Shielded prosthetic component

• US 8,516,884 B2
• Filed: 02/27/2012
• Issued: 08/27/2013
• Est. Priority Date: 06/29/2010
• Status: Active Grant

• Current Assignee: Howmedica Osteonics Corp. (Stryker Corporation)
• Original Assignee: OrthoSensor, Inc (Stryker Corporation)
• Inventors: Stein, Marc, Chase, Andrew U.
• Primary Examiner(s): THOMPSON, JEWEL VERGIE
• Application Number:
  US13/406,515
• Publication Number:
  US 20120226359A1
• Time in Patent Office: 547 Days
• Field of Search: 733/790.1, 600/587
• US Class Current: 73/379.01
• CPC Class Codes: A61B 5/4509 Bone density determination
• CPC Class Codes: A61B 5/4528 Joints A61B5/4533, A61B5/4538 take precedence
• CPC Class Codes: A61B 5/6846 specially adapted to be brought in contact with an internal body part, i.e. invasive
• CPC Class Codes: A61F 2/4657 Measuring instruments used for implanting artificial joints for surgical instruments A61B90/06

Abstract

A prosthetic component suitable for long-term implantation is provided. The prosthetic component measures a parameter of the muscular-skeletal system is disclosed. The prosthetic component comprises a first structure having at least one support surface, a second structure having at least one feature configured to couple to bone, and at least one sensor. The electronic circuitry and sensors are hermetically sealed within the prosthetic component. The sensor couples to the support surface of the first structure. The first and second structure are coupled together housing the at least one sensor. The first and second structures comprises steel, titanium, cobalt or an alloy thereof. At least one of the first or second structures is coupled to ground to shield the sensor from parasitic coupling. The at least one sensor can be a pressure sensor for measuring load and position of load.

Claims

1. A prosthetic component for measuring a parameter of the muscular-skeletal system comprising:

a prosthetic component comprising a conductive material having at least one feature configured to couple to bone;

electronic circuitry; and

at least one sensor configured to measure the parameter of the muscular-skeletal system where the electronic circuitry is coupled to the at least one sensor, where the prosthetic component houses the electronic circuitry and the at least one sensor, and where the conductive material of the prosthetic component is coupled to ground to shield the electronic circuitry and at least one sensor.

2. The prosthetic component of claim 1 where the conductive material of the prosthetic component is coupled to ground through the at least one sensor.

3. The prosthetic component of claim 2 further including a load pad coupled to the at least one sensor where the load pad couples to ground.

4. The prosthetic component of claim 3 where the at least one sensor comprises one of a strain gauge, piezo-resistive sensor, mems device, mechanical sensor, polymer sensor, ultrasonic waveguide, or capacitor.

5. The prosthetic component of 4 where the at least one sensor is a compressible capacitor.

6. The prosthetic component of claim 5 where the compressible capacitor includes a conductive region or plate that is coupled to ground.

7. The prosthetic component of claim 6 where the conductive region is configured to shield the compressible capacitor.

8. The prosthetic component of claim 7 where the conductive region is coupled to the load pad.

9. The prosthetic component of claim 8 where the capacitor is formed in interconnect coupling the capacitor to the electronic circuitry.

10. A prosthetic component for the muscular-skeletal system where at least one sensor is housed in the prosthetic component, where the prosthetic component comprises a conductive material, and where the conductive material is grounded to shield the sensor from parasitic coupling.

11. The prosthetic component of claim 10 where the prosthetic component comprises steel.

12. The prosthetic component of claim 11 where the at least one sensor is a load sensor and is coupled to a support surface of the prosthetic component.

13. The prosthetic component of claim 12 where the at least one sensor comprises one of a strain gauge, mems device, piezo-resistive sensor, mechanical sensor, polymer sensor, ultrasonic sensor, or capacitor.

14. The prosthetic component of claim 13 where the at least one sensor includes a shield and where the shield and the conductive material of the prosthetic component are coupled in common.

15. The prosthetic component of claim 14 where a conductive pad couples the shield of the at least one sensor and the conductive material of the prosthetic component in common.

16. A tibial prosthetic component comprising at least one sensor housed in the tibial prosthetic component where the tibial prosthetic component comprises a conductive material and where the conductive material is grounded to shield the at least one sensor.

17. The tibial prosthetic component of claim 16 further including electronic circuitry in the tibial prosthetic component coupled to the at least one sensor.

18. The tibial prosthetic component of claim 17 where the at least one sensor couples to a support surface of the tibial prosthetic component and where at least one sensor measures a force, pressure, or load.

19. The tibial prosthetic component of claim 18 where the at least one sensor is a capacitor.

20. The tibial prosthetic component of claim 19 where the capacitor includes a shield coupled to ground.