Bimetallic integrated on-chip thermocouple array
First Claim
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1. An apparatus, comprising:
- a semiconductor integrated circuit chip defined by a stack of several interconnected layers including at least two layers of dissimilar metal patterned to define an array of integrated bimetallic thermocouples spaced apart from one another, each of the thermocouples being operatively connected to a thermal management circuit defined by the integrated circuit chip.
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Abstract
An integrated circuit chip is defined by a stack of several interconnected layers. The integrated circuit chip includes at least two layers of dissimilar metal patterned to define an array of integrated bimetallic thermocouples.
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Citations
23 Claims
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1. An apparatus, comprising:
a semiconductor integrated circuit chip defined by a stack of several interconnected layers including at least two layers of dissimilar metal patterned to define an array of integrated bimetallic thermocouples spaced apart from one another, each of the thermocouples being operatively connected to a thermal management circuit defined by the integrated circuit chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method, comprising:
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preparing circuitry of an integrated circuit device from a number of layers of different composition, the layers including at least two metallic layers of dissimilar metals; patterning the metallic layers to define a number of spaced apart bimetallic thermocouple junctions positioned along the circuitry; and operatively coupling the thermocouple junctions to a thermal management device for the integrated circuit device. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification