Integrated MEMS devices with controlled pressure environments by means of enclosed volumes
First Claim
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1. A MEMS device comprising:
- two or more enclosures of different volumes;
at least one of the two or more enclosures comprising at least one cavity;
a first structure within a first enclosure; and
a second structure within a second enclosure,wherein the volume of the first enclosure is different from the volume of the second enclosure, wherein a substrate defines part of the first and second sealed enclosures, wherein the substrate contains two or more etched cavities of different depths.
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Abstract
An integrated MEMS device comprises a wafer where the wafer contains two or more cavities of different depths. The MEMS device includes one movable structure within a first cavity of a first depth and a second movable structure within a second cavity of a second depth. The cavities are sealed to maintain different pressures for the different movable structures for optimal operation. MEMS stops can be formed in the same multiple cavity depth processing flow. The MEMS device can be integrated with a CMOS wafer.
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Citations
14 Claims
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1. A MEMS device comprising:
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two or more enclosures of different volumes;
at least one of the two or more enclosures comprising at least one cavity;a first structure within a first enclosure; and a second structure within a second enclosure, wherein the volume of the first enclosure is different from the volume of the second enclosure, wherein a substrate defines part of the first and second sealed enclosures, wherein the substrate contains two or more etched cavities of different depths. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification