Methods of making a radio frequency identification (RFID) tags
First Claim
1. A method of making an electronic assembly comprising:
- providing a strap from a first web of flexible material, the strap comprising;
a functional component, the functional component being a radio frequency identification (RFID) flip chip;
a portion of the flexible material; and
first and second connection pads on the flexible material;
providing an antenna on a flexible substrate;
detecting for a defective functional component of the strap;
attaching the strap to the flexible substrate if a defect is not detected during the detecting,wherein the antenna is electrically coupled to the RFID flip chip by the first and second connection pads, andwherein the strap is smaller than the antenna.
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Accused Products
Abstract
Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.
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Citations
23 Claims
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1. A method of making an electronic assembly comprising:
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providing a strap from a first web of flexible material, the strap comprising; a functional component, the functional component being a radio frequency identification (RFID) flip chip; a portion of the flexible material; and first and second connection pads on the flexible material; providing an antenna on a flexible substrate; detecting for a defective functional component of the strap; attaching the strap to the flexible substrate if a defect is not detected during the detecting, wherein the antenna is electrically coupled to the RFID flip chip by the first and second connection pads, and wherein the strap is smaller than the antenna. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of making an electronic assembly comprising:
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providing a strap from a first web of flexible material, the strap comprising; a functional component, the functional component being a radio frequency identification (RFID) chip configured for fluidic self assembly; a portion of the flexible material; and first and second connection pads on the flexible material; providing an antenna on a flexible substrate; detecting for a defective functional component of the strap; attaching the strap to the flexible substrate if a defect is not detected during the detecting, wherein the antenna is electrically coupled to the RFID chip by the first and second connection pads, and wherein the strap is smaller than the antenna. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification