Semiconductor package with integrated inductor

• US 8,513,771 B2
• Filed: 06/07/2010
• Issued: 08/20/2013
• Est. Priority Date: 06/07/2010
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Elian, Klaus, Theuss, Horst, Meyer-Berg, Georg
• Primary Examiner(s): Mandala, Victor A
• Assistant Examiner(s): MOORE, WHITNEY
• Application Number:
  US12/795,230
• Publication Number:
  US 20110298088A1
• Time in Patent Office: 1,170 Days
• Field of Search: 257/531, 257/E29.325, 257/E21.502
• US Class Current: 257/531
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 17/04 with magnetic core
• CPC Class Codes: H01F 2017/0073 with a special conductive pattern, e.g. flat spiral
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 24/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Abstract

A semiconductor package includes a semiconductor chip. An inductor is applied to the semiconductor chip. The inductor has at least one winding. An encapsulation body is formed of an encapsulation material. The encapsulation material contains a magnetic component and fills a space within the winding to form a magnetic winding core.

Claims

1. A semiconductor package, comprising:

a semiconductor chip having a first main surface;

an inductor disposed in the semiconductor chip, the inductor having a winding;

an encapsulation body comprising an encapsulation material, wherein the encapsulation material contains a magnetic component and fills a space within the winding to form a magnetic winding core; and

an electric redistribution structure extending over a surface of the encapsulation body and over the first main surface of the semiconductor chip.

2. The semiconductor package of claim 1, wherein the semiconductor chip comprises a hole, the hole comprising the space within the winding that is filled with the encapsulation material.

3. The semiconductor package of claim 2, wherein the semiconductor chip comprises a recess provided in a first main surface of the semiconductor chip, the recess laterally extending from the hole to an outline of the semiconductor chip and being filled with encapsulation material.

4. The semiconductor package of claim 3, wherein the semiconductor chip comprises a winding trench provided in the first main surface, the winding trench being filled with a metal material to form the winding.

5. The semiconductor package of claim 3, wherein the semiconductor chip comprises a winding trench provided in a second main surface of the semiconductor chip opposite to the first main surface, the winding trench being filled with a metal material to form the winding.

6. The semiconductor package of claim 3, wherein the semiconductor chip comprises a second main surface opposite to the first main surface and side faces extending from the first main surface to the second main surface, and wherein the encapsulation body entirely covers the side faces of the semiconductor chip.

7. The semiconductor package of claim 6, wherein the encapsulation body comprises a surface which is substantially coplanar with the first main surface of the semiconductor chip.

8. The semiconductor package of claim 7, wherein the electric redistribution structure has at least one structured metal layer and one polymer layer.

9. The semiconductor package of claim 1, wherein the semiconductor chip comprises a winding trench provided in a main semiconductor chip surface, the winding trench being filled with a metal material to form the winding.

10. The semiconductor package of claim 1, wherein the encapsulation material comprises a polymer material embedding magnetic particles.

11. The semiconductor package of claim 10, wherein the magnetic particles comprise iron, nickel and/or molybdenum.

12. A method of manufacturing a semiconductor package, the method comprising:

attaching a semiconductor chip to a carrier, the semiconductor chip including an inductor having a winding;

depositing an encapsulation material onto the semiconductor chip to form an encapsulation body, the encapsulation material containing a magnetic component and filling a space within the winding to form a magnetic winding core; and

applying an electric redistribution structure to the encapsulation body.

13. The method of claim 12, wherein attaching a semiconductor chip comprises attaching a plurality of semiconductor chips, each semiconductor chip including an inductor, the method further comprising singulating the encapsulation body in at least two semiconductor packages.

14. The method of claim 13, further comprising:

providing a semiconductor wafer comprising multiple functional chip regions;

applying the inductor having the winding to each functional chip region of the semiconductor wafer; and

separating the wafer into semiconductor chips, each of the semiconductor chip comprising the functional chip region equipped with inductors.

15. The method of claim 14, further comprising generating a hole into each functional chip region, the hole comprising the space within the winding to be filled with the encapsulation material to form the magnetic winding core.

16. The method of claim 15, further comprising generating a recess into a wafer surface of each functional chip region, the recess laterally extending from the hole to an outline of the functional chip region.

17. The method of claim 14, further comprising:

generating a winding trench into a wafer surface of each functional chip region; and

depositing metal material into the winding trench to form the winding of the inductor.

18. The method of claim 12, wherein the encapsulation body is formed by compression molding, transfer molding, injection molding, powder molding, liquid molding, dispensing or laminating.

19. The method of claim 12, wherein the encapsulation material is based on a polymer matrix material embedding magnetic particles.

20. The method of claim 19, wherein the magnetic particles comprise iron, nickel and/or molybdenum.

21. A semiconductor package, comprising:

a semiconductor chip having a first main surface;

an encapsulation body disposed around the semiconductor chip;

an inductor integrated in the semiconductor chip, the inductor having a winding; and

an electric redistribution structure extending over a surface of the encapsulation body and over the first main surface of the semiconductor chip, wherein the semiconductor chip comprises a hole running through the winding, the hole filled with a polymer material embedding magnetic particles.

22. The semiconductor package of claim 21, wherein the encapsulation body comprises an encapsulation material, wherein the encapsulation material is made of the polymer material embedding magnetic particles.

23. The semiconductor package of claim 21, wherein the semiconductor chip further comprises an integrated circuit electrically coupled to the winding.