Resin for composite structures

• US 8,519,050 B2
• Filed: 11/08/2010
• Issued: 08/27/2013
• Est. Priority Date: 11/23/2005
• Status: Expired due to Fees

• Current Assignee: Milgard Manufacturing Incorporated (MI Windows & Doors LLC)
• Original Assignee: Milgard Manufacturing Incorporated (MI Windows & Doors LLC)
• Inventors: Kharchenko, Semen, Coffee, Harry D., Huang, Icheng, Brown, Randall J.
• Primary Examiner(s): Ryan, Patrick
• Assistant Examiner(s): GRESO, AARON J
• Application Number:
  US12/941,851
• Publication Number:
  US 20110054108A1
• Time in Patent Office: 1,023 Days
• Field of Search: 524/101, 524/589, 524/599, 252/182.2, 252/182.21, 252/182.22
• US Class Current: 524/589
• CPC Class Codes: B29C 70/523 and impregnating the reinforcement in the die
• CPC Class Codes: B29K 2075/00 Use of PU, i.e. polyureas or polyurethanes or derivatives thereof, as moulding material
• CPC Class Codes: C08G 18/4804 Two or more polyethers of different physical or chemical nature
• CPC Class Codes: C08G 18/7657 containing two or more aromatic rings
• CPC Class Codes: C08K 3/013 Fillers, pigments or reinforcing additives

Abstract

A resin precursor composition includes an isocyanate component, a first polyol having a molecular weight of between approximately 600 and 800 and an OH index of between approximately 200 and 300 mgOH/g, and a second polyol having a molecular weight of between approximately 100 and 300 and an OH index of between approximately 800 and 1,200 mgOH/g.

Claims

1. A resin precursor composition comprising:

an isocyanate component;

a first polyol having a molecular weight of between about 600 and 800 and an OH index of between about 200 and 300 mgOH/g;

a second polyol having a molecular weight of between about 100 and 300 and an OH index of between about 935 and 1,200 mgOH/g;

wherein the first polyol and the second polyol form a blend that has an OH index of between about 350 and 700 mgOH/g; and

wherein the cured resin precursor composition has an elastic modulus of between about 350,000 and 500,000 psi and an elongation-to-failure of between about 6% and 15%.

2. The resin precursor composition of claim 1, further comprising a polymeric additive configured to reduce shrinkage of the resin precursor composition as it cures.

3. The resin precursor composition of claim 2, wherein the polymeric additive is selected from the group consisting of polystyrene, methacrylate resin, polyvinyl acetate, capped PPO, and a styrene-acrylic copolymer.

4. The resin precursor composition of claim 1, wherein the ratio of the isocyanate component to the blend is between approximately 80% and 115% of stoichiometric.

5. The resin precursor composition of claim 1, wherein the isocyanate component comprises a material selected from the group consisting of diphenylmethane diisocyanate, a polymeric isomer of diphenylmethane diisocyanate, and combinations thereof.

6. The resin precursor composition of claim 1, wherein at least one of the first and second polyols is a polyether polyol.

7. The resin precursor composition of claim 1, wherein at least one of the first and second polyols is a polyester polyol.

10. The resin precursor composition of claim 1, further comprising a mold release material and a filler material.

11. The resin precursor composition of claim 10, wherein the mold release material is provided in an amount of between approximately 0.5% and 5% of the total mass of the resin precursor composition and the filler is provided in an amount of between approximately 0.5% and 10% of the total mass of the resin precursor composition.

12. The resin precursor composition of claim 11, wherein the filler component is present in an amount that is substantially equal to the mass percentage of the mold release material.

19. The resin precursor composition of claim 1, wherein the first polyol and the second polyol both have a hydroxy group functionality of three.

26. The resin precursor composition of claim 1, wherein the second polyol has a molecular weight of between approximately 150 and 190.

27. The resin precursor composition of claim 1, wherein the second polyol has a molecular weight of between approximately 100 and 300 and has an OH index of between approximately 935 and 1050 mgOH/g.

8. A resin precursor composition comprising:

an isocyanate component;

a first polyol having a molecular weight of between about 600 and 800 and an OH index of between about 200 and 300 mgOH/g;

a second polyol having a molecular weight of between about 100 and 300 and an OH index of between about 935 and 1,200 mgOH/g;

and a third polyol having a molecular weight of between about 200 and 300 and an OH index of between about 500 and 700 mgOH/g; and

wherein the first polyol, the second polyol, and the third polyol form a blend having an OH index between about 350 and 750 mgOH/g; and

wherein the cured resin precursor composition has an elastic modulus of between between about 350,000 and 500,000 psi and an elongation-to-failure of between about 6% and 15%.

9. The resin precursor composition of claim 8, wherein the first, second, and third polyols form a blend that comprises between approximately 20% and 50% of the first polyol, between approximately 20% and 50% of the second polyol, and between approximately 20% and 40% of a third polyol.

20. The resin precursor composition of claim 8, wherein the second polyol has a molecular weight of between approximately 100 and 300 and has an OH index of between approximately 935 and 1050 mgOH/g.

21. The resin precursor composition of claim 8, wherein the second polyol has a molecular weight of between approximately 150 and 190.

22. The resin precursor composition of claim 8, wherein the first polyol, the second polyol and the third polyol each has a hydroxy group functionality of three.

23. The resin precursor composition of claim 8, wherein each of the first polyol, the second polyol and the third polyol is a polyether polyol.

24. The resin precursor composition of claim 8, wherein the second polyol has a molecular weight of between approximately 150 and 190 and an OH index of between approximately 935 and 1050 mgOH/g, and further wherein each of the first polyol, the second polyol and the third polyol is a polyether polyol.

25. The resin precursor composition of claim 24, wherein the first polyol, the second polyol and the third polyol each has a hydroxy group functionality of three.

13. A method for producing a resin precursor composition comprising:

mixing at least˜

three polyether polyols with a mold release material and a filler material to form a first resin precursor component; and

mixing a second component with the first component to form a resin precursor composition, the second component comprising an isocyanate material;

wherein a first of the three polyether polyols has a molecular weight of between about 600 and 800 and an OH index of between about 200 and 300 mgOH/g and a second of the three polyether polyols has a molecular weight of between about 100 and 300 and an OH index of between about 935 and 1,200 mgOH/g and the third of the three polyether polyols has a molecular weight of between about 200 and 300 and an OH index of between about 500 and 700 mgOH/g;

wherein the first polyol, the second polyol, and the third polyol form a blend having an OH index between about 350 and 750 mgOH/g; and

wherein the cured resin precursor composition has an elastic modulus of between about 350,000 and 500,000 psi and an elongation-to-failure of between about 6% and 15%.

14. The method of claim 13, wherein the step of mixing the second component with the first component is performed less than approximately five minutes before the resin precursor composition is to be provided to an impregnation die of a pultrusion process.

15. The method of claim 13, wherein the step of mixing the second component with the first component is performed at a rate that matches the rate of consumption of the resin precursor composition in a pultrusion process.

16. The method of claim 13, further comprising providing the resin precursor composition into an impregnation die of a pultrusion process.

17. The method of claim 16, wherein the mold release material comprises an acid that is attracted to walls of the impregnation die.

18. The method of claim 16, wherein a portion of the mold release material reacts with the filler material to form a metal soap.