Power converter module with a cooled busbar arrangement
First Claim
1. A power converter module comprising:
- a first liquid-cooled heat sink;
a busbar arrangement having at least two busbars which are electrically insulated from one another;
at least one power semiconductor module which is mechanically connected to the first liquid-cooled heat sink for thermal conduction and electrically connected by the busbar arrangement to connections of the power converter module;
a second liquid-cooled heat sink positively or non-positively connected to the busbar arrangement; and
a thermally conductive and electrically insulating layer disposed between an upper busbar of the busbar arrangement and the second liquid-cooled heat sink.
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Accused Products
Abstract
A power converter module has a first liquid-cooled heat sink, a busbar arrangement having at least two busbars which are electrically insulated from one another and at least one power semiconductor module which is mechanically connected to the first liquid-cooled heat sink for thermal conduction and electrically connected to connections of the power converter module by the busbar arrangement. A second liquid-cooled heat sink is positively or non-positively connected to the busbar arrangement. A thermally conductive and electrically insulating layer is disposed between an upper busbar of the busbar arrangement and the second liquid-cooled heat sink. Additional power loss arising in the busbar is dissipated by the second liquid-cooled heat sink, which is pressed with a clamping elements on a surface of the upper busbar.
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Citations
10 Claims
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1. A power converter module comprising:
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a first liquid-cooled heat sink; a busbar arrangement having at least two busbars which are electrically insulated from one another; at least one power semiconductor module which is mechanically connected to the first liquid-cooled heat sink for thermal conduction and electrically connected by the busbar arrangement to connections of the power converter module; a second liquid-cooled heat sink positively or non-positively connected to the busbar arrangement; and a thermally conductive and electrically insulating layer disposed between an upper busbar of the busbar arrangement and the second liquid-cooled heat sink. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification