Antenna for an electronic tag
First Claim
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1. An inductive element, characterized in that it comprises:
- a first group of parallel conductive tracks coplanar in a first plane;
a second group of parallel conductive tracks coplanar in a second plane parallel to the first plane; and
an insulating material separating the two groups of tracks, one end of each track of the first group being connected to an end of a track of the second group having its other end connected to an end of another track of the first group, the connections between the first and second groups of tracks being conductive vias that cross through the insulating material,wherein the first group of parallel conductive tracks is superimposed in a first metal level of a semiconductor wafer and the second group of parallel conductive tracks is superimposed in a second metal level of the semiconductor wafer.
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Abstract
The invention concerns an inductive element for forming an electromagnetic transponder antenna, comprising a first group of mutually parallel conductors coplanar in a first plane, a second group of mutually parallel conductors coplanar in a second plane parallel to the first plane, and an insulating material separating the two groups of conductors, one end of each conductor of the first group being connected to one end of a conductor of the second group whereof the other end is connected to one end of another conductor of the first group, the connections between the conductors being conductive via holes in the thickness of the insulating material.
24 Citations
13 Claims
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1. An inductive element, characterized in that it comprises:
- a first group of parallel conductive tracks coplanar in a first plane;
a second group of parallel conductive tracks coplanar in a second plane parallel to the first plane; and an insulating material separating the two groups of tracks, one end of each track of the first group being connected to an end of a track of the second group having its other end connected to an end of another track of the first group, the connections between the first and second groups of tracks being conductive vias that cross through the insulating material, wherein the first group of parallel conductive tracks is superimposed in a first metal level of a semiconductor wafer and the second group of parallel conductive tracks is superimposed in a second metal level of the semiconductor wafer. - View Dependent Claims (2, 3, 4, 5, 6)
- a first group of parallel conductive tracks coplanar in a first plane;
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7. An inductive element, comprising:
- an insulating material;
a first group of conductive tracks on a first side of the insulating material, the first group of conductive tracks comprising a first track and a second track, the first group of conductive tracks being superimposed in a first metal level of a semiconductor wafer;a second group of conductive tracks on a second side of the insulating material, the second group of conductive tracks comprising a third track and a fourth track, the second group of conductive tracks being superimposed in a second metal level of the semiconductor wafer; and conductive connections between the first and second groups of conductive tracks, the conductive connections comprising a first conductive connection between the first track and the third track, a second conductive connection between the second track and the third track, and a third conductive connection between the second track and the fourth track, wherein each of the first, second and third conductive connections extends through the insulating material. - View Dependent Claims (8, 9, 10, 11)
- an insulating material;
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12. A method of using a transponder comprising an antenna that includes an inductive element having an insulating material;
- a first group of conductive tracks on a first side of the insulating material, the first group of conductive tracks comprising a first track and a second track;
a second group of conductive tracks on a second side of the insulating material, the second group of conductive tracks comprising a third track and a fourth track; and
conductive connections between the first and second groups of tracks, the conductive connections comprising a first conductive connection between the first track and the third track, a second conductive connection between the second track and the third track, and a third conductive connection between the second track and the fourth track, wherein each of the first, second and third conductive connections extends through the insulating material, the first and second group of conductive tracks being superimposed a first and second metal level in a semiconductor wafer, respectively, the method comprising;placing the transponder in contact with all object comprising metal at least at a surface of the object. - View Dependent Claims (13)
- a first group of conductive tracks on a first side of the insulating material, the first group of conductive tracks comprising a first track and a second track;
Specification