Multi-step release method for electrochemically fabricated structures

• US 8,512,578 B2
• Filed: 09/28/2010
• Issued: 08/20/2013
• Est. Priority Date: 12/03/2001
• Status: Expired due to Term

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Cohen, Adam L., Lockard, Michael S., McPherson, Dale S.
• Primary Examiner(s): ALANKO, ANITA KAREN
• Application Number:
  US12/892,734
• Publication Number:
  US 20110073479A1
• Time in Patent Office: 1,057 Days
• Field of Search: None
• US Class Current: 216/2
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B81C 1/0019 Flexible or deformable structures not provided for in groups B81C1/00142 - B81C1/00182
• CPC Class Codes: C23C 18/1605 by masking
• CPC Class Codes: C23C 18/1651 Two or more layers only obtained by electroless plating
• CPC Class Codes: C23C 18/1689 After-treatment
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: G03F 7/00 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using photoresist structures for special production processes, see the relevant places, e.g. B44C, H01L, e.g. H01L21/00, H05K

Abstract

Multi-layer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surrounds the desired structure. After structure formation, the sacrificial material is removed by a multi-stage etching operation. In some embodiments sacrificial material to be removed may be located within passages or the like on a substrate or within an add-on component. The multi-stage etching operations may be separated by intermediate post processing activities, they may be separated by cleaning operations, or barrier material removal operations, or the like. Barriers may be fixed in position by contact with structural material or with a substrate or they may be solely fixed in position by sacrificial material and are thus free to be removed after all retaining sacrificial material is etched.

Claims

1. A method for simultaneously forming a plurality of three-dimensional structures, comprising:

(A) forming a plurality of successively formed layers, wherein each successive layer comprises at least two materials and is formed on and adhered to a previously formed layer, one of the at least two materials is a structural material and the other of the at least two materials is a sacrificial material, and wherein each successive layer defines a successive cross-section of a plurality of the three-dimensional structures, and wherein the forming of each of the plurality of successive layers comprises;

(i) depositing a first of the at least two materials;

(ii) depositing a second of the at least two materials;

(iii) planarizing the first and second materials to set a boundary level for the layer; and

(B) during or after formation of the plurality of successively formed layers, locating at least one etching barrier to at least partially shield sacrificial material around a portion of the three-dimensional structures from attack by an etchant while the etchant removes sacrificial material from multiple layers around at least another portion of the three-dimensional structures;

(C) after locating the barrier and after forming the plurality of successive layers, etching away a portion of the sacrificial material from multiple layers of the structural material to reveal a portion of the three-dimensional structures,

(D) after said etching away, removing the barrier;

(E) after removing the barrier, etching away another portion of the sacrificial material from multiple layers of the structural material to reveal at least another portion of the three-dimensional structures.

2. The method of claim 1 wherein during formation of at least one given layer, the step of depositing the first of the at least two materials comprises depositing a sacrificial material.

3. The method of claim 1 wherein during formation of at least one given layer, the step of depositing the first of the at least two materials comprises depositing a structural material.

4. The method of claim 1 wherein during the formation of at least one given layer the at least two materials comprise at least three materials.

5. The method of claim 4 wherein during the formation of at least one given layer the at least three materials comprise at least three different electroplated materials.

6. The method of claim 1 wherein the revealing of the structures also releases the structures from a substrate on which they were formed.

7. An electroplating method for simultaneously fabricating a plurality of multi-layer three-dimensional structures, comprising:

(A) forming a first layer comprising depositing at least a first structural material and at least a first sacrificial material and planarizing the at least one deposited first structural material and the at least one deposited first sacrificial material to set a boundary level of the first layer;

(B) forming additional layers with an initial additional layer formed on and adhered to the first layer and with subsequent additional layers formed on and adhered to previously formed additional layers, wherein the forming of each additional layer comprises depositing at least one additional structural material and depositing at least one additional sacrificial material and planarizing the at least one deposited additional structural material and the at least one additional sacrificial material to set a boundary level for each additional layer;

(C) during or after formation of the plurality of successively formed layers, locating at least one etching barrier to at least partially shield sacrificial material around a portion of the three-dimensional structures from attack by an etchant while the etchant removes sacrificial material from multiple layers around at least another portion of the three-dimensional structures;

(D) after locating the barrier and after forming the plurality of successive layers, etching away a portion of the sacrificial material from multiple layers of the structural material to reveal a portion of the three-dimensional structures,

(E) after said etching away, removing the barrier;

(F) after removing the barrier, etching away another portion of the sacrificial material from multiple layers of the structural material to reveal at least another portion of the three-dimensional structures.

8. The method of claim 7 wherein during formation of a given layer, the step of depositing the at least one sacrificial material occurs before the step of depositing the at least one structural material.

9. The method of claim 7 wherein during formation of a given layer, the step of depositing the at least one structural material occurs before the step of depositing the at least one sacrificial material.

10. The method of claim 7 wherein during the formation of the given layer the depositing of the at least one structural material and the at least one sacrificial material comprise the deposition of at least three materials.

11. The method of claim 10 wherein during the formation of the given layer the depositing of the at least three materials comprise the electroplating of at least three different materials.

12. The method of claim 7 wherein the revealing of the structures also releases the structures from a substrate on which they were formed.

13. An electrochemical fabrication process for producing a plurality of multi-layer three-dimensional structures from a plurality of adhered layers, the process comprising:

(A) forming a layer by depositing at least one sacrificial material and at least one structural material onto a substrate, wherein the substrate may comprise previously deposited layers, and wherein the depositing of at least one of the materials comprises an electrodeposition or electroless deposition operation;

(B) repeating (A) one or more times such that a plurality of layers are formed and such that successive layers are formed adjacent to and adhered to previously formed layers;

(C) locating an etching barrier to inhibit etching of sacrificial material around one or more selected three-dimensional structures during an etching operation that is intended to release one or more non-selected structures from the sacrificial material;

(D) performing a first etching operation to release the one or more non-selected structures from the sacrificial material;

(E) removing the etching barrier;

(F) after removal of the etching barrier, performing a second etching operation to release at least a portion of the selected structures from multiple layers of the sacrificial material.

14. The method of claim 13 wherein during formation of a given layer, the step of depositing the at least one sacrificial material occurs before the step of depositing the at least one structural material.

15. The method of claim 13 wherein during formation of a given layer, the step of depositing the at least one structural material occurs before the step of depositing the at least one sacrificial material.

16. The method of claim 13 wherein during the formation of the given layer the depositing of the at least one structural material and the at least one sacrificial material comprise the deposition of at least three materials.

17. The method of claim 16 wherein during the formation of the given layer the depositing of the at least three materials comprise the electroplating of at least three different materials.

18. The method of claim 13 wherein the release of the structures from surrounding sacrificial material also releases the structures from a substrate on which they were formed.