Antenna sheet, transponder, and booklet

• US 8,519,905 B2
• Filed: 09/12/2008
• Issued: 08/27/2013
• Est. Priority Date: 09/14/2007
• Status: Active Grant

• Current Assignee: Toppan Printing Co., Ltd. (TOPPAN Holdings, Inc.)
• Original Assignee: Toppan Printing Co., Ltd. (TOPPAN Holdings, Inc.)
• Inventors: Tanaka, Junsuke, Yamamoto, Akihisa, Maehira, Makoto, Mizuguchi, Yoshiyuki
• Primary Examiner(s): Owens, Douglas W
• Assistant Examiner(s): Dawkins, Collin
• Application Number:
  US12/733,666
• Publication Number:
  US 20100277382A1
• Time in Patent Office: 1,810 Days
• Field of Search: 343/866, 343/867, 343/868, 343/872, 343/873, 343/741, 343/700.MS, 343/795, 340/572.7
• US Class Current: 343/866
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01057 Lanthanum [La]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 : Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

An antenna sheet is provided with a flexible substrate, and an antenna coil, which is connected to a terminal section of an external IC module having an IC chip and is arranged on the substrate. On the substrate, a storing section that stores at least a part of the IC module is formed.

Claims

1. An antenna sheet comprising:

a flexible substrate;

an antenna coil that is connected to a terminal section of an external IC module including an IC chip, said antenna coil being arranged on said substrate;

a storing section that stores at least a part of said IC module being formed on said substrate; and

a cover layer that covers said antenna coil,

said cover layer comprising

an EMAA (ethylene methyl acrylic acid copolymer)-based thermoplastic adhesive whose thickness is greater than or equal to 12 μ

m,

an EMAA based thermoplastic adhesive to which an epoxy-based cross-linking agent is added, a mixture ratio of the epoxy-based cross-linking agent being greater than or equal to 1%, or

an acrylic-based thermoplastic adhesive whose thickness is greater than or equal to 4 μ

m.

2. The antenna sheet according to claim 1, wherein said antenna coil is formed in a film shape, and the width of a connection section of said antenna coil to be connected to said terminal section is larger than the width of said antenna coil;

and

a pair of said connection sections are arranged opposing each other at portions pinching said storing section in said substrate.

3. The antenna sheet according to claim 1, including a water-resistant layer formed such as to cover said antenna coil.

4. The antenna sheet according to claim 2, wherein the widths of said connection sections are smaller or similar to the width of said terminal section.

5. The antenna sheet according to claim 2, wherein said terminal section and said connection sections are connected such that they overlap in a direction linking said opposing connection sections, and the length of said connection sections is larger than the length of a region where said terminal section and said connection section overlap.

6. The antenna sheet according to claim 2, wherein slit holes are provided in said substrate and in said connection sections.

7. The antenna sheet according to claim 1, wherein a through hole that penetrates said substrate is formed in a region of said substrate where said antenna coil is not formed.

8. The antenna sheet according to claim 2, wherein said connection sections of said antenna sheet are welded to said terminal section of said IC module at a plurality of points.

9. A transponder comprising:

an antenna sheet including a flexible substrate, an antenna coil that is connected to a terminal section of an external IC module including an IC chip, said antenna coil being arranged on said substrate, a storing section that stores at least a part of said IC module being formed on said substrate, and a cover layer that covers said antenna coil; and

an IC module including an IC chip and a terminal section,

said IC module being fixed to said antenna sheet,

said antenna sheet being connected to said terminal section of said IC module, and

said cover layer comprising

an EMAA (ethylene methyl acrylic acid copolymer)-based thermoplastic adhesive whose thickness is greater than or equal to 12 μ

m,

an EMAA based thermoplastic adhesive to which an epoxy-based cross-linking agent is added, a mixture ratio of the epoxy-based cross-linking agent being greater than or equal to 1%, or

an acrylic-based thermoplastic adhesive whose thickness is greater than or equal to 4 μ

m.

10. The transponder according to claim 9, including a pair of base materials that pinch said antenna sheet and said IC module.

11. The transponder according to claim 10, wherein a base material opening for storing at least a part of said IC module is provided in at least one of said pair of base materials.

12. The transponder according to claim 10, wherein a through hole is formed in said antenna sheet, and said pair of base materials are joined via said through hole.

13. The transponder according to claim 10, including a cover material joined to a face of at least one of said pair of base materials.

14. The transponder according to claim 10, wherein said pair of base materials are porous or have a fibrous structure.

15. A booklet comprising:

an antenna sheet including a flexible substrate, an antenna coil that is connected to a terminal section of an external IC module including an IC chip , said antenna coil being arranged on said substrate, a storing section that stores at least a part of said IC module being formed on said substrate, and a cover layer that covers said antenna coil;

an IC module including an IC chip and a terminal section; and

a pair of base materials that pinch said antenna sheet and said IC module,

said IC module being fixed to said antenna sheet,

said antenna sheet being connected to said terminal section of said IC module, and

said cover layer comprising

an EMAA (ethylene methyl acrylic acid copolymer)-based thermoplastic adhesive whose thickness is greater than or equal to 12 μ

m,

an EMAA based thermoplastic adhesive to which an epoxy-based cross-linking agent is added, a mixture ratio of the epoxy-based cross-linking agent being greater than or equal to 1%, or

an acrylic-based thermoplastic adhesive whose thickness is greater than or equal to 4 μ

m.