Method and system for large scale manufacture of thin film photovoltaic devices using single-chamber configuration

• US 8,512,528 B2
• Filed: 04/25/2012
• Issued: 08/20/2013
• Est. Priority Date: 11/14/2007
• Status: Expired due to Fees

• Current Assignee: Stion Corporation
• Original Assignee: Stion Corporation
• Inventors: Lee, Howard W. H., Farris, Chester A. III
• Primary Examiner(s): ROSASCO, STEPHEN D
• Application Number:
  US13/456,030
• Publication Number:
  US 20120276682A1
• Time in Patent Office: 482 Days
• Field of Search: 204/192.26, 204/192.3, 204/298.11, 204/298.25, 204/298.26, 204/298.27
• US Class Current: 204/192.26
• CPC Class Codes: H01L 21/67167 surrounding a central transfer chamber
• CPC Class Codes: H01L 21/67173 in-line arrangement
• CPC Class Codes: H01L 21/67213 comprising at least one ion or electron beam chamber coating by ion implantation C23C; ion or electron beam tubes H01J37/00
• CPC Class Codes: H01L 21/6723 comprising at least one plating chamber electroless plating apparatuses C23C, electroplating apparatuses C25D
• CPC Class Codes: Y10S 428/917 Electroluminescent

Abstract

A system for large scale manufacture of thin film photovoltaic cells includes a chamber comprising a plurality of compartments in a common vacuum ambient therein. Additionally, the system includes one or more shutter screens removably separating each of the plurality of compartments. The system further includes one or more transfer tools configured to transfer a substrate from one compartment to another without breaking the common vacuum ambient. The substrate is optically transparent and is characterized by a lateral dimension of about 1 meter or greater for a solar module. Embodiments of the invention provide compartments configured to subject the substrate to one or more thin film processes to form a Cu-rich Cu—In composite material overlying the substrate and at least one of the plurality of compartments is configured to subject the Cu-rich Cu—In composite material to a thermal process to form a chalcogenide structured material.

Claims

1. A method for manufacture of thin film photovoltaic cells in a system with single-chamber configuration having multiple compartments therein, the method comprising:

providing a substrate into a first compartment within a chamber, the substrate being optically transparent and being characterized by a lateral dimension of about 1 meter or greater for manufacture a thin film photovoltaic cell;

forming an electrode layer overlying the substrate;

transferring the substrate within the chamber to a second compartment to subject the electrode layer to a copper bearing sputtering target;

forming a copper-bearing layer overlying the electrode layer;

transferring the substrate within the chamber to a third compartment to subject the copper-bearing layer to an indium sputtering target;

forming an indium layer overlying the copper-bearing layer, thereby forming a Cu-rich Cu—

In composite film having a Cu;

In atomic ratio of 1.2;

1 and greater;

transferring the substrate to a fourth compartment within the chamber, the compartment comprising a plurality of nozzles for supplying gas phase sulfur-bearing species and one or more heaters for supplying thermal energy; and

performing a thermal treatment process to form a photovoltaic absorber layer by reacting the Cu-rich Cu—

In composite film with the sulfur-bearing species.

2. The method of claim 1 wherein the substrate comprises a soda lime glass, a quartz, a fused silica, or a plastic, or other composite materials.

3. The method of claim 1 wherein the chamber comprises two or more sputtering targets disposed in series for forming the electrode layer characterized by resistivity of about 100 ohm-cm to 10 ohm-cm and less.

4. The method of claim 3 wherein the electrode layer comprises a conductive material selected from molybdenum, tungsten, copper, chromium, aluminum, nickel, and platinum.

5. The method of claim 3 wherein the electrode layer comprises a molybdenum sublayer with a tensile stress followed by another molybdenum sublayer with a compressive stress.

6. The method of claim 1 wherein the chamber comprises a vacuum ambient having a pressure of about 6.2 mTorr or lower.

7. The method of claim 1 wherein the copper-bearing layer comprises a pure copper material or a copper-gallium alloy.

8. The method of claim 1 wherein the indium sputtering target is made of 99.999% pure indium.

9. The method of claim 1 wherein the fourth compartment comprises a rapid thermal annealing processor.

10. The method of claim 1 wherein the one or more heaters are capable of heating the compartment from room temperature to about 500 degrees Celsius.

11. The method of claim 1 wherein the gas phase sulfur-bearing species comprise a hydrogen sulfide gas, a sulfur vapor from a solid phase sulfide material.

12. The method of claim 1 wherein the thermal process further comprises forming a cap layer made of copper sulfide material covering the photovoltaic absorber layer made of copper-indium-disulfide material.

13. The method of claim 12 further comprising performing a dip process to remove the copper sulfide cap layer substantially away the copper-indium-disulfide material.

14. The method of claim 1 further comprising performing a doping process to the photovoltaic absorber layer using sodium, or boron, or aluminum or any combination of those materials as dopant impurities to form one or more p++ regions.

15. A method for manufacture of thin film photovoltaic cells in a system with single-chamber configuration having multiple compartments therein, the method comprising:

providing a substrate into a first compartment within the chamber, the substrate being optically transparent and being characterized by a lateral dimension of about 1 meter or greater for manufacture a thin film photovoltaic cell;

forming an electrode layer overlying the substrate;

transferring the substrate to a second compartment within the chamber to subject the electrode layer to a copper bearing sputtering target and an indium bearing sputtering target;

forming a copper-bearing layer overlying the electrode layer;

forming an indium layer overlying the copper-bearing layer, thereby forming a Cu-rich Cu—

In composite film having a Cu;

In atomic ratio of 1.2;

1 and greater;

transferring the substrate to a third compartment within the chamber, the compartment comprising a plurality of nozzles for supplying gas phase sulfur-bearing species and one or more heaters for supplying thermal energy; and

performing a thermal treatment process to form a photovoltaic absorber layer by reacting the Cu-rich Cu—

In composite film with the sulfur-bearing species.

16. The method of claim 15 wherein the one or more heaters are capable of heating the compartment from room temperature to about 500 degrees Celsius.

17. The method of claim 15 wherein the gas phase sulfur-bearing species comprise a hydrogen sulfide gas, a sulfur vapor from a solid phase sulfide material.

18. The method of claim 15 wherein the thermal process further comprises forming a cap layer made of copper sulfide material covering the photovoltaic absorber layer made of copper-indium-disulfide material.

19. The method of claim 18 further comprising performing a dip process to remove the copper sulfide cap layer substantially away the copper-indium-disulfide material.

20. The method of claim 15, wherein the transferring the substrate further comprises moving one or more shutter screens between compartments prior to moving the substrate past the opening defined by the movement of the one or more shutter screens.