×

Resin for composite structures

  • US 8,519,050 B2
  • Filed: 11/08/2010
  • Issued: 08/27/2013
  • Est. Priority Date: 11/23/2005
  • Status: Expired due to Fees
First Claim
Patent Images

1. A resin precursor composition comprising:

  • an isocyanate component;

    a first polyol having a molecular weight of between about 600 and 800 and an OH index of between about 200 and 300 mgOH/g;

    a second polyol having a molecular weight of between about 100 and 300 and an OH index of between about 935 and 1,200 mgOH/g;

    wherein the first polyol and the second polyol form a blend that has an OH index of between about 350 and 700 mgOH/g; and

    wherein the cured resin precursor composition has an elastic modulus of between about 350,000 and 500,000 psi and an elongation-to-failure of between about 6% and 15%.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×