Optical integrator for an illumination system of a microlithographic projection exposure apparatus

• US 8,520,307 B2
• Filed: 12/20/2010
• Issued: 08/27/2013
• Est. Priority Date: 02/17/2006
• Status: Expired due to Fees

• Current Assignee: CARL Zeiss SMT GmbH (Carl-Zeiss-Stiftung)
• Original Assignee: CARL Zeiss SMT GmbH (Carl-Zeiss-Stiftung)
• Inventors: Wolf, Oliver, Siekmann, Heiko, Kalchbrenner, Eva, Rennon, Siegfried, Wangler, Johannes, Bresan, Andre, Gerhard, Michael, Haverkamp, Nils, Scholz, Axel, Scharnweber, Ralf, Layh, Michael, Burkart, Stefan
• Primary Examiner(s): Jones, James
• Application Number:
  US12/973,234
• Publication Number:
  US 20110083542A1
• Time in Patent Office: 981 Days
• Field of Search: 359/621
• US Class Current: 359/621
• CPC Class Codes: G03F 7/70075 Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
• CPC Class Codes: G03F 7/70958 Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
• CPC Class Codes: Y10T 83/0304 Grooving
• CPC Class Codes: Y10T 83/04 Processes

Abstract

The disclosure relates to an optical integrator configured to produce a plurality of secondary light sources in an illumination system of a microlithographic projection exposure apparatus. The disclosure also relates to a method of manufacturing an array of elongated microlenses for use in such an illumination system. Arrays of elongated microlenses are often contained in optical integrators or scattering plates of such illumination systems.

Claims

1. A method of manufacturing an array of elongated microlenses configured to be used in an illumination system of a microlithographic projection exposure apparatus, the method comprising:

a) repeatedly moving a cutting tool comprising a cutting edge relative to a substrate in a fly-cut process so that the cutting edge cuts into the substrate; and

b) moving the substrate during step a) along a longitudinal direction;

c) moving the substrate at least substantially perpendicular to the longitudinal direction; and

d) repeating a) and b) to provide the array of elongated microlenses,

wherein the method comprises rotating the cutting tool around a rotational axis, the cutting edge points away from the rotational axis, and the elongated microlenses have longitudinal axes which are parallel to the longitudinal direction.

2. The method of claim 1, comprising moving the substrate parallel to a machining plane.

3. The method of claim 1, comprising moving the substrate along straight parallel lines during b).

4. The method of claim 1, comprising moving the substrate along straight zig zag lines or serpentines during b).

5. The method of claim 1, wherein the rotational axis extends at least substantially parallel to a substrate surface on which the elongated microlenses are formed.

6. The method of claim 1, wherein the cutting edge is spaced apart from the rotational axis by at least 5 mm.

7. The method of claim 1, wherein the cutting edge is spaced apart from the rotational axis by more than 9 mm and less than 11 mm.

8. The method of claim 1, comprising rotating the cutting tool with a rotational frequency in excess of 5000 1/min.

9. The method of claim 1, comprising rotating the cutting tool with a rotational frequency between 8000 1/min and 10000 1/min.

10. The method of claim 1, wherein the cutting edge is concavely or convexly curved.

11. The method of claim 1, comprising, during c), moving the substrate substantially by a multiple of a pitch of the elongated microlenses.

12. The method of claim 1, comprising reworking a portion of the surface of an elongated microlens to change a surface profile of the elongated microlens.

13. The method of claim 12, wherein reworking the portion of the surface of the elongated microlens comprises repeating a) and b) with an additional cutting tool having a different cutting edge.

14. The method of claim 12, wherein reworking the portion of the surface of the elongated microlens comprises repeating a) and a) with the cutting tool turned around by 180°

.

15. The method of claim 1, comprising polishing a portion of an elongated microlens.

16. The method of claim 1, comprising exposing a portion of an elongated microlens to an ion beam.

17. The method of claim 16, wherein all ions in the ion beam move at least substantially parallel to an ion beam direction.

18. The method of claim 16, comprising applying a cover layer on the portion of the elongated microlens prior to exposure to the ion beam.

19. The method of claim 16, wherein the ion beam has a cross section with a maximum dimension which is greater than a pitch of the elongated microlens.

20. The method of claim 16, wherein the ion beam has a cross section with a maximum dimension which is greater than 5 times a pitch of the elongated microlens.

21. The method of claim 16, wherein an orientation between the portion of the elongated microlens and the ion beam is changed to adjust for a change of a surface profile of the elongated microlens.

22. The method of claim 16, wherein the elongated microlenses extends parallel to a second direction, and the ion beam has a direction which is in a plane of incidence parallel to the second direction and perpendicular to a plane in which the elongated microlenses extend.

23. The method of claim 16, wherein the elongated microlenses extend parallel to a second direction, and the ion beam has a direction which is in a plane of incidence that is perpendicular to the second direction.

24. The method of claim 23, comprising exposing the elongated microlenses to another ion beam which has a direction in the plane of incidence but symmetrical to a surface normal of the substrate.

25. The method of claim 16, wherein only those portions of the elongated microlenses arranged in different areas of the array are reworked.

26. The method of claim 1, wherein the substrate:

is a CaF₂ crystal having a surface that is machined by the cutting tool, the surface of the CaF₂ crystal being at least substantially parallel to a {111} crystal plane, and

is oriented with respect to the moving cutting tool so that the cutting edge cuts into the substrate along an actual cutting direction which forms a deviation angle of less than 20°

to an ideal cutting direction, the ideal cutting direction being perpendicular to one of the three {100} crystal planes, and the ideal cutting direction pointing toward a corner of a triangle formed by the intersection of the {111} crystal plane with the three {100} crystal planes.

27. The method of claim 26, wherein two arrays of parallel elongated microlenses are manufactured subsequently on opposite sides of the substrate, and the surface of the CaF₂ crystal is at least substantially parallel to a {111} crystal plane during the manufacture of both arrays.

28. The method of claim 27, wherein the deviation angle is between 13°

and 17°

for both arrays.

29. The method of claim 27, wherein the deviation angle equals substantially 15°

for both arrays.

30. A method of reworking an array of elongated microlenses having a maximum pitch, the array of elongated microlenses being configured for use in an illumination system of a microlithographic projection exposure apparatus, the method comprising:

exposing a portion of an elongated microlens to an ion beam having a cross section with a maximum dimension greater than a maximum pitch of the portion of the elongated microlens,

wherein an orientation between the portion of the elongated microlens and the ion beam is changed to adjust for a modification of a surface profile of the elongated microlens by the ion beam.

31. A method of manufacturing an array of elongated microlenses configured to be used in an illumination system of a microlithographic projection exposure apparatus, the method comprising:

a) repeatedly moving a cutting tool comprising a cutting edge relative to a substrate in a fly-cut process so that the cutting edge cuts into the substrate; and

b) moving the substrate during step a) along a longitudinal direction;

c) moving the substrate at least substantially perpendicular to the longitudinal direction; and

d) repeating a) and b) to provide the array of elongated microlenses,

wherein the method comprises rotating the cutting tool with a rotational frequency in excess of 5000 1/min, and the elongated microlenses have longitudinal axes which are parallel to the longitudinal direction.

32. The method of claim 31, wherein the method comprises rotating the cutting tool with a rotational frequency between 8000 1/min and 10000 1/min.

33. A method of manufacturing an array of elongated microlenses configured to be used in an illumination system of a microlithographic projection exposure apparatus, the method comprising:

a) repeatedly moving a cutting tool comprising a cutting edge relative to a substrate in a fly-cut process so that the cutting edge cuts into the substrate; and

b) moving the substrate during step a) along a longitudinal direction;

c) moving the substrate at least substantially perpendicular to the longitudinal direction; and

d) repeating a) and b) to provide the array of elongated microlenses,

wherein the method comprises reworking a portion of the surface of an elongated microlens to change a surface profile of the elongated microlens, and the elongated microlenses have longitudinal axes which are parallel to the longitudinal direction.

34. The method of claim 33, wherein reworking the portion of the surface of the elongated microlens comprises repeating a) and b) with an additional cutting tool having a different cutting edge.

35. The method of claim 33, wherein reworking the portion of the surface of the elongated microlens comprises repeating a) and a) with the cutting tool turned around by 180°

.

36. A method of manufacturing an array of elongated microlenses configured to be used in an illumination system of a microlithographic projection exposure apparatus, the method comprising:

a) repeatedly moving a cutting tool comprising a cutting edge relative to a substrate in a fly-cut process so that the cutting edge cuts into the substrate; and

b) moving the substrate during step a) along a longitudinal direction;

c) moving the substrate at least substantially perpendicular to the longitudinal direction; and

d) repeating a) and b) to provide the array of elongated microlenses,

wherein the method comprises exposing a portion of an elongated microlens to an ion beam, and the elongated microlenses have longitudinal axes which are parallel to the longitudinal direction.

37. The method of claim 36, wherein all ions in the ion beam move at least substantially parallel to an ion beam direction.

38. The method of claim 36, comprising applying a cover layer on the portion of the elongated microlens prior to exposure to the ion beam.

39. The method of claim 36, wherein the ion beam has a cross section with a maximum dimension which is greater than a pitch of the elongated microlens.

40. The method of claim 36, wherein the ion beam has a cross section with a maximum dimension which is greater than 5 times a pitch of the elongated microlens.

41. The method of claim 36, wherein an orientation between the portion of the elongated microlens and the ion beam is changed to adjust for a change of a surface profile of the elongated microlens.

42. The method of claim 36, wherein the elongated microlenses extends parallel to a second direction, and the ion beam has a direction which is in a plane of incidence parallel to the second direction and perpendicular to a plane in which the elongated microlenses extend.

43. The method of claim 36, wherein the elongated microlenses extend parallel to a second direction, and the ion beam has a direction which is in a plane of incidence that is perpendicular to the second direction.

44. The method of claim 36, wherein only those portions of the elongated microlenses arranged in different areas of the array are reworked.

45. A method of manufacturing an array of elongated microlenses configured to be used in an illumination system of a microlithographic projection exposure apparatus, the method comprising:

a) repeatedly moving a cutting tool comprising a cutting edge relative to a substrate in a fly-cut process so that the cutting edge cuts into the substrate; and

b) moving the substrate during step a) along a longitudinal direction;

c) moving the substrate at least substantially perpendicular to the longitudinal direction; and

d) repeating a) and b) to provide the array of elongated microlenses,

wherein;

the substrate is a CaF₂ crystal having a surface that is machined by the cutting tool, the surface of the CaF₂ crystal being at least substantially parallel to a {111} crystal plane, and

the substrate is oriented with respect to the moving cutting tool so that the cutting edge cuts into the substrate along an actual cutting direction which forms a deviation angle of less than 20°

to an ideal cutting direction, the ideal cutting direction being perpendicular to one of the three {100} crystal planes, and the ideal cutting direction pointing toward a corner of a triangle formed by the intersection of the {111 } crystal plane with the three {100} crystal planes

the elongated microlenses have longitudinal axes which are parallel to the longitudinal direction.

46. The method of claim 45, wherein two arrays of parallel elongated microlenses are manufactured subsequently on opposite sides of the substrate, and the surface of the CaF₂ crystal is at least substantially parallel to a {111} crystal plane during the manufacture of both arrays.

47. The method of claim 46, wherein the deviation angle is between 13°

and 17°

for both arrays.

48. The method of claim 46, wherein the deviation angle equals substantially 15°

for both arrays.