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Single-layer metallization and via-less metamaterial structures

  • US 8,514,146 B2
  • Filed: 10/13/2008
  • Issued: 08/20/2013
  • Est. Priority Date: 10/11/2007
  • Status: Active Grant
First Claim
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1. A metamaterial device comprising:

  • a dielectric substrate having a first surface and a second, different surface; and

    a metallization layer formed on the first surface and patterned to have two or more conductive parts to form a single-layer composite left and right handed (CRLH) metamaterial structure on the first surface, the two or more conductive parts comprising;

    a ground electrode;

    a cell patch;

    a via line coupling the cell patch with the ground electrode; and

    a feed line electromagnetically coupled to the cell patch through a gap to direct a signal to or from the cell patch, the feed line including a launch pad formed near a distal end and separate from the cell patch to enhance capacitive coupling between the feed line and the cell patch, the launch pad including a lateral width that differs from a lateral width of the feed line elsewhere.

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