Single-layer metallization and via-less metamaterial structures
First Claim
Patent Images
1. A metamaterial device comprising:
- a dielectric substrate having a first surface and a second, different surface; and
a metallization layer formed on the first surface and patterned to have two or more conductive parts to form a single-layer composite left and right handed (CRLH) metamaterial structure on the first surface, the two or more conductive parts comprising;
a ground electrode;
a cell patch;
a via line coupling the cell patch with the ground electrode; and
a feed line electromagnetically coupled to the cell patch through a gap to direct a signal to or from the cell patch, the feed line including a launch pad formed near a distal end and separate from the cell patch to enhance capacitive coupling between the feed line and the cell patch, the launch pad including a lateral width that differs from a lateral width of the feed line elsewhere.
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Abstract
Techniques and apparatus based on metamaterial structures provided for antenna and transmission line devices, including single-layer metallization and via-less metamaterial structures.
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Citations
34 Claims
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1. A metamaterial device comprising:
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a dielectric substrate having a first surface and a second, different surface; and a metallization layer formed on the first surface and patterned to have two or more conductive parts to form a single-layer composite left and right handed (CRLH) metamaterial structure on the first surface, the two or more conductive parts comprising; a ground electrode; a cell patch; a via line coupling the cell patch with the ground electrode; and a feed line electromagnetically coupled to the cell patch through a gap to direct a signal to or from the cell patch, the feed line including a launch pad formed near a distal end and separate from the cell patch to enhance capacitive coupling between the feed line and the cell patch, the launch pad including a lateral width that differs from a lateral width of the feed line elsewhere. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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Specification