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Light emitting diode components integrated with thermoelectric devices

  • US 8,519,409 B2
  • Filed: 11/15/2010
  • Issued: 08/27/2013
  • Est. Priority Date: 11/15/2010
  • Status: Active Grant
First Claim
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1. A light emitting diode (LED) component comprising:

  • an LED emitter substrate having an upward facing surface and a downward facing surface, the LED emitter substrate including a cavity in the downward facing surface of the LED emitter substrate and a plurality of thermal vias extending from a bottom of the cavity to an area close to the upward facing surface of the LED emitter substrate;

    a plurality of thermoelectric elements disposed in the cavity, wherein each of the plurality of thermoelectric elements is connected to a corresponding one of the plurality of thermal vias;

    a thermoelectric substrate disposed in the cavity, wherein the thermoelectric substrate is disposed with a plurality of electrical vias and bonding pads to electrically connect the plurality of thermoelectric elements; and

    an LED die disposed on the upward facing surface of the LED emitter substrate, wherein the LED die includes a plurality of doped layers.

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