector and the docking connector to a non-volatile memory;

the non-volatile memory is configured to store at least one configuration datum associated with the operation of the electronics assembly such that disconnection of a first electronics assembly and connection of a second electronics assembly does not require modification of the at least one configuration datum for the second electronics assembly to operate in the same manner as the first electronics assembly.

16. The electronics assembly of claim 14, wherein:

the second electronic component input is configured to accept a LVDS signal and has a characteristic input impedance; and

the circuit matching element output is configured to provide a LVDS signal and match the characteristic input impedance of the second electronic component input.

17. The electronics assembly of claim 16, wherein no inductive element is coupled to the line between the circuit matching element output and the second electronic component input.

18. The electronics assembly of claim 17, wherein no ferrite is coupled to the line between the circuit matching element output and the second electronic component input.

19. The electronics assembly of claim 13, wherein the maximum shielding frequency is at least 1 GHz.

20. An All-In-One (AIO) assembly for a medical device, the AIO assembly comprising:

a display unit having an input with an input impedance;

a conductive sled;

a motherboard coupled to the sled, the motherboard comprising a processor and a display driver;

a breakout board having an input coupled to the display driver and an output coupled to the input of the display, the breakout board output configured to provide an output impedance that matches the input impedance of the display;

a conductive cover coupled to the sled, the conductive cover configured to form a volume when coupled to the, the motherboard and the breakout board disposed within the volume;

wherein all non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a maximum shielding frequency.

21. The AIO assembly of claim 20, wherein:

the display input is configured to accept a LVDS signal and has a characteristic input impedance; and

the breakout board output is configured to provide a LVDS signal and match the characteristic input impedance of the display input.

22. The AIO assembly of claim 21, wherein no inductive element is coupled to the line between the breakout board output and the display input.

23. The AIO assembly of claim 22, wherein no ferrite is coupled to the line between the breakout board output and the display input.

24. The AIO assembly of claim 20, wherein the motherboard further comprises an interface connector configured to removably engage a docking connector coupled to at least one external electronic device of the medical device.

25. The AIO assembly of claim 20, wherein the maximum shielding frequency is at least 1 GHz.

26. An Automated Dispensing Machine (ADM), comprising:

a housing;

at least one compartment coupled to the housing, the compartment configured to allow access to the contents of the compartment only after receipt of a signal;

a docking connector; and

an AIO assembly removably coupled to the housing, the AIO comprising;

a display unit having an input with an input impedance;

a conductive sled;

a motherboard coupled to the sled, the motherboard comprising a processor, a display driver, and an electrical interface connector configured to removably mate with the docking connector;

a breakout board having an input coupled to the display driver and an output coupled to the input of the display, the breakout board output configured to provide an output impedance that matches the input impedance of the display;

a conductive cover coupled to the sled, the conductive cover configured to form a volume when coupled to the sled, the motherboard and the breakout board disposed within the volume;

wherein all non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a maximum shielding frequency; and

wherein the AIO assembly is configured to be removable from the ADM without disassembly of the external shell.

27. The ADM of claim 26, wherein:

the display input is configured to accept a LVDS signal and has a characteristic input impedance; and

the breakout board output is configured to provide a LVDS signal and match the characteristic input impedance of the display input.

28. The ADM of claim 27, wherein no inductive element is coupled to the line between the breakout board output and the display input.

29. The ADM of claim 28, wherein no ferrite is coupled to the line between the breakout board output and the display input.

30. The ADM of claim 26, further comprising a non-volatile memory coupled to the housing and electrically coupled to the processor through the docking connector and interface connector, the non-volatile memory configured to store at least one configuration datum associated with the operation of the ADM such that removal of a first AIO assembly and connection of a second AIO assembly enables the ADM to be function with the second AIO assembly in the same manner as the ADM previously functioned with the first AIO assembly without additional action.

31. The ADM of claim 26, wherein the maximum shielding frequency is at least 1 GHz.