Apparatus and methods for monitoring health of semiconductor process systems

• US 8,515,568 B1
• Filed: 09/23/2011
• Issued: 08/20/2013
• Est. Priority Date: 06/23/2006
• Status: Active Grant

• Current Assignee: Novellus Systems Incorporated (Lam Research Corporation)
• Original Assignee: Novellus Systems Incorporated (Lam Research Corporation)
• Inventors: Achtnig, Jeffery William, Fleming, Russell, Jain, Jaideep
• Primary Examiner(s): Ali, Mohammad
• Assistant Examiner(s): Norton, Jennifer L
• Application Number:
  US13/242,816
• Time in Patent Office: 697 Days
• Field of Search: 700/9, 700/19, 700/29, 700/32, 700/108, 700/109, 700/110, 700/121, 257/E21.525, 702/84, 702/178, 702/181, 702/182, 702/183
• US Class Current: 700/108
• CPC Class Codes: G05B 19/41875 characterised by quality surveillance of production
• CPC Class Codes: G05B 23/0232 based on qualitative trend analysis, e.g. system evolution
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

Disclosed are apparatus and methods for monitoring an operation parameter of a process tool, independently of a process system recipe, are provided. In one embodiment, the behavior of a process device as it transitions between different states is monitored for a single cycle of operation or over time to detect trends that indicate a potential failure of the process device. When a trend that indicates a potential failure is detected, an alarm is generated. In one implementation, the time for reaching a particular stage of operation may be repeatedly monitored over a plurality of device cycles. For example, the time to open a valve or door may be monitored. In another example, the time for reaching a stable phase of gas flow after a ramping stage has commenced is monitored. When the time for reaching a particular stage begins to decline by a predetermined amount, an alarm may be generated.

Claims

1. A method of monitoring a process system for performing a fabrication operation on a semiconductor wafer, the method comprising:

enabling output of a feedback from the process system and receiving the feedback, the feedback specifying a characteristic of a component of the process system, wherein the characteristic is in response to input data sent to the component;

determining whether there is an actual or imminent problem with the process system based on the feedback, wherein such determination is accomplished without analysis of the input data sent to such component; and

reporting the actual or imminent problem or sending an alert regarding the actual or imminent problem when it is determined that there is an actual or imminent problem, while physically disabling output of the input data from the process system.

2. A method as recited in claim 1, wherein the component is a mass flow controller (MFC) or a unit pressure controller (UPC) of the process system, the feedback specifies an effective orifice diameter of the MFC or UPC, and it is determined that there is an actual or imminent problem when the effective orifice diameter correlates with probability of failure that is higher than a predetermined amount.

3. A method as recited in claim 1, wherein determining whether there is an actual or imminent problem with the process system is accomplished by correlating the feedback with feedback from other measurement devices to thereby predict failure are likely to occur under a set of conditions of the current and other measurement devices.

4. A method as recited in claim 1, wherein the feedback specifies an RF power level or DC power level output and the determination is based on such output without being based on a RF or DC power level input to the component.

5. A method as recited in claim 1, wherein the feedback specifies a length of time of processing the wafer.

6. A method as recited in claim 1, wherein the feedback specifies a flow level output and the determination is based on such output without being based on a flow level setpoint input to the component.

7. A method as recited in claim 1, wherein the feedback specifies a rotational speed.

8. A method as recited in claim 1, wherein the feedback specifies a voltage output.

21. The method of claim 1, wherein the input data includes proprietary input data, and wherein disabling output of the input data includes disabling output of the proprietary input data.

9. An apparatus for monitoring a process system for performing a fabrication operation on a semiconductor wafer, comprising:

one or more processors;

one or more memory, wherein at least one of the processors and memory are adapted for;

enabling output of a feedback from the process system and receiving the feedback, the feedback specifying a characteristic of a component of the process system, wherein the characteristic is in response to input data sent to the component;

determining whether there is an actual or imminent problem with the process system based on the feedback, wherein such determination is accomplished without analysis of the input data sent to such component; and

reporting the actual or imminent problem or sending an alert regarding the actual or imminent problem when it is determined that there is an actual or imminent problem, while physically disabling output of the input data from the process system.

10. An apparatus as recited in claim 9, wherein the component is a mass flow controller (MFC) or a unit pressure controller (UPC) of the process system, the feedback specifies an effective orifice diameter of the MFC or UPC, and it is determined that there is an actual or imminent problem when the effective orifice diameter correlates with probability of failure that is higher than a predetermined amount.

11. An apparatus as recited in claim 9, wherein determining whether there is an actual or imminent problem with the process system is accomplished by correlating the feedback with feedback from other measurement devices to thereby predict failure are likely to occur under a set of conditions of the current and other measurement devices.

12. An apparatus as recited in claim 9, wherein the feedback specifies an RF power level or DC power level output and the determination is based on such output without being based on a RF or DC power level input to the component.

13. An apparatus as recited in claim 9, wherein the feedback specifies a length of time of processing the wafer.

14. An apparatus as recited in claim 9, wherein the feedback specifies a flow level output and the determination is based on such output without being based on a flow level setpoint input to the component.

15. An apparatus as recited in claim 9, wherein the feedback specifies a rotational speed.

16. An apparatus as recited in claim 9, wherein the feedback specifies a voltage output.

22. The apparatus of claim 9, wherein the input data includes proprietary input data, and wherein disabling output of the input data includes disabling output of the proprietary input data.

17. A computer program product for monitoring a process system for performing a fabrication operation on a semiconductor wafer, the computer program product comprising:

at least one non-transitory computer readable medium;

computer program instructions stored within the at least one computer readable product configured to cause a processing device to;

enabling output of a feedback from the process system and receiving the feedback, the feedback specifying a characteristic of a component of the process system, wherein the characteristic is in response to input data sent to the component;

determining whether there is an actual or imminent problem with the process system based on the feedback, wherein such determination is accomplished without analysis of the input data sent to such component; and

reporting the actual or imminent problem or sending an alert regarding the actual or imminent problem when it is determined that there is an actual or imminent problem, while physically disabling output of the input data from the process system.

18. A computer program product as recited in claim 17, wherein the component is a mass flow controller (MFC) or a unit pressure controller (UPC) of the process system, the feedback specifies an effective orifice diameter of the MFC or UPC, and it is determined that there is an actual or imminent problem when the effective orifice diameter correlates with probability of failure that is higher than a predetermined amount.

19. A computer program product as recited in claim 17, wherein the feedback specifies an RF power level or DC power level output and the determination is based on such output without being based on a RF or DC power level input to the component.

20. A computer program product as recited in claim 17, wherein the feedback specifies a flow level output and the determination is based on such output without being based on a flow level setpoint input to the component.

23. The computer program product of claim 17, wherein the input data includes proprietary input data, and wherein disabling output of the input data includes disabling output of the proprietary input data.