Electrical system and matrix assembly therefor

• US 8,514,552 B2
• Filed: 12/17/2010
• Issued: 08/20/2013
• Est. Priority Date: 12/17/2010
• Status: Active Grant

• Current Assignee: Labinal (Safran SA)
• Original Assignee: Eaton Corp. (Wisconsin) (Eaton Corporation PLC.)
• Inventors: Mills, Patrick Wellington, McCormick, James Michael, Hanley, Kevin Francis, Budd, Timothy Richey
• Primary Examiner(s): THOMPSON, GREGORY D
• Application Number:
  US12/971,142
• Publication Number:
  US 20120154987A1
• Time in Patent Office: 977 Days
• Field of Search: 361/644, 361676-678
• US Class Current: 361/644
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

A matrix assembly is provided for an electrical system such as, for example, a power distribution unit for an aircraft. The electrical system includes an enclosure and a number of current carrying components such as, for example, electrical bus members, electrical switching apparatus, and/or fuses. The matrix assembly includes a matrix member having a generally planar portion, a plurality of attachment points for attaching the current carrying components to the generally planar portion, and a plurality of mounting points for attaching the generally planar portion to a thermally conductive structure such as, for example, an aluminum airframe structure. The matrix member is a thermally conductive liquid crystalline polymer. In addition to providing dielectric insulation, the matrix member also effectively transfers heat away from the current carrying components to the aluminum airframe structure, thereby reducing the temperature and corresponding electrical resistance within the electrical system and improving performance.

Claims

1. A matrix assembly for an electrical system, said electrical system comprising an enclosure and a number of current carrying components housed by said enclosure, said matrix assembly comprising:

a matrix member comprising a generally planar portion, a plurality of attachment points structured to attach said current carrying components to said genera planar portion, and a plurality of mounting points structured to attach said generally planar portion to a thermally conductive structure, wherein said matrix member is a thermally conductive liquid crystalline polymer,

wherein said matrix member further comprises a number of heat sink structures,

wherein said heat sink structures are a number of protrusions extending outwardly from said planar portion, thereby increasing the surface area of said matrix member; and

wherein each of said protrusions is structured to extend outwardly from a corresponding one of said attachment points to transfer heat generated by said current carrying components away from said current carrying components, and

wherein said number of protrusions are a plurality of ribs; and

wherein said ribs extend between at least some of said attachment points and said mounting points thereby facilitating heat transfer from said current carrying components through said ribs to said mounting points and into said thermally conductive structure.

2. The matrix assembly of claim 1 wherein said thermally conductive liquid crystalline polymer has a thermal conductivity of about 1 W/mK to about 20 W/mK;

and wherein said matrix member is structured to provide heat transfer and dielectric insulation, without requiring a plurality of separate structures.

3. The matrix assembly of claim 1 wherein said thermally conductive structure is an airframe structure.

4. The matrix assembly of claim 1 wherein said enclosure includes an interior and an exterior;

wherein a portion of said matrix member is structured to extend outwardly from the interior of said enclosure to the exterior of said enclosure; and

wherein said mounting points are structured to be disposed on the exterior of said enclosure.

5. The matrix assembly of claim 4 wherein said matrix member is structured to transfer heat away from said current carrying components disposed on the interior of said enclosure through said matrix member to the exterior of said enclosure and through said mounting points to said thermally conductive structure.

6. The matrix assembly of claim 1 wherein said matrix member further comprises a first side and a second side disposed opposite the first side;

wherein said electrical system further comprises a printed circuit board;

wherein said current carrying components are structured to be attached to the first side of said matrix member; and

wherein said printed circuit board is structured to be attached to the second side of said matrix member.

7. The matrix assembly of claim 1 wherein said current carrying components comprise at least one of an electrical bus member, an electrical switching apparatus, and a fuse.

8. An electrical system comprising:

an enclosure;

a number of current carrying components housed by said enclosure; and

a matrix assembly comprising;

a matrix member comprising a generally planar portion, a plurality of attachment points attaching said current carrying components to said generally planar portion, and a plurality of mounting points structured to attach said generally planar portion to a thermally conductive structure,

wherein said matrix member is a thermally conductive liquid crystalline polymer,

wherein said matrix member further comprises a number of protrusions extending outwardly from said planar portion, thereby increasing the surface area of said matrix member; and

wherein each of said protrusions extend outwardly from a corresponding one of said attachment points to transfer heat generated by said current carrying components away from said current carrying components, and

wherein said number of protrusions are a plurality of ribs; and

wherein said ribs extend between at least some of said attachment points and said mounting points, thereby facilitating heat transfer from said current carrying components through said ribs to said mounting points and into said thermally conductive structure.

9. The electrical system of claim 8 wherein said thermally conductive liquid crystalline polymer has a thermal conductivity of about 1 W/mK to about 20 W/mK;

and wherein said matrix member is structured to provide heat transfer and dielectric insulation, without requiring a plurality of separate structures.

10. The electrical system of claim 8 wherein said thermally conductive structure is an airframe structure.

11. The electrical system of claim 8 wherein said enclosure includes an interior and an exterior;

wherein a portion of said matrix member extends outwardly from the interior of said enclosure to the exterior of said enclosure; and

wherein said mounting points are disposed on the exterior of said enclosure.

12. The electrical system of claim 11 wherein said matrix member transfers heat generated by said current carrying components disposed on the interior of said enclosure through said matrix member to the exterior of said enclosure and through said mounting points to said airframe thermally conductive structure.

13. The electrical system of claim 8 wherein said matrix member further comprises a first side and a second side disposed opposite the first side wherein said electrical system further comprises a printed circuit board;

wherein said current carrying components are attached to the first side of said matrix member; and

wherein said printed circuit board is attached to the second side of said matrix member.

14. The electrical system of claim 8 wherein said current carrying components comprise at least one of an electrical conductor, an electrical bus member, an electrical switching apparatus, and a fuse.

15. The electrical system of claim 14 wherein said electrical system is a power distribution unit for an aircraft;

wherein said aircraft has a thermally conductive structure;

wherein said current carrying components generate heat within the interior of said power distribution unit; and

wherein said matrix member of said matrix assembly transfers said heat from said power distribution unit to said structure of said aircraft.