Single-layer metallization and via-less metamaterial structures

• US 8,514,146 B2
• Filed: 10/13/2008
• Issued: 08/20/2013
• Est. Priority Date: 10/11/2007
• Status: Active Grant

• Current Assignee: Tyco Electronics Services GmbH (TE Connectivity Limited)
• Original Assignee: Tyco Electronics Services GmbH (TE Connectivity Limited)
• Inventors: Gummalla, Ajay, Achour, Maha, Lee, Cheng-Jung, Pathak, Vaneet, Poilasne, Gregory
• Primary Examiner(s): Nguyen, Hoang V
• Assistant Examiner(s): MCCAIN, KYANA RASHAWN
• Application Number:
  US12/250,477
• Publication Number:
  US 20090128446A1
• Time in Patent Office: 1,772 Days
• Field of Search: 343/909, 343/911
• US Class Current: 343/909
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 15/08 formed of solid dielectric material
• CPC Class Codes: H01Q 5/307 Individual or coupled radiating elements, each element being fed in an unspecified way

Abstract

Techniques and apparatus based on metamaterial structures provided for antenna and transmission line devices, including single-layer metallization and via-less metamaterial structures.

Claims

1. A metamaterial device comprising:

a dielectric substrate having a first surface and a second, different surface; and

a metallization layer formed on the first surface and patterned to have two or more conductive parts to form a single-layer composite left and right handed (CRLH) metamaterial structure on the first surface, the two or more conductive parts comprising;

a ground electrode;

a cell patch;

a via line coupling the cell patch with the ground electrode; and

a feed line electromagnetically coupled to the cell patch through a gap to direct a signal to or from the cell patch, the feed line including a launch pad formed near a distal end and separate from the cell patch to enhance capacitive coupling between the feed line and the cell patch, the launch pad including a lateral width that differs from a lateral width of the feed line elsewhere.

2. The device as in claim 1, wherein the dielectric substrate is free of via holes.

3. The device as in claim 1, wherein the dielectric substrate is shaped to conform to a shape of and is attached to another surface.

4. The device as in claim 3, wherein the dielectric substrate is shaped to conform to a shape of and is attached to an inner wall of a device housing for the device.

5. The device as in claim 3, wherein the dielectric substrate is shaped to conform to a shape of and is attached to a carrier apparatus that holds the device.

6. The device as in claim 3, wherein the dielectric substrate is not flat.

7. The device as in claim 3, wherein the dielectric substrate is flexible.

8. The device as in claim 1, wherein the two or more conductive parts of the metamaterial structure are structured to form a metamaterial antenna and are positioned and sized to generate two or more frequency resonances at which the metamaterial antenna operates.

9. The device as in claim 1, wherein the two or more conductive parts of the metamaterial structure are structured to form a metamaterial antenna and are positioned and sized to generate two or more frequency resonances in WiFi bands.

10. The device as in claim 1, wherein:

the two or more conductive parts of the metamaterial structure are structured to form a metamaterial antenna and are positioned and sized to generate two or more frequency resonances which include a first frequency resonance in a low band and a second frequency resonance in a high band, the first frequency resonance being a left-handed (LH) mode frequency resonance and the second frequency resonance being a right-handed (RH) mode frequency resonance.

11. The device as in claim 10, wherein the two or more frequency resonances further include a third frequency resonance which is in either the low band or the high band.

12. The device as in claim 11, wherein at least two out of the first, second and third frequency resonances are specified to collectively produce a broader contiguous frequency range as compared to a single resonance.

13. The device as in claim 10, wherein at least two out of the two or more frequency resonances are specified to form a broader contiguous frequency range as compared to a single resonance.

14. The device as in claim 10, wherein the low band includes a cellular band and the high band includes a PCS/DCS band.

15. The device as in claim 1, wherein the two or more conductive parts of the metamaterial structure are structured to form a metamaterial antenna and are positioned and sized to generate two or more frequency resonances in WiMax bands.

16. The device as in claim 1, wherein the two or more conductive parts of the metamaterial structure are structured to form a metamaterial antenna and are positioned and sized to generate one or more frequency resonances between 824 MHz and 960 MHz.

17. The device as in claim 1, wherein the two or more conductive parts of the metamaterial structure are structured to form a metamaterial antenna and are positioned and sized to generate one or more frequency resonances between 1710 MHz and 2170 MHz.

18. The device as in claim 1, wherein the two or more conductive parts of the metamaterial structure are structured to form a penta-band metamaterial antenna and are positioned and sized to generate five frequency resonances.

19. The device as in claim 1, wherein the two or more conductive parts of the metamaterial structure are structured to form a quad-band metamaterial antenna and are positioned and sized to generate four frequency resonances.

20. The device as in claim 1, wherein the ground electrode is a co-planar waveguide (CPW) ground, and the metallization layer includes a CPW feed that is coupled to the feed line.

21. The device as in claim 1, wherein the ground electrode, the cell patch, the via line, the gap, and the feed line are configured to generate frequency resonances for a quad-band antenna operation.

22. The device as in claim 21, wherein the frequency resonances include a left-handed (LH) mode frequency resonance in a low band of the quad-band.

23. The device as in claim 1, wherein a distal end of the feed line that is close to the cell patch is shaped and configured to enhance impedance matching of the CRLH metamaterial structure.

24. The device as in claim 1, wherein the cell patch is shaped and configured to increase a length of the gap.

25. The device as in claim 1, wherein a location where the via line is attached to the ground electrode is determined at least in part using information about a feed location to enhance impedance matching of the CRLH metamaterial structure.

26. The device as in claim 1, comprising:

a second electrode formed on the second surface and comprising an extended portion configured to enhance impedance matching of the CRLH metamaterial structure.

27. The device as in claim 1, comprising:

a conductive line attached to the feed line on the first surface,

wherein the ground electrode, the cell patch, the via line, the gap, the feed line, and the conductive line are configured as an antenna to generate frequency resonances for a penta-band antenna operation.

28. The device as in claim 27, wherein the frequency resonances include at least two LH mode frequency resonances in a low band of the penta-band.

29. The device as in claim 27, wherein the conductive line has a meander shape.

30. The device as in claim 27, wherein the conductive line has a spiral shape.

31. The device as in claim 1, comprising:

a capacitor that couples the cell patch and the feed line, wherein a width of the gap is increased and/or a length of the gap is decreased as compared to the width and/or the length of the gap in the absence of the capacitor based on a capacitance value of the capacitor.

32. The device as in claim 1, comprising:

an inductor inserted in the via line, wherein a length of the via line is shortened as compared to the length of the via line in the absence of the inductor based on an inductance value of the inductor.

33. The device as in claim 1, comprising:

a lumped element coupled to the two or more conductive parts.

34. The device as in claim 1, wherein

the second surface is free of a metallization area underneath the cell patch.