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X-Y address type solid state image pickup device and method of producing the same

  • US 8,519,460 B2
  • Filed: 02/14/2012
  • Issued: 08/27/2013
  • Est. Priority Date: 07/11/2001
  • Status: Expired due to Term
First Claim
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1. A solid state image pickup device comprising:

  • a first region of a first conductivity-type in physical contact with a second region of a second conductivity-type, said first region being at a first surface of a semiconductor layer;

    a photo-diode region of the second conductivity-type in physical contact with said second region, a conductivity of the second conductivity-type being higher in said second region than in said photo-diode region;

    a back side region of the first conductivity-type in physical contact with said photo-diode region, said back side region being at a second surface of the semiconductor layer,wherein said photo-diode region is between a first well region of the first conductivity-type and a second well region of the first conductivity-type,wherein said first well region and said second well region are in physical contact with said back side region.

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