Methods and systems for forming slots in a semiconductor substrate

• US 8,510,948 B2
• Filed: 04/17/2007
• Issued: 08/20/2013
• Est. Priority Date: 01/31/2002
• Status: Expired due to Fees

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Buswell, Shen, Rivas, Rio T., Khavarl, Mahrgan, Templin, Paul, Jenssen, Conrad, MacKenzle, Mark H.
• Primary Examiner(s): ANGWIN, DAVID PATRICK
• Application Number:
  US11/736,523
• Publication Number:
  US 20070240309A1
• Time in Patent Office: 2,317 Days
• Field of Search: 298/901, 296/11, 297/29, 347/54, 347/62, 347/65, 347/92, 451/36, 451/37, 451/38, 451/57, 451/58
• US Class Current: 29/890.1
• CPC Class Codes: B41J 2/1603 of the front shooter type
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: Y10T 29/49083 Heater type
• CPC Class Codes: Y10T 29/49401 Fluid pattern dispersing device making, e.g., ink jet

Abstract

A method of fabricating a fluid feed slot in a print head substrate includes making a cut into a first surface of a substrate using a cutting disk having a generally planar surface oriented generally perpendicular to the first surface, and removing material from a second surface of the substrate. Making the cut and removing the material form, in combination, the fluid feed slot in the substrate at least a portion of which passes entirely through the substrate, with a full length of the fluid feed slot extending less than a full length of the substrate, and making the cut into the first surface includes providing a first completed portion of the fluid feed slot with curved surfaces at opposite end walls thereof converging from the first surface toward the second surface.

Claims

1. A method of fabricating a fluid feed slot in a print head substrate, comprising:

making a cut into a first surface of a substrate using a cutting disk, the cutting disk having a generally planar surface oriented generally perpendicular to the first surface; and

,

removing material from a second surface of the substrate,

wherein said making a cut and said removing material form, in combination, the fluid feed slot in the substrate at least a portion of which passes entirely through the substrate, a full length of the fluid feed slot extending less than a full length of the substrate,

wherein said making a cut into the first surface includes providing a first completed portion of the fluid feed slot with curved surfaces at opposite end walls thereof converging from the first surface toward the second surface.

2. The method of claim 1, wherein said making a cut into the first surface comprises making a cut into a thin film side of the substrate.

3. The method of claim 1, wherein said making a cut into the first surface comprises making a cut with the cutting disk being moved in both the x and y directions relative to the substrate.

4. The method of claim 1, wherein said making a cut into the first surface comprises making a cut into a backside of the substrate.

5. The method of claim 1, wherein said making a cut with the cutting disk comprises making a cut with a circular saw.

6. The method of claim 1, wherein said making a cut into the first surface comprises making a cut at least a portion of which extends entirely through the substrate.

7. The method of claim 1, wherein said making a cut comprises making multiple passes with the cutting disk to cut a desired thickness of the substrate, including moving the cutting disk in a direction substantially parallel with the first surface during each of the multiple passes.

8. The method of claim 1, wherein said removing material comprises making a second cut into the second surface of the substrate with a cutting disk,

wherein said making a second cut into the second surface includes providing a second completed portion of the fluid feed slot with curved surfaces at opposite end walls thereof converging from the second surface toward the first surface.

9. The method of claim 1, wherein said removing material comprises one or more of:

sand drilling, dry etching, wet etching, and drilling with a rotary drill bit.

10. The method of claim 8, wherein the end walls of the first and second completed portions of the fluid feed slot meet at an angle greater than or equal to ninety degrees relative to the substrate.

11. The method of claim 1, wherein said removing material is performed before said making a cut.

12. The method of claim 1, wherein a finalized form of the fluid feed slot includes at least a portion of the curved surfaces at the opposite end walls thereof, and substantially parallel opposite sidewalls extending between the opposite end walls.

13. The method of claim 12, wherein the opposite sidewalls and the opposite end walls define the full length of the fluid feed slot.