Power converter module with a cooled busbar arrangement

• US 8,520,386 B2
• Filed: 09/28/2009
• Issued: 08/27/2013
• Est. Priority Date: 12/10/2008
• Status: Active Grant

• Current Assignee: Innomotics GmbH (Siemens AG)
• Original Assignee: Siemens AG
• Inventors: Kolk, Wilfried, Bott, Stefan
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US13/133,818
• Publication Number:
  US 20110242760A1
• Time in Patent Office: 1,429 Days
• Field of Search: None
• US Class Current: 361/699
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

A power converter module has a first liquid-cooled heat sink, a busbar arrangement having at least two busbars which are electrically insulated from one another and at least one power semiconductor module which is mechanically connected to the first liquid-cooled heat sink for thermal conduction and electrically connected to connections of the power converter module by the busbar arrangement. A second liquid-cooled heat sink is positively or non-positively connected to the busbar arrangement. A thermally conductive and electrically insulating layer is disposed between an upper busbar of the busbar arrangement and the second liquid-cooled heat sink. Additional power loss arising in the busbar is dissipated by the second liquid-cooled heat sink, which is pressed with a clamping elements on a surface of the upper busbar.

Claims

1. A power converter module comprising:

a first liquid-cooled heat sink;

a busbar arrangement having at least two busbars which are electrically insulated from one another;

at least one power semiconductor module which is mechanically connected to the first liquid-cooled heat sink for thermal conduction and electrically connected by the busbar arrangement to connections of the power converter module;

a second liquid-cooled heat sink positively or non-positively connected to the busbar arrangement; and

a thermally conductive and electrically insulating layer disposed between an upper busbar of the busbar arrangement and the second liquid-cooled heat sink.

2. The power converter module of claim 1, further comprising at least one clamping element for positively or non-positively connecting the second liquid-cooled heat sink to the busbar arrangement.

3. The power converter module of claim 1, wherein the second liquid-cooled heat sink is fluidly connected to the first liquid-cooled heat sink.

4. The power converter module of claim 1, wherein the second liquid-cooled heat sink covers at least approximately a major portion of a surface area of the busbar arrangement.

5. The power converter module of claim 2, wherein the clamping element comprises a leaf spring with two clamping screws.

6. The power converter module of claim 2, wherein the clamping element comprises a positive-locking bracket with two clamping screws.

7. The power converter module of claim 6, wherein the positive-locking bracket comprises an elastic part disposed in a region of the second liquid-cooled heat sink.

8. The power converter module of claim 1, wherein the insulating layer comprises a thermally conductive interlace materials.

9. The power converter module of claim 1, wherein the insulating layer comprises thermally conductive and electrically insulating interface materials.

10. The power converter module of claim 1, wherein the busbars and the insulating layer are laminated with one another.