Method of treating a gas stream

• US 8,518,162 B2
• Filed: 07/27/2006
• Issued: 08/27/2013
• Est. Priority Date: 08/15/2005
• Status: Active Grant

• Current Assignee: Edwards Limited (Atlas Copco AB)
• Original Assignee: Edwards Limited (Atlas Copco AB)
• Inventors: Smith, James Robert, Seeley, Andrew James, Baker, Derek Martin, Radoiu, Marilena
• Primary Examiner(s): Hopkins, Robert A
• Application Number:
  US11/990,255
• Publication Number:
  US 20110197759A1
• Time in Patent Office: 2,588 Days
• Field of Search: 95/4, 95/57, 95/60, 95/67, 95/73, 952/88, 96/15, 96/74, 422/168, 422/173, 422/186.04, 422/186.21, 422/186.22, 204/157.3, 423/240.R, 588/311, 588/415, 588/406
• US Class Current: 95/288
• CPC Class Codes: H01J 37/32192 Microwave generated discharge H01J37/32357, H01J37/32366, H01J37/32394, H01J37/32403 take precedence
• CPC Class Codes: H01J 37/32229 Waveguides
• CPC Class Codes: H01J 37/32844 Treating effluent gases
• CPC Class Codes: Y02C 20/30 of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]

Abstract

A method is described for treating gas exhaust from a polysilicon etch process, which uses a plasma abatement device to treat the gas. The device comprises a stainless steel gas chamber having a gas inlet for receiving the gas and a gas outlet. As the gas may contain a halocompound and water vapor, the chamber is heated to a temperature that inhibits adsorption of water on the surface within the chamber, thereby inhibiting corrosion of the gas chamber. The gas is then conveyed to the gas chamber for treatment, and the temperature of the chamber is maintained above said temperature during treatment of the gas.

Claims

1. A method of treating a gas containing varying amounts of a halocompound and water vapour, the method comprising the steps of:

providing a plasma abatement device comprising a gas chamber having a gas inlet for receiving the gas and a gas outlet;

heating a housing of the chamber to a temperature that inhibits adsorption of water on a stainless steel surface within the chamber;

conveying the gas to the gas chamber for treatment thereof within the chamber; and

maintaining the housing of the chamber at or above said temperature during treatment of the gas,

wherein the gas is treated at or around atmospheric pressure,

wherein the housing of the chamber is maintained within the range from 120°

C. to 180°

C. during treatment of the gas.

2. The method according to claim 1 wherein the housing of the chamber is heated to at least 120°

C. before the gas is conveyed to the chamber.

3. The method according to claim 1 wherein the housing of the chamber is maintained above said temperature by flowing a heat transfer fluid through a chamber temperature control circuit for controlling the temperature of the housing of the chamber, and controlling the temperature of the fluid.

4. The method according to claim 3 wherein the chamber temperature control circuit is located in part within a wall of the housing of the chamber.

5. The method according to claim 3 wherein the chamber temperature control circuit extends about the gas outlet.

6. The method according to claim 3 wherein the temperature of the fluid is controlled by flowing the fluid through heat exchange means, and controlling the heat exchange means to control the temperature of the fluid.

7. The method according to claim 6 wherein the heat transfer fluid is conveyed through at least one of a first heat exchanger to selectively cool the fluid to a first fluid temperature, and a second heat exchanger to selectively heat the fluid to a second fluid temperature greater than the first fluid temperature.

8. The method according to claim 7 wherein the first fluid temperature is lower than 120°

C., and the second temperature is at least 120°

C.

9. The method according to claim 3 wherein the heat transfer fluid comprises a diathermic fluid.

10. The method according to claim 3 wherein the housing of the chamber is heated to said temperature by the heat transfer fluid prior to supply of the gas to the chamber.

11. The method according to claim 1 wherein the plasma abatement device comprises a microwave plasma abatement device.

12. The method according to claim 1 wherein the halocompound comprises a hydrogen halide, Br₂ and Cl₂.