Configuration of multiple LED module
First Claim
Patent Images
1. An LED module, comprising:
- a carrier having a first main area, a second main area, and at least one semiconductor layer comprising a semiconductor material, said first main area having a planar configuration;
a plurality of conductive regions formed on said first main area of said carrier;
a plurality of LED semiconductor bodies applied on said plurality of conductive regions; and
chip connection regions formed on said conductive regions, said LED semiconductor bodies being disposed on said chip connection regions.
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Abstract
A configuration of multiple LED modules having a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer. The first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.
36 Citations
25 Claims
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1. An LED module, comprising:
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a carrier having a first main area, a second main area, and at least one semiconductor layer comprising a semiconductor material, said first main area having a planar configuration; a plurality of conductive regions formed on said first main area of said carrier; a plurality of LED semiconductor bodies applied on said plurality of conductive regions; and chip connection regions formed on said conductive regions, said LED semiconductor bodies being disposed on said chip connection regions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. An LED module, comprising:
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a carrier having a first main area, a second main area, and at least one semiconductor layer comprising a semiconductor material, said first main area having a planar configuration; a plurality of conductive regions formed on said first main area of said carrier; a plurality of LED semiconductor bodies applied on said plurality of conductive regions; and said carrier having and being bounded by at least one electrical insulating layer on a side of said first main area, said insulating layer being arranged between the conductive regions and said semiconductor layer. - View Dependent Claims (24, 25)
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Specification